RFI and EMI - Contacts, Fingerstock and Gaskets

Image	Part Number	Description / PDF	Quantity	Rfq
	4697ABH1K09600 Laird - Performance Materials	GK NICU NRS PU V0 CSH	0
	0098095808 Laird - Performance Materials	S3,STR,SNSAT,USFT,RIV	0
	4131ACH1K09600 Laird - Performance Materials	GK NICU NRS PU V0 BELL	0
	8866-0155-72 Laird - Performance Materials	DSTRHOL,CUSTMATL 15.88X10.16X15.	0
	0097065608 Laird - Performance Materials	PCLIP,STR,SNS,CLO	0
	4692PA51H01200 Laird - Performance Materials	GK NICU PTAFG PU V0 DSH	0
	4223AB51K02316 Laird - Performance Materials	GK NICU NRS PU V0 REC	0
	0077001015 Laird - Performance Materials	SLMT,STR,ZNC	0
	0095082300 Laird - Performance Materials	DCON,9P,SS	0
	0097053817 Laird - Performance Materials	AP,STR,SNB,PSA	0
	4053PA51H09600 Laird - Performance Materials	GK NICU PTAFG PU V0 DSH	0
	4742AB51K09600 Laird - Performance Materials	GK,NICU,NRS,PU,V0,DSH	0
	0097095717 Laird - Performance Materials	S3,STR,SNB,PSA	0
	0097060509 Laird - Performance Materials	CLO,STR,TLN,NID	0
	4906PA51G01800 Laird - Performance Materials	GK,NICU,NRSG,PU,V0,DSH	0
	8104010340 Laird - Performance Materials	UFDF BECU BF RL	0
	8864-0060-72 Laird - Performance Materials	OSTRHOL,CUSTMATL 2.16X1.02MM	0
	0098055547 Laird - Performance Materials	TWT,STR,SNB,USFT	0
	8560-0598-93 Laird - Performance Materials	DIECUT ECE093	0
	0078001902 Laird - Performance Materials	SLMT,4F,BF,USF	0

RFI and EMI - Contacts, Fingerstock and Gaskets

1. Overview

RF/IF (Radio Frequency/Intermediate Frequency) and RFID (Radio Frequency Identification) systems require effective electromagnetic interference (EMI) and radio frequency interference (RFI) shielding to maintain signal integrity. Contacts, fingerstock, and gaskets are critical components for ensuring electrical continuity and shielding performance in electronic enclosures. These components prevent electromagnetic leakage while maintaining mechanical functionality in connectors, housings, and assemblies.

2. Main Types and Functional Classification

Type	Functional Features	Application Examples
Contacts	Conductive elements for maintaining electrical connections under compression	RF connectors, PCB grounding pads
Fingerstock	Resilient metal strips with finger-like projections for continuous shielding	Server chassis, military equipment
Gaskets	Conductive elastomers or mesh materials for sealing gaps	Automotive sensors, medical devices

3. Structure and Composition

Typical structures include:

Contacts: Beryllium copper or phosphor bronze cores with conductive platings (gold, silver, nickel)
Fingerstock: Canted coil springs or stamped metal fingers with corrosion-resistant coatings
Gaskets: Silicone rubber with embedded silver-aluminum particles or wire mesh

4. Key Technical Parameters

Parameter	Typical Range	Significance
Contact Resistance	0.1-10 m	Affects signal transmission efficiency
Shielding Effectiveness	60-120 dB (100 MHz-10 GHz)	Determines EMI/RFI attenuation
Compression Force	0.5-5 N/mm	Impacts mechanical durability
Temperature Range	-55 C to +150 C	Defines operational stability

5. Application Fields

Main industries include:

Telecommunications (5G base stations, microwave links)
Automotive (V2X communication systems, radar sensors)
Aerospace (avionics shielding compartments)
Medical (MRI shielding enclosures)

6. Leading Manufacturers and Products

Manufacturer	Representative Products
Parker Chomerics	CHO-SEAL conductive gaskets
Laird Performance Materials	Form-in-Place EMI gaskets
3M	EMI Shielding Tapes 9703/9706
Samtec	RFI/EMI shielded connectors

7. Selection Recommendations

Considerations include:

Frequency range of the application (higher frequencies require tighter tolerances)
Environmental conditions (temperature, humidity, chemical exposure)
Material compatibility (avoid galvanic corrosion between mating surfaces)
Cost-effectiveness (balance performance vs. budget constraints)

Case Study: In automotive radar systems, Parker Chomerics' silicone-based gaskets reduced EMI leakage by 40% compared to traditional metal fingerstock.

8. Industry Trends

Key development directions:

Miniaturization for 5G mmWave applications
Low-PIM (Passive Intermodulation) material formulations
Multi-functional integration with thermal management
RoHS-compliant plating processes (eliminating hexavalent chromium)