RF Evaluation and Development Kits, Boards

Image Part Number Description / PDF Quantity Rfq
102991016

102991016

Seeed

WIO LTE CAT M1/NBIOT TRACKER

0

102110057

102110057

Seeed

WIO NODE

0

110060622

110060622

Seeed

LORA LORAWAN GATEWAY - 868MHZ KI

0

109990246

109990246

Seeed

YARD STICK ONE

1

102991186

102991186

Seeed

WIO LITE MG126 - ATSAMD21 CORTEX

0

110060704

110060704

Seeed

PARTICLE INTERNET BUTTON

0

102010129

102010129

Seeed

SEEEDUINO LORAWAN W/GPS

5

102991455

102991455

Seeed

SERIAL TO ETHERNET MODULE BASED

30

110060576

110060576

Seeed

ESP32 BREAKOUT KIT W/O MODULE

12

102991454

102991454

Seeed

ESP32 DEVELOPMENT BOARD - WT32-S

0

110060490

110060490

Seeed

KIWISDR KIT

0

114991735

114991735

Seeed

REBUTTON ARDUINO AZURE IOT

0

102030002

102030002

Seeed

LINKIT ONE

1

102991024

102991024

Seeed

WIO LTE JP VERSION V1.3 4G CAT.1

0

113990234

113990234

Seeed

TXRX ESP8266 MOD WIFI TRACE ANT

0

102991023

102991023

Seeed

WIO LTE AU VERSION V1.3 4G CAT.1

0

102991022

102991022

Seeed

WIO LTE EU VERSION V1.3- 4G, CAT

0

107990093

107990093

Seeed

ESP32-A1S WI-FI+BT AUDIO DEVELOP

0

317060018

317060018

Seeed

CACTUS MICRO REV2 ARDUINO COMPAT

0

102990830

102990830

Seeed

REDBEAR BLEND V2

0

RF Evaluation and Development Kits, Boards

1. Overview

RF/IF (Radio Frequency/Intermediate Frequency) and RFID (Radio Frequency Identification) evaluation and development kits are hardware platforms designed to facilitate the testing, prototyping, and optimization of wireless communication systems. These kits enable engineers to validate circuit performance, debug protocols, and accelerate product development. They play a critical role in modern technologies such as IoT, 5G, smart logistics, and industrial automation by bridging theoretical design and real-world deployment.

2. Main Types and Functional Classification

TypeFunctional FeaturesApplication Examples
RF Evaluation BoardsFocus on RF signal generation, modulation/demodulation, and impedance matching testing5G base station prototyping, Wi-Fi 6 module testing
RFID Development KitsSupport NFC, UHF/HF RFID tag/reader development with protocol analysisSmart retail payment systems, asset tracking solutions
Multifunctional Development BoardsIntegrate RF, microcontroller, and sensor interfaces for system-level testingIndustrial IoT gateway development, drone communication modules

3. Structure and Components

Typical products consist of: - Base PCB: Multilayer board with RF shielding compartments - RF Front-End: Includes LNA (Low Noise Amplifier), PA (Power Amplifier), and frequency synthesizers - Processing Unit: Embedded FPGA or MCU for real-time signal processing - Interface Ports: USB-C, SMA connectors, GPIO headers for peripheral expansion - Power Management: Regulated voltage supplies for different RF components

4. Key Technical Specifications

ParameterDescriptionImportance
Frequency RangeOperational bandwidth (e.g., 300 MHz - 6 GHz)Determines application compatibility
Output PowerTransmit power level (e.g., -20 to +20 dBm)Impacts communication distance and FCC compliance
Receiver SensitivityMinimum detectable signal level (e.g., -120 dBm)Affects signal reliability in noisy environments
Impedance MatchingVSWR (Voltage Standing Wave Ratio) 2:1Ensures minimal signal reflection
Power Supply RequirementsVoltage/current specifications (e.g., 3.3V 5%)Critical for system integration

5. Application Areas

  • Telecommunications: 5G NR network testing, satellite communication simulation
  • Healthcare: Wireless patient monitoring device development
  • Retail: NFC-based payment terminal prototyping
  • Industrial: RFID-enabled supply chain automation

6. Leading Manufacturers and Products

ManufacturerRepresentative ProductKey Features
Texas InstrumentsAFE7444EVMQuad-channel RF-sampling transceiver evaluation
STMicroelectronicsST25RU3993-DISCOUHF RFID reader IC development kit
Nordic SemiconductornRF52840-DKBluetooth 5.2 and Thread protocol testing
Impinj Speedway R420UHF Gen2 RFID reader for logistics automation

7. Selection Guidelines

Key considerations include: - Frequency Compatibility: Match kit range with target application (e.g., Sub-1GHz vs 2.4GHz) - Development Ecosystem: Availability of SDKs, simulation software, and community support - Scalability: Modular design for future hardware expansion - Compliance Certifications: Pre-tested for FCC/CE regulatory standards - Cost-Performance Ratio: Balance between feature set and project budget

8. Industry Trends

Emerging trends include: - Millimeter-wave Integration: Development kits supporting 24GHz+ for automotive radar - AI-Driven Testing: Embedded machine learning algorithms for signal optimization - Energy Harvesting Support: Ultra-low power RF modules for battery-free IoT devices - Cloud Integration: Over-the-air firmware updates and remote diagnostics - Standardization: Unified platform architectures across multiple vendors

RFQ BOM Call Skype Email
Top