RFI and EMI - Contacts, Fingerstock and Gaskets

Part Number	Description / PDF	Quantity
S0981-46R Harwin	RFI SHIELD CLIP R/A TIN SMD	13889
3021302 Würth Elektronik Midcom	WE-LT CONDUCTIVE SHIELDING GASKE	219
4548PA51H01800 Laird - Performance Materials	GSKT FAB/FOAM 6.4X457.2MM DSHAPE	255
S1411-46R Harwin	RFI SHIELD CLIP MAXI TIN SMD	60042
S7101-42R Harwin	RFI SHIELD FINGER AU 3.5MM SMD	2190
4049PA51H01800 Laird - Performance Materials	GASKET FAB/FOAM 6.35X457.2MM SQ	0
4357PA51H01800 Laird - Performance Materials	GASKET FAB/FOAM 10X457.2MM RECT	577
56-70000 Parker Chomerics	FINGERSTOCK 0.13X0.37X15"	48
4692PA51G01800 Laird - Performance Materials	GSKT FAB/FOAM 6.4X457.2MM DSHAPE	0
0077010502 Laird - Performance Materials	FINGERSTOCK BECU 15.24X406.4MM	0
1551573-5 TE Connectivity AMP Connectors	PRE-LOADED SPRING FINGER 2.15MM	4258
WS-3230-KD-2400 3G Shielding Specialties	FAB/FOAM GASKET .300WX.100HX24L	90
S1721-46R Harwin	RFI SHIELD CLIP MINI TIN SMD	0
0097043802 Laird - Performance Materials	FINGERSTOCK BECU 27.69MMX406.4MM	944
0097095702 Laird - Performance Materials	FINGERSTOCK BECU 8.9X381MM	0
3020905 Würth Elektronik Midcom	WE-LT CONDUCTIVE SHIELDING GASKE	0
3021008 Würth Elektronik Midcom	GASKET FABRIC/FOAM 10MMX1M RECT	38
14-37FS-BD-16 Leader Tech Inc.	COPPER BERYLLIUM FINGERSTOCK EMI	108
3020903 Würth Elektronik Midcom	WE-LT CONDUCTIVE SHIELDING GASKE	75
0097055117 Laird - Performance Materials	FINGERSTOCK BECU 4X609.6MM	490

RFI and EMI - Contacts, Fingerstock and Gaskets

1. Overview

RF/IF (Radio Frequency/Intermediate Frequency) and RFID (Radio Frequency Identification) systems require effective electromagnetic interference (EMI) and radio frequency interference (RFI) shielding to maintain signal integrity. Contacts, fingerstock, and gaskets are critical components for ensuring electrical continuity and shielding performance in electronic enclosures. These components prevent electromagnetic leakage while maintaining mechanical functionality in connectors, housings, and assemblies.

2. Main Types and Functional Classification

Type	Functional Features	Application Examples
Contacts	Conductive elements for maintaining electrical connections under compression	RF connectors, PCB grounding pads
Fingerstock	Resilient metal strips with finger-like projections for continuous shielding	Server chassis, military equipment
Gaskets	Conductive elastomers or mesh materials for sealing gaps	Automotive sensors, medical devices

3. Structure and Composition

Typical structures include:

Contacts: Beryllium copper or phosphor bronze cores with conductive platings (gold, silver, nickel)
Fingerstock: Canted coil springs or stamped metal fingers with corrosion-resistant coatings
Gaskets: Silicone rubber with embedded silver-aluminum particles or wire mesh

4. Key Technical Parameters

Parameter	Typical Range	Significance
Contact Resistance	0.1-10 m	Affects signal transmission efficiency
Shielding Effectiveness	60-120 dB (100 MHz-10 GHz)	Determines EMI/RFI attenuation
Compression Force	0.5-5 N/mm	Impacts mechanical durability
Temperature Range	-55 C to +150 C	Defines operational stability

5. Application Fields

Main industries include:

Telecommunications (5G base stations, microwave links)
Automotive (V2X communication systems, radar sensors)
Aerospace (avionics shielding compartments)
Medical (MRI shielding enclosures)

6. Leading Manufacturers and Products

Manufacturer	Representative Products
Parker Chomerics	CHO-SEAL conductive gaskets
Laird Performance Materials	Form-in-Place EMI gaskets
3M	EMI Shielding Tapes 9703/9706
Samtec	RFI/EMI shielded connectors

7. Selection Recommendations

Considerations include:

Frequency range of the application (higher frequencies require tighter tolerances)
Environmental conditions (temperature, humidity, chemical exposure)
Material compatibility (avoid galvanic corrosion between mating surfaces)
Cost-effectiveness (balance performance vs. budget constraints)

Case Study: In automotive radar systems, Parker Chomerics' silicone-based gaskets reduced EMI leakage by 40% compared to traditional metal fingerstock.

8. Industry Trends

Key development directions:

Miniaturization for 5G mmWave applications
Low-PIM (Passive Intermodulation) material formulations
Multi-functional integration with thermal management
RoHS-compliant plating processes (eliminating hexavalent chromium)