| Image | Part Number | Description / PDF | Quantity | Rfq |
|---|---|---|---|---|
 |
Renesas Electronics America |
WIDE BAND LOW POWER AMPLIFIER |
43616 |
|
 |
Maxim Integrated |
IC AMP CELLULR 50MHZ-1GHZ 40TQFN |
1571050 |
|
 |
Analog Devices, Inc. |
IC RF AMP GP 200MHZ-4GHZ SOT89 |
57 |
|
 |
Analog Devices, Inc. |
IC RF AMP RADAR 2GHZ-18GHZ DIE |
0 |
|
 |
SMT GAIN BLOCK, DC - 4000 MHZ, 5 |
0 |
|
|
 |
Analog Devices, Inc. |
IC RF AMP VSAT 12GHZ-16GHZ 32QFN |
810 |
|
 |
Analog Devices, Inc. |
IC AMP VSAT DBS 6GHZ-20GHZ 32QFN |
636 |
|
 |
Analog Devices, Inc. |
IC RF AMP GP 22GHZ-26.5GHZ DIE |
0 |
|
 |
Skyworks Solutions, Inc. |
IC RF AMP CDMA 1.7GHZ-2GHZ 8DFN |
2372 |
|
 |
Roving Networks / Microchip Technology |
IC AMP 802.11A/B/G 2.4GHZ 16LGA |
2756 |
|
 |
Analog Devices, Inc. |
IC RF AMP GP 81GHZ-86GHZ DIE |
10 |
|
 |
NXP Semiconductors |
IC RF AMP GP 0HZ-6GHZ SOT89A |
512 |
|
 |
Metelics (MACOM Technology Solutions) |
AMPLIFIER |
10 |
|
 |
Analog Devices, Inc. |
IC RF AMP GP 17GHZ-26GHZ 24SMT |
66 |
|
 |
Metelics (MACOM Technology Solutions) |
IC RF AMP GP 50MHZ-1GHZ 24QFN |
0 |
|
 |
NXP Semiconductors |
IC AMP 1.4GHZ-2.2GHZ TO270WBG-17 |
0 |
|
 |
Analog Devices, Inc. |
GSM900 POWER AMPLIFIER |
1080 |
|
 |
Renesas Electronics America |
VFQFPN 4.00X4.00X0.90 MM, 0.50MM |
0 |
|
 |
Maxim Integrated |
698MHZ TO 3800MHZ RF POWER AMPLI |
1181040 |
|
 |
Analog Devices, Inc. |
IC AMP VSAT 13.6-14.9GHZ 32QFN |
0 |
|
RF/IF amplifiers and RFID amplifiers are critical components in wireless communication systems, designed to boost signal strength while maintaining signal integrity. RF amplifiers operate across radio frequency (RF) and intermediate frequency (IF) bands, enabling signal transmission/reception in devices like base stations, IoT modules, and medical equipment. RFID amplifiers specialize in enhancing signals for radio frequency identification systems, ensuring reliable data exchange between readers and tags. These components are essential for modern technologies such as 5G networks, smart logistics, and contactless payment systems.
| Type | Functional Characteristics | Application Examples |
|---|---|---|
| Low Noise Amplifier (LNA) | High sensitivity, minimal added noise | RF receivers, satellite communication |
| Power Amplifier (PA) | High output power, efficiency optimization | Cellular base stations, Wi-Fi routers |
| IF Amplifier | Fixed/dynamic gain control at IF bands | Television tuners, radar systems |
| Variable Gain Amplifier (VGA) | Adjustable gain for signal conditioning | Software-defined radios, test equipment |
| RFID Reader Amplifier | Impedance matching for tag interrogation | UHF RFID readers, NFC terminals |
Typical RF amplifiers consist of: - Dielectric substrate (e.g., FR4, Rogers material) with conductive traces - Transistor elements (GaAs FETs, SiGe BJTs, or GaN HEMTs) - Impedance matching networks (LC circuits or microstrip lines) - Thermal management (heat sinks or thermal vias) - Shielded enclosure for EMI protection Modern designs integrate bias tees, directional couplers, and protection diodes.
| Parameter | Description | Importance |
|---|---|---|
| Gain (dB) | Signal amplification ratio | Determines signal reach and clarity |
| Noise Figure (dB) | Additional noise introduced | Impacts receiver sensitivity |
| Output Power (dBm) | Maximum deliverable power | Dictates transmission distance |
| Frequency Range (GHz) | Operational bandwidth | System compatibility factor |
| P1dB Compression | Linear-to-saturation threshold | Ensures signal fidelity |
| IP3 (dBm) | Intermodulation distortion resistance | Multi-signal environment performance |
| Manufacturer | Representative Product | Key Features |
|---|---|---|
| Texas Instruments | LMX2500 | Integrated synthesizer with 15dBm output power |
| Analog Devices | ADAR1000 | 4-channel mmWave beamformer for 24GHz RFID |
| STMicroelectronics | STRF79X | Highly integrated NFC/RFID transceiver |
| Nordic Semiconductor | nRF21540 | 2.4GHz front-end module with +20dB gain |
| Impinj | R4H001 | UHF Gen2 RFID reader IC with on-chip amplifier |
Key considerations include: - Frequency alignment with system requirements - Gain flatness across operational bandwidth - Thermal dissipation capabilities - Package type (QFN, BGA, or connectorized) - Environmental compliance (temperature, humidity) - Cost vs. performance trade-offs
Emerging trends include: - Transition to GaN technology for higher power density - Silicon integration for mmWave applications - AI-driven dynamic impedance matching - Energy-efficient Class-J and Doherty architectures - Convergence with photonic ICs for 6G systems