RF Evaluation and Development Kits, Boards

Image Part Number Description / PDF Quantity Rfq
114990197

114990197

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WRTNODE STANDARD SHIELD

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102990843

102990843

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FIPY- IOT DEVELOPMENT BOARD

0

113990100

113990100

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LINKIT CONNECT 7681 WI-FI HDK FO

0

109110001

109110001

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LOPY

0

113990095

113990095

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DEVDUINO SENSOR NODE V3 (ATMEGA

0

317030031

317030031

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BLUEDUINO REV2--ARDUINO COMPATIB

0

113990059

113990059

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BLEND MICRO AN ARDUINO DEVELOPME

0

113110001

113110001

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RAZBERRY Z-WAVE

0

103990103

103990103

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DEVDUINO SENSOR NODE V2.2 (ATMEG

0

103990038

103990038

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DEVDUINO SENSOR NODE V1.3

0

102990831

102990831

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REDBEAR BLE NANO V2

0

113110002

113110002

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REDBEARLAB CC3200 WIFI BOARD

0

114991091

114991091

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AMEBA RTL8710AF WIRELESS DEV BOA

0

103990074

103990074

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DEVDUINO SENSOR NODE

0

103990053

103990053

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DEVDUINO SENSOR NODE V2 (ATMEGA

0

102990963

102990963

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WIDORA AIR BASED ESP32 EVALBOARD

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102990837

102990837

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WIO LTE US VERSION - 4G, CAT.1,

0

113010001

113010001

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ARCH GPRS V2

0

109110002

109110002

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WIPY 2.0

0

114991092

114991092

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RTL8710AF WIFI BOARD

0

RF Evaluation and Development Kits, Boards

1. Overview

RF/IF (Radio Frequency/Intermediate Frequency) and RFID (Radio Frequency Identification) evaluation and development kits are hardware platforms designed to facilitate the testing, prototyping, and optimization of wireless communication systems. These kits enable engineers to validate circuit performance, debug protocols, and accelerate product development. They play a critical role in modern technologies such as IoT, 5G, smart logistics, and industrial automation by bridging theoretical design and real-world deployment.

2. Main Types and Functional Classification

TypeFunctional FeaturesApplication Examples
RF Evaluation BoardsFocus on RF signal generation, modulation/demodulation, and impedance matching testing5G base station prototyping, Wi-Fi 6 module testing
RFID Development KitsSupport NFC, UHF/HF RFID tag/reader development with protocol analysisSmart retail payment systems, asset tracking solutions
Multifunctional Development BoardsIntegrate RF, microcontroller, and sensor interfaces for system-level testingIndustrial IoT gateway development, drone communication modules

3. Structure and Components

Typical products consist of: - Base PCB: Multilayer board with RF shielding compartments - RF Front-End: Includes LNA (Low Noise Amplifier), PA (Power Amplifier), and frequency synthesizers - Processing Unit: Embedded FPGA or MCU for real-time signal processing - Interface Ports: USB-C, SMA connectors, GPIO headers for peripheral expansion - Power Management: Regulated voltage supplies for different RF components

4. Key Technical Specifications

ParameterDescriptionImportance
Frequency RangeOperational bandwidth (e.g., 300 MHz - 6 GHz)Determines application compatibility
Output PowerTransmit power level (e.g., -20 to +20 dBm)Impacts communication distance and FCC compliance
Receiver SensitivityMinimum detectable signal level (e.g., -120 dBm)Affects signal reliability in noisy environments
Impedance MatchingVSWR (Voltage Standing Wave Ratio) 2:1Ensures minimal signal reflection
Power Supply RequirementsVoltage/current specifications (e.g., 3.3V 5%)Critical for system integration

5. Application Areas

  • Telecommunications: 5G NR network testing, satellite communication simulation
  • Healthcare: Wireless patient monitoring device development
  • Retail: NFC-based payment terminal prototyping
  • Industrial: RFID-enabled supply chain automation

6. Leading Manufacturers and Products

ManufacturerRepresentative ProductKey Features
Texas InstrumentsAFE7444EVMQuad-channel RF-sampling transceiver evaluation
STMicroelectronicsST25RU3993-DISCOUHF RFID reader IC development kit
Nordic SemiconductornRF52840-DKBluetooth 5.2 and Thread protocol testing
Impinj Speedway R420UHF Gen2 RFID reader for logistics automation

7. Selection Guidelines

Key considerations include: - Frequency Compatibility: Match kit range with target application (e.g., Sub-1GHz vs 2.4GHz) - Development Ecosystem: Availability of SDKs, simulation software, and community support - Scalability: Modular design for future hardware expansion - Compliance Certifications: Pre-tested for FCC/CE regulatory standards - Cost-Performance Ratio: Balance between feature set and project budget

8. Industry Trends

Emerging trends include: - Millimeter-wave Integration: Development kits supporting 24GHz+ for automotive radar - AI-Driven Testing: Embedded machine learning algorithms for signal optimization - Energy Harvesting Support: Ultra-low power RF modules for battery-free IoT devices - Cloud Integration: Over-the-air firmware updates and remote diagnostics - Standardization: Unified platform architectures across multiple vendors

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