RFI and EMI - Contacts, Fingerstock and Gaskets

Image Part Number Description / PDF Quantity Rfq
4184AC51K00400

4184AC51K00400

Laird - Performance Materials

GK NICU NRS PU V0 DSH

0

0078001502

0078001502

Laird - Performance Materials

SLMT,1F,BF,USFT

0

0078002117

0078002117

Laird - Performance Materials

SLMT,STR,SNB,USFT

0

4184AB51K01200

4184AB51K01200

Laird - Performance Materials

GK NICU NRS PU V0 DSH

0

4391AD50101200

4391AD50101200

Laird - Performance Materials

GK NICU PTAF PU NR REC

0

8912014046

8912014046

Laird - Performance Materials

EGW,SS .125X.490X.750

0

4215AB51K01800

4215AB51K01800

Laird - Performance Materials

GK NICU NRS PU V0 REC

0

0097094121

0097094121

Laird - Performance Materials

FLX,STR,SU

0

0097073217

0097073217

Laird - Performance Materials

GB,4F,SNB

0

0097063715

0097063715

Laird - Performance Materials

NOSG,STR,ZNC,CLO

0

0097095517

0097095517

Laird - Performance Materials

S3,STR,SNB,RIV

0

4048AC51K01606

4048AC51K01606

Laird - Performance Materials

GASKET FABRIC/FOAM 6MM SQ

0

0C98054202

0C98054202

Laird - Performance Materials

NOSG COIL BF USF PSA

0

SNL60RXP-55CC-NA

SNL60RXP-55CC-NA

Laird - Performance Materials

FORM IN PLACE GASKET 55CC TUBE

0

4J54EA51N00650

4J54EA51N00650

Laird - Performance Materials

IO NICU MESHG PU V0 REC

0

4692AB51K09600

4692AB51K09600

Laird - Performance Materials

GK NICU NRS PU V0 DSH

0

0098055902

0098055902

Laird - Performance Materials

TWT,STR,BF,USF,PSA

0

4084AB51H01800

4084AB51H01800

Laird - Performance Materials

GK NICU PTAFG PU V0 SQ

0

0097039002

0097039002

Laird - Performance Materials

CSTR,STR,BF

0

4L39AB51G01800

4L39AB51G01800

Laird - Performance Materials

GK NICU NRSG PU V0 BELL

0

RFI and EMI - Contacts, Fingerstock and Gaskets

1. Overview

RF/IF (Radio Frequency/Intermediate Frequency) and RFID (Radio Frequency Identification) systems require effective electromagnetic interference (EMI) and radio frequency interference (RFI) shielding to maintain signal integrity. Contacts, fingerstock, and gaskets are critical components for ensuring electrical continuity and shielding performance in electronic enclosures. These components prevent electromagnetic leakage while maintaining mechanical functionality in connectors, housings, and assemblies.

2. Main Types and Functional Classification

TypeFunctional FeaturesApplication Examples
ContactsConductive elements for maintaining electrical connections under compressionRF connectors, PCB grounding pads
FingerstockResilient metal strips with finger-like projections for continuous shieldingServer chassis, military equipment
GasketsConductive elastomers or mesh materials for sealing gapsAutomotive sensors, medical devices

3. Structure and Composition

Typical structures include:

  • Contacts: Beryllium copper or phosphor bronze cores with conductive platings (gold, silver, nickel)
  • Fingerstock: Canted coil springs or stamped metal fingers with corrosion-resistant coatings
  • Gaskets: Silicone rubber with embedded silver-aluminum particles or wire mesh

4. Key Technical Parameters

ParameterTypical RangeSignificance
Contact Resistance0.1-10 m Affects signal transmission efficiency
Shielding Effectiveness60-120 dB (100 MHz-10 GHz)Determines EMI/RFI attenuation
Compression Force0.5-5 N/mmImpacts mechanical durability
Temperature Range-55 C to +150 CDefines operational stability

5. Application Fields

Main industries include:

  • Telecommunications (5G base stations, microwave links)
  • Automotive (V2X communication systems, radar sensors)
  • Aerospace (avionics shielding compartments)
  • Medical (MRI shielding enclosures)

6. Leading Manufacturers and Products

ManufacturerRepresentative Products
Parker ChomericsCHO-SEAL conductive gaskets
Laird Performance MaterialsForm-in-Place EMI gaskets
3MEMI Shielding Tapes 9703/9706
SamtecRFI/EMI shielded connectors

7. Selection Recommendations

Considerations include:

  • Frequency range of the application (higher frequencies require tighter tolerances)
  • Environmental conditions (temperature, humidity, chemical exposure)
  • Material compatibility (avoid galvanic corrosion between mating surfaces)
  • Cost-effectiveness (balance performance vs. budget constraints)

Case Study: In automotive radar systems, Parker Chomerics' silicone-based gaskets reduced EMI leakage by 40% compared to traditional metal fingerstock.

8. Industry Trends

Key development directions:

  • Miniaturization for 5G mmWave applications
  • Low-PIM (Passive Intermodulation) material formulations
  • Multi-functional integration with thermal management
  • RoHS-compliant plating processes (eliminating hexavalent chromium)
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