RF Directional Coupler

Image Part Number Description / PDF Quantity Rfq
CP0402A0942BLTR

CP0402A0942BLTR

Elco (AVX)

RF DIR COUPLER 925-960MHZ 0402

0

4864

4864

MITEQ, Inc.(L3 Narda-MITEQ)

CROSSGUIDE DIR COUP 26.5-40.0 SM

0

CP0402A3500FLTR

CP0402A3500FLTR

Elco (AVX)

RF DIR COUPLER 3.5GHZ 0402

0

DBTC-20-4X+

DBTC-20-4X+

20.4 DB SMT DIRECTIONAL COUPLER,

0

MACP-010572-TR1000

MACP-010572-TR1000

Metelics (MACOM Technology Solutions)

RMS POWER DETECTOR 6-18 GHZ

10794000

FPC06719

FPC06719

Knowles DLI

RF DIR COUPLER 6GHZ-18GHZ SMD

35

CP0402A1880ANTR

CP0402A1880ANTR

Elco (AVX)

RF DIR COUPLER 1.85-1.91GHZ 0402

0

CP0805B0942AWTR\500

CP0805B0942AWTR\500

Elco (AVX)

RF DIR COUPLER 925-960MHZ 0805

0

FPC07643

FPC07643

Knowles DLI

COUPLER

10

X3C19P1-03S

X3C19P1-03S

Anaren

RF DIR COUPLER 1.4GHZ-2GHZ SMD

0

CP0603D0836AWTR

CP0603D0836AWTR

Elco (AVX)

RF DIR COUPLER 824-849MHZ 0603

0

CP0805B0902BWTR

CP0805B0902BWTR

Elco (AVX)

RF DIR COUPLER 890-915MHZ 0805

0

4203-6

4203-6

MITEQ, Inc.(L3 Narda-MITEQ)

RF DIR COUPLER 2GHZ-18GHZ MODULE

0

DBTC-20-4L+

DBTC-20-4L+

20.4 DB SMT DIRECTIONAL COUPLER,

0

BDCN-17-25+

BDCN-17-25+

16.8 DB SMT BI-DIRECTIONAL COUPL

0

DBTC-10-13+

DBTC-10-13+

10.3 DB SMT DIRECTIONAL COUPLER,

0

11306-3S

11306-3S

Anaren

RF DIR COUPLER 2GHZ-4GHZ SMD

2155

X3C21P1-05S

X3C21P1-05S

Anaren

RF DIR COUPLER 2GHZ-2.3GHZ SMD

1355

CP10710P150-20

CP10710P150-20

Amtery Corporation

7 GHZ 10 GHZ, 20 DB COUPLING, B

3

CP0603A1960AWTR

CP0603A1960AWTR

Elco (AVX)

RF DIR COUPLER 1.93-1.99GHZ 0603

0

RF Directional Coupler

1. Overview

Directional couplers are passive devices that sample a portion of RF/IF signal power for monitoring or feedback purposes. They enable signal splitting, reflection measurement, and signal-to-noise ratio optimization. These components are critical in wireless communication systems, RFID infrastructure, and industrial control applications.

2. Major Types and Functional Classification

TypeFunctional FeaturesApplication Examples
Microwave Ridge WaveguideHigh power handling (100W+), broadband operation5G Base stations, Satellite communication
Coaxial LineCompact design, 50/75 impedance optionsRFID readers, Test equipment
Microstrip PlanarLow profile, Surface-mount compatibleWLAN routers, IoT modules
Hybrid Coupler3dB power split with phase matchingMIMO systems, Beamforming networks

3. Structure and Components

Typical construction includes: - Precision-machined metal housing (aluminum/copper alloys) - Dielectric substrates (PTFE or ceramic materials) - Coupling slots/apertures (0.1-2.0mm dimensions) - Input/Output ports with SMA/N-Type connectors - Isolation termination resistor (50 matched load) - EMI shielding gaskets

4. Key Technical Specifications

ParameterTypical RangeImportance
Coupling Factor3-40 dBDetermines sampled power level
Directivity15-40 dBMeasures forward/reverse signal separation
Insertion Loss0.1-2.0 dBImpacts system power efficiency
VSWR1.1:1 - 1.5:1Affects impedance matching quality
Frequency Range30 MHz - 110 GHzDefines operational bandwidth

5. Application Fields

Key industries include: - Telecommunications (5G/4G BTS signal monitoring) - RFID systems (UHF/NFC reader sensitivity control) - Industrial IoT (Wireless sensor network optimization) - Medical equipment (MRI RF power management) - Automotive (V2X communication diagnostics)

6. Leading Manufacturers and Products

ManufacturerRepresentative ProductKey Features
Analog DevicesADL552340GHz broadband, 20dB coupling accuracy
Mini-CircuitsZFDC-20-63-S+DC-20GHz, 3.5mm connectorized
TE ConnectivityRF-0424-01Automotive-grade RFID coupler
KRYTAR1010480010-48GHz, 50dB dynamic range

7. Selection Guidelines

Key considerations: - Frequency bandwidth match (1.5x operating range) - Power handling (1.2x maximum system power) - Directivity requirements (>30dB for precise measurements) - Environmental factors (operating temperature -40 C to +85 C) - Connector type compatibility (SMA vs N-Type) - Cost vs performance tradeoff (planar vs waveguide)

8. Industry Trends

Emerging developments: - Sub-6GHz massive MIMO integration - Advanced packaging for mmWave applications - AI-optimized coupling algorithms - Gallium Nitride (GaN) material adoption - Miniaturization for mobile device integration - Higher directivity (>50dB) research

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