Arrays/Networks Resistors

Part Number	Description / PDF	Quantity
EXB-28V431JX Panasonic	RES ARRAY 4 RES 430 OHM 0804	317
EXB-2HV820JV Panasonic	RES ARRAY 8 RES 82 OHM 1506	8836
EXB-28V243JX Panasonic	RES ARRAY 4 RES 24K OHM 0804	13913
EXB-34V131JV Panasonic	RES ARRAY 2 RES 130 OHM 0606	0
EXB-V8V391JV Panasonic	RES ARRAY 4 RES 390 OHM 1206	16138
EXB-D10C223J Panasonic	RES ARRAY 8 RES 22K OHM 1206	12009
EXB-24V824JX Panasonic	RES ARRAY 2 RES 820K OHM 0404	10000
EXB-24V202JX Panasonic	RES ARRAY 2 RES 2K OHM 0404	0
EXB-34V241JV Panasonic	RES ARRAY 2 RES 240 OHM 0606	0
EXB-14V122JX Panasonic	RES ARRAY 2 RES 1.2K OHM 0302	16783
EXB-38V103JV Panasonic	RES ARRAY 4 RES 10K OHM 1206	135110
EXB-28V272JX Panasonic	RES ARRAY 4 RES 2.7K OHM 0804	27730
EXB-D10C823J Panasonic	RES ARRAY 8 RES 82K OHM 1206	9549
EXB-V8V303JV Panasonic	RES ARRAY 4 RES 30K OHM 1206	0
EXB-A10P103J Panasonic	RES ARRAY 8 RES 10K OHM 2512	1612
EXB-28V2R7JX Panasonic	RES ARRAY 4 RES 2.7 OHM 0804	19711
EXB-2HV564JV Panasonic	RES ARRAY 8 RES 560K OHM 1506	6890
EXB-38V111JV Panasonic	RES ARRAY 4 RES 110 OHM 1206	0
EXB-2HV180JV Panasonic	RES ARRAY 8 RES 18 OHM 1506	4150
EXB-28V242JX Panasonic	RES ARRAY 4 RES 2.4K OHM 0804	4894

Arrays/Networks Resistors

1. Overview

Resistor arrays/networks are integrated circuits containing multiple resistors in a single package. They provide precise resistance values and spatial efficiency in electronic systems. These components play a critical role in modern electronics by enabling voltage division, signal conditioning, and termination networks while reducing PCB footprint and assembly complexity.

2. Main Types and Functional Classification

Type	Functional Characteristics	Application Examples
Bussed Resistor Arrays	Common terminal connection for multiple resistors	Digital logic pull-up/pull-down networks
Isolated Resistor Networks	Electrically separated resistor elements	Analog signal conditioning circuits
Voltage Divider Arrays	Precisely matched resistor ratios	Sensor signal scaling in measurement systems
Termination Networks	High-precision impedance matching	High-speed data bus termination
Integrated EMI Filters	Combined resistive and capacitive elements	Noise suppression in communication interfaces

3. Structure and Composition

Typical construction features:

Ceramic substrate (Al O or AlN) for thermal stability
Thin-film or thick-film resistive elements (NiCr, TaN)
Termination pads with Ag/Pd or Sn/Pb metallization
Molded epoxy encapsulation (for discrete packages)
Standard packages: SIP, DIP, SOIC, TSSOP

4. Key Technical Parameters

Parameter	Significance
Resistance Range	0.1 to 10M (determines application suitability)
Power Rating	50mW to 1W per element (thermal management factor)
Tolerance	0.1% to 5% (precision level indicator)
TCR	25ppm/ C to 100ppm/ C (temperature stability)
Insulation Resistance	100M min (isolation performance)
Voltage Rating	50V to 200V (safety and breakdown protection)

5. Application Fields

Consumer Electronics: Smartphones (LCD biasing), IoT devices
Automotive: ECU sensor interfaces, LED lighting control
Industrial: PLC signal conditioning, precision instrumentation
Telecommunications: Transmission line termination, RF circuits
Aerospace: Avionics redundancy systems, navigation equipment

6. Leading Manufacturers and Products

Manufacturer	Key Products
Vishay Precision Group	CRCW-HP series (high-precision thin-film)
Panasonic Electronic Devices	EX-H series (automotive-grade networks)
TT Electronics	WSL series (low-TCR power arrays)
ROHM Semiconductor	MNR series (miniaturized resistor networks)
Yageo Corporation	RCN series (high-voltage termination arrays)

7. Selection Guidelines

Calculate required resistance values and tolerances
Determine power dissipation requirements per element
Assess temperature coefficient needs based on operating environment
Select package type compatible with PCB layout and assembly process
Consider EMI filtering requirements for high-frequency applications
Evaluate automotive/aerospace certification needs

Industry Trends Analysis

Current development directions include:

Miniaturization: 01005-inch footprint arrays for mobile devices
Increased integration: Embedded passives in SiP modules
Extended reliability: AEC-Q100 qualified parts for EV systems
High-precision manufacturing: Laser-trimmed thin-film technology
Environmental compliance: Halogen-free and RoHS-compliant packages