RFI and EMI - Contacts, Fingerstock and Gaskets

Image Part Number Description / PDF Quantity Rfq
S1761-46R

S1761-46R

Harwin

EMI SHIELD FINGER T&R(2000/R)

19950

S1791-42R

S1791-42R

Harwin

RFI SHIELD FINGER TIN 4MM SMD

0

S7141-45R

S7141-45R

Harwin

RFI SHIELD FINGER AU 2.5MM SMD

21499

S7261-45R

S7261-45R

Harwin

RFI SHIELD FINGER AU 1.5MM SMD

7420

S7181-45R

S7181-45R

Harwin

RFI SHIELD FINGER AU 4.5MM SMD

3999

S7041-42R

S7041-42R

Harwin

RFI SHIELD FINGER AU 4MM SMD

59688

S0911-46R

S0911-46R

Harwin

RFI SHIELD CLIP COMPACT TIN SMD

131

S7111-42R

S7111-42R

Harwin

RFI SHIELD FINGER AU 4.5MM SMD

10792

S0921-46R

S0921-46R

Harwin

RFI SHIELD CLIP CORNER TIN SMD

1986

S7131-45R

S7131-45R

Harwin

RFI SHIELD FINGER AU 2MM SMD

992

S7221-45R

S7221-45R

Harwin

RFI SHIELD FINGER AU 1.23MM SMD

36046

S7161-45R

S7161-45R

Harwin

RFI SHIELD FINGER AU 3.5MM SMD

2543

S1711-46R

S1711-46R

Harwin

RFI SHIELD CLIP TIN SMD

8524

S7081-42R

S7081-42R

Harwin

RFI SHIELD FINGER AU 2.75MM SMD

4123

S7061-42R

S7061-42R

Harwin

RFI SHIELD FINGER AU 5.5MM SMD

0

S7241-45R

S7241-45R

Harwin

RFI SHIELD FINGER AU 1.3MM SMD

6755

S7171-45R

S7171-45R

Harwin

RFI SHIELD FINGER AU 4MM SMD

3063

S2711-46R

S2711-46R

Harwin

SMT RFI CLIP 1900/TR (T&R)

87132

S0961-46R

S0961-46R

Harwin

RFI SHIELD CLIP MINI TIN SMD

4990

S7121-42R

S7121-42R

Harwin

RFI SHIELD FINGER AU 1.7MM SMD

39701

RFI and EMI - Contacts, Fingerstock and Gaskets

1. Overview

RF/IF (Radio Frequency/Intermediate Frequency) and RFID (Radio Frequency Identification) systems require effective electromagnetic interference (EMI) and radio frequency interference (RFI) shielding to maintain signal integrity. Contacts, fingerstock, and gaskets are critical components for ensuring electrical continuity and shielding performance in electronic enclosures. These components prevent electromagnetic leakage while maintaining mechanical functionality in connectors, housings, and assemblies.

2. Main Types and Functional Classification

TypeFunctional FeaturesApplication Examples
ContactsConductive elements for maintaining electrical connections under compressionRF connectors, PCB grounding pads
FingerstockResilient metal strips with finger-like projections for continuous shieldingServer chassis, military equipment
GasketsConductive elastomers or mesh materials for sealing gapsAutomotive sensors, medical devices

3. Structure and Composition

Typical structures include:

  • Contacts: Beryllium copper or phosphor bronze cores with conductive platings (gold, silver, nickel)
  • Fingerstock: Canted coil springs or stamped metal fingers with corrosion-resistant coatings
  • Gaskets: Silicone rubber with embedded silver-aluminum particles or wire mesh

4. Key Technical Parameters

ParameterTypical RangeSignificance
Contact Resistance0.1-10 m Affects signal transmission efficiency
Shielding Effectiveness60-120 dB (100 MHz-10 GHz)Determines EMI/RFI attenuation
Compression Force0.5-5 N/mmImpacts mechanical durability
Temperature Range-55 C to +150 CDefines operational stability

5. Application Fields

Main industries include:

  • Telecommunications (5G base stations, microwave links)
  • Automotive (V2X communication systems, radar sensors)
  • Aerospace (avionics shielding compartments)
  • Medical (MRI shielding enclosures)

6. Leading Manufacturers and Products

ManufacturerRepresentative Products
Parker ChomericsCHO-SEAL conductive gaskets
Laird Performance MaterialsForm-in-Place EMI gaskets
3MEMI Shielding Tapes 9703/9706
SamtecRFI/EMI shielded connectors

7. Selection Recommendations

Considerations include:

  • Frequency range of the application (higher frequencies require tighter tolerances)
  • Environmental conditions (temperature, humidity, chemical exposure)
  • Material compatibility (avoid galvanic corrosion between mating surfaces)
  • Cost-effectiveness (balance performance vs. budget constraints)

Case Study: In automotive radar systems, Parker Chomerics' silicone-based gaskets reduced EMI leakage by 40% compared to traditional metal fingerstock.

8. Industry Trends

Key development directions:

  • Miniaturization for 5G mmWave applications
  • Low-PIM (Passive Intermodulation) material formulations
  • Multi-functional integration with thermal management
  • RoHS-compliant plating processes (eliminating hexavalent chromium)
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