RFI and EMI - Contacts, Fingerstock and Gaskets

Image Part Number Description / PDF Quantity Rfq
S0951-46R

S0951-46R

Harwin

RFI SHIELD CLIP MINI TIN SMD

469883

S1941-46R

S1941-46R

Harwin

RFI SHIELD FINGER TIN SMD

9968

S7151-45R

S7151-45R

Harwin

RFI SHIELD FINGER AU 3MM SMD

37837

S7191-45R

S7191-45R

Harwin

RFI SHIELD FINGER AU 5MM SMD

14362

S1951-46R

S1951-46R

Harwin

RFI SHIELD FINGER TIN SMD

0

S1741-46R

S1741-46R

Harwin

RFI SHIELD FINGER TIN 2.5MM SMD

11514

S1001-46R

S1001-46R

Harwin

RFI SHIELD CLIP MICRO TIN SMD

87477

S0941-46R

S0941-46R

Harwin

RFI SHIELD CLIP MINI TIN SMD

0

S7051-42R

S7051-42R

Harwin

RFI SHIELD FINGER AU 6MM SMD

4190

S0981-46R

S0981-46R

Harwin

RFI SHIELD CLIP R/A TIN SMD

13889

S1411-46R

S1411-46R

Harwin

RFI SHIELD CLIP MAXI TIN SMD

60042

S7101-42R

S7101-42R

Harwin

RFI SHIELD FINGER AU 3.5MM SMD

2190

S1721-46R

S1721-46R

Harwin

RFI SHIELD CLIP MINI TIN SMD

0

S7251-45R

S7251-45R

Harwin

RFI SHIELD FINGER AU 1.5MM SMD

2534

S7271-45R

S7271-45R

Harwin

RFI SHIELD FINGER AU 2MM SMD

5137

S7071-46R

S7071-46R

Harwin

RFI SHIELD FINGER TIN 2.5MM SMD

12283

S7091-42R

S7091-42R

Harwin

RFI SHIELD FINGER AU 2.7MM SMD

14871

S0971-46R

S0971-46R

Harwin

RFI SHIELD CLIP MINI TIN SMD

226809

S1761-42R

S1761-42R

Harwin

RFI SHIELD FINGER GOLD 3.5MM SMD

129178

S0991-46R

S0991-46R

Harwin

RFI SHIELD CLIP MICRO TIN SMD

340565

RFI and EMI - Contacts, Fingerstock and Gaskets

1. Overview

RF/IF (Radio Frequency/Intermediate Frequency) and RFID (Radio Frequency Identification) systems require effective electromagnetic interference (EMI) and radio frequency interference (RFI) shielding to maintain signal integrity. Contacts, fingerstock, and gaskets are critical components for ensuring electrical continuity and shielding performance in electronic enclosures. These components prevent electromagnetic leakage while maintaining mechanical functionality in connectors, housings, and assemblies.

2. Main Types and Functional Classification

TypeFunctional FeaturesApplication Examples
ContactsConductive elements for maintaining electrical connections under compressionRF connectors, PCB grounding pads
FingerstockResilient metal strips with finger-like projections for continuous shieldingServer chassis, military equipment
GasketsConductive elastomers or mesh materials for sealing gapsAutomotive sensors, medical devices

3. Structure and Composition

Typical structures include:

  • Contacts: Beryllium copper or phosphor bronze cores with conductive platings (gold, silver, nickel)
  • Fingerstock: Canted coil springs or stamped metal fingers with corrosion-resistant coatings
  • Gaskets: Silicone rubber with embedded silver-aluminum particles or wire mesh

4. Key Technical Parameters

ParameterTypical RangeSignificance
Contact Resistance0.1-10 m Affects signal transmission efficiency
Shielding Effectiveness60-120 dB (100 MHz-10 GHz)Determines EMI/RFI attenuation
Compression Force0.5-5 N/mmImpacts mechanical durability
Temperature Range-55 C to +150 CDefines operational stability

5. Application Fields

Main industries include:

  • Telecommunications (5G base stations, microwave links)
  • Automotive (V2X communication systems, radar sensors)
  • Aerospace (avionics shielding compartments)
  • Medical (MRI shielding enclosures)

6. Leading Manufacturers and Products

ManufacturerRepresentative Products
Parker ChomericsCHO-SEAL conductive gaskets
Laird Performance MaterialsForm-in-Place EMI gaskets
3MEMI Shielding Tapes 9703/9706
SamtecRFI/EMI shielded connectors

7. Selection Recommendations

Considerations include:

  • Frequency range of the application (higher frequencies require tighter tolerances)
  • Environmental conditions (temperature, humidity, chemical exposure)
  • Material compatibility (avoid galvanic corrosion between mating surfaces)
  • Cost-effectiveness (balance performance vs. budget constraints)

Case Study: In automotive radar systems, Parker Chomerics' silicone-based gaskets reduced EMI leakage by 40% compared to traditional metal fingerstock.

8. Industry Trends

Key development directions:

  • Miniaturization for 5G mmWave applications
  • Low-PIM (Passive Intermodulation) material formulations
  • Multi-functional integration with thermal management
  • RoHS-compliant plating processes (eliminating hexavalent chromium)
RFQ BOM Call Skype Email
Top