RFI and EMI - Contacts, Fingerstock and Gaskets

Part Number	Description / PDF	Quantity
30506 Würth Elektronik Midcom	CONDUCTIVE NI/CU GLASS SLEEVE 1M	0
3021013 Würth Elektronik Midcom	GASKET COND SHIELD RECT 1000MM	0
BMI-C-004 Laird - Performance Materials	CONTACT BECU 6.0X4.3MM	5849
0097057202 Laird - Performance Materials	FINGERSTOCK BECU 7X406.4MM	0
4850-12-1212-0400 Parker Chomerics	SOFT SHIELD 4850 12"X12" 4MM	7
0C97054019 Laird - Performance Materials	RFI EMI GROUNDING MATERIAL 25FT	0
0077005202 Laird - Performance Materials	GASKET BECU 8.1X32.77MM	0
WS-3125-KR-2400 3G Shielding Specialties	FAB/FOAM GASKET .395WX.040HX24L	100
10-04-1687-6502 Parker Chomerics	CHO-SEAL 6502 NI/AL 0.070" 1'	9
6-34T-SN-24 Leader Tech Inc.	COPPER BERYLLIUM FINGERSTOCK EMI	14
0C97055502 Laird - Performance Materials	RFI EMI GROUNDING MATERIAL 25FT	0
BMI-C-006 Laird - Performance Materials	CONTACT BECU 2.9X1.5MM	3819
4231PA51H01800 Laird - Performance Materials	GASKET FAB/FOAM 41X457.2MM RECT	0
WS-3235-KD-2400 3G Shielding Specialties	FAB/FOAM GASKET .125WX.125HX24L	88
3020402 Würth Elektronik Midcom	GASKET FABRIC/FOAM 4MMX1M RECT	56
S0941-46R Harwin	RFI SHIELD CLIP MINI TIN SMD	0
4239PA51H01800 Laird - Performance Materials	GASKET FAB/FOAM 41X457.2MM RECT	0
3021010 Würth Elektronik Midcom	GASKET FABRIC/FOAM 10MMX1M SQ	30
10-04-8363-S6305 Parker Chomerics	CHO-SEAL S6305 NI/C 0.103" 1'	447
S7051-42R Harwin	RFI SHIELD FINGER AU 6MM SMD	4190

RFI and EMI - Contacts, Fingerstock and Gaskets

1. Overview

RF/IF (Radio Frequency/Intermediate Frequency) and RFID (Radio Frequency Identification) systems require effective electromagnetic interference (EMI) and radio frequency interference (RFI) shielding to maintain signal integrity. Contacts, fingerstock, and gaskets are critical components for ensuring electrical continuity and shielding performance in electronic enclosures. These components prevent electromagnetic leakage while maintaining mechanical functionality in connectors, housings, and assemblies.

2. Main Types and Functional Classification

Type	Functional Features	Application Examples
Contacts	Conductive elements for maintaining electrical connections under compression	RF connectors, PCB grounding pads
Fingerstock	Resilient metal strips with finger-like projections for continuous shielding	Server chassis, military equipment
Gaskets	Conductive elastomers or mesh materials for sealing gaps	Automotive sensors, medical devices

3. Structure and Composition

Typical structures include:

Contacts: Beryllium copper or phosphor bronze cores with conductive platings (gold, silver, nickel)
Fingerstock: Canted coil springs or stamped metal fingers with corrosion-resistant coatings
Gaskets: Silicone rubber with embedded silver-aluminum particles or wire mesh

4. Key Technical Parameters

Parameter	Typical Range	Significance
Contact Resistance	0.1-10 m	Affects signal transmission efficiency
Shielding Effectiveness	60-120 dB (100 MHz-10 GHz)	Determines EMI/RFI attenuation
Compression Force	0.5-5 N/mm	Impacts mechanical durability
Temperature Range	-55 C to +150 C	Defines operational stability

5. Application Fields

Main industries include:

Telecommunications (5G base stations, microwave links)
Automotive (V2X communication systems, radar sensors)
Aerospace (avionics shielding compartments)
Medical (MRI shielding enclosures)

6. Leading Manufacturers and Products

Manufacturer	Representative Products
Parker Chomerics	CHO-SEAL conductive gaskets
Laird Performance Materials	Form-in-Place EMI gaskets
3M	EMI Shielding Tapes 9703/9706
Samtec	RFI/EMI shielded connectors

7. Selection Recommendations

Considerations include:

Frequency range of the application (higher frequencies require tighter tolerances)
Environmental conditions (temperature, humidity, chemical exposure)
Material compatibility (avoid galvanic corrosion between mating surfaces)
Cost-effectiveness (balance performance vs. budget constraints)

Case Study: In automotive radar systems, Parker Chomerics' silicone-based gaskets reduced EMI leakage by 40% compared to traditional metal fingerstock.

8. Industry Trends

Key development directions:

Miniaturization for 5G mmWave applications
Low-PIM (Passive Intermodulation) material formulations
Multi-functional integration with thermal management
RoHS-compliant plating processes (eliminating hexavalent chromium)