RF Directional Coupler

Image Part Number Description / PDF Quantity Rfq
LDC311G9610B-004

LDC311G9610B-004

TOKO / Murata

MULTI-LAY HYBRID COUPLER 1206

0

CP0603A0836ENTR

CP0603A0836ENTR

Elco (AVX)

DIRECTIONAL COUPLER

0

CP0402P0947BNTR

CP0402P0947BNTR

Elco (AVX)

DIRECTIONAL COUPLER

0

2020-6615-30

2020-6615-30

Metelics (MACOM Technology Solutions)

COUPLER,DIRECTIONAL,

210

CP0402P5000HNTR

CP0402P5000HNTR

Elco (AVX)

DIRECTIONAL COUPLER

0

LDC312G1403B-769

LDC312G1403B-769

TOKO / Murata

MULTI-LAY HYBRID COUPLER 1206

0

CP0603A1060ANTR

CP0603A1060ANTR

Elco (AVX)

DIRECTIONAL COUPLER

0

XC2500P-20S

XC2500P-20S

Anaren

RF DIR COUPLER 2.3GHZ-2.7GHZ SMD

0

CP0805A1615BSTR

CP0805A1615BSTR

Elco (AVX)

DIRECTIONAL COUPLER

0

CP0402P0897ANTR

CP0402P0897ANTR

Elco (AVX)

DIRECTIONAL COUPLER

0

LDC312G1519B-720

LDC312G1519B-720

TOKO / Murata

MULTI-LAY HYBRID COUPLER 1206

0

CP0402P5000ANTR

CP0402P5000ANTR

Elco (AVX)

DIRECTIONAL COUPLER

0

CP0603A1747CNTR

CP0603A1747CNTR

Elco (AVX)

DIRECTIONAL COUPLER

0

CP0603A0942DNTR

CP0603A0942DNTR

Elco (AVX)

DIRECTIONAL COUPLER

0

CP0603A1842DWTR

CP0603A1842DWTR

Elco (AVX)

DIRECTIONAL COUPLER

0

CP0805A2856ASTR

CP0805A2856ASTR

Elco (AVX)

DIRECTIONAL COUPLER

0

1H0566-3

1H0566-3

Anaren

RF DIR COUPLER 2GHZ-4GHZ

2

CP0603A1088ELTR

CP0603A1088ELTR

Elco (AVX)

DIRECTIONAL COUPLER

0

X3C07F1-03S

X3C07F1-03S

Anaren

RF DIR COUPLER 600MHZ-900MHZ SMD

0

CP0603A1960MNTR-SAM

CP0603A1960MNTR-SAM

Elco (AVX)

DIRECTIONAL COUPLER

0

RF Directional Coupler

1. Overview

Directional couplers are passive devices that sample a portion of RF/IF signal power for monitoring or feedback purposes. They enable signal splitting, reflection measurement, and signal-to-noise ratio optimization. These components are critical in wireless communication systems, RFID infrastructure, and industrial control applications.

2. Major Types and Functional Classification

TypeFunctional FeaturesApplication Examples
Microwave Ridge WaveguideHigh power handling (100W+), broadband operation5G Base stations, Satellite communication
Coaxial LineCompact design, 50/75 impedance optionsRFID readers, Test equipment
Microstrip PlanarLow profile, Surface-mount compatibleWLAN routers, IoT modules
Hybrid Coupler3dB power split with phase matchingMIMO systems, Beamforming networks

3. Structure and Components

Typical construction includes: - Precision-machined metal housing (aluminum/copper alloys) - Dielectric substrates (PTFE or ceramic materials) - Coupling slots/apertures (0.1-2.0mm dimensions) - Input/Output ports with SMA/N-Type connectors - Isolation termination resistor (50 matched load) - EMI shielding gaskets

4. Key Technical Specifications

ParameterTypical RangeImportance
Coupling Factor3-40 dBDetermines sampled power level
Directivity15-40 dBMeasures forward/reverse signal separation
Insertion Loss0.1-2.0 dBImpacts system power efficiency
VSWR1.1:1 - 1.5:1Affects impedance matching quality
Frequency Range30 MHz - 110 GHzDefines operational bandwidth

5. Application Fields

Key industries include: - Telecommunications (5G/4G BTS signal monitoring) - RFID systems (UHF/NFC reader sensitivity control) - Industrial IoT (Wireless sensor network optimization) - Medical equipment (MRI RF power management) - Automotive (V2X communication diagnostics)

6. Leading Manufacturers and Products

ManufacturerRepresentative ProductKey Features
Analog DevicesADL552340GHz broadband, 20dB coupling accuracy
Mini-CircuitsZFDC-20-63-S+DC-20GHz, 3.5mm connectorized
TE ConnectivityRF-0424-01Automotive-grade RFID coupler
KRYTAR1010480010-48GHz, 50dB dynamic range

7. Selection Guidelines

Key considerations: - Frequency bandwidth match (1.5x operating range) - Power handling (1.2x maximum system power) - Directivity requirements (>30dB for precise measurements) - Environmental factors (operating temperature -40 C to +85 C) - Connector type compatibility (SMA vs N-Type) - Cost vs performance tradeoff (planar vs waveguide)

8. Industry Trends

Emerging developments: - Sub-6GHz massive MIMO integration - Advanced packaging for mmWave applications - AI-optimized coupling algorithms - Gallium Nitride (GaN) material adoption - Miniaturization for mobile device integration - Higher directivity (>50dB) research

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