Arrays/Networks Resistors

Part Number	Description / PDF	Quantity
EXB-V8V914JV Panasonic	RES ARRAY 4 RES 910K OHM 1206	0
EXB-V4V102JV Panasonic	RES ARRAY 2 RES 1K OHM 0606	4819
EXB-24V391JX Panasonic	RES ARRAY 2 RES 390 OHM 0404	705
EXB-2HV560JV Panasonic	RES ARRAY 8 RES 56 OHM 1506	45140
EXB-2HV274JV Panasonic	RES ARRAY 8 RES 270K OHM 1506	1391
EXB-Q16P103J Panasonic	RES ARRAY 15 RES 10K OHM 1506	8173
EXB-V8V180JV Panasonic	RES ARRAY 4 RES 18 OHM 1206	23490
EXB-38V122JV Panasonic	RES ARRAY 4 RES 1.2K OHM 1206	19585
EXB-34V510JV Panasonic	RES ARRAY 2 RES 51 OHM 0606	0
EXB-34V394JV Panasonic	RES ARRAY 2 RES 390K OHM 0606	39013
EXB-V8V224JV Panasonic	RES ARRAY 4 RES 220K OHM 1206	0
EXB-24V204JX Panasonic	RES ARRAY 2 RES 200K OHM 0404	0
EXB-24V101JX Panasonic	RES ARRAY 2 RES 100 OHM 0404	0
EXB-38V473JV Panasonic	RES ARRAY 4 RES 47K OHM 1206	7709
EXB-V8V273JV Panasonic	RES ARRAY 4 RES 27K OHM 1206	11377
EXB-28V621JX Panasonic	RES ARRAY 4 RES 620 OHM 0804	108
EXB-24V114JX Panasonic	RES ARRAY 2 RES 110K OHM 0404	0
EXB-V8V684JV Panasonic	RES ARRAY 4 RES 680K OHM 1206	19860
EXB-24V751JX Panasonic	RES ARRAY 2 RES 750 OHM 0404	0
EXB-18V151JX Panasonic	RES ARRAY 4 RES 150 OHM 0502	4417

Arrays/Networks Resistors

1. Overview

Resistor arrays/networks are integrated circuits containing multiple resistors in a single package. They provide precise resistance values and spatial efficiency in electronic systems. These components play a critical role in modern electronics by enabling voltage division, signal conditioning, and termination networks while reducing PCB footprint and assembly complexity.

2. Main Types and Functional Classification

Type	Functional Characteristics	Application Examples
Bussed Resistor Arrays	Common terminal connection for multiple resistors	Digital logic pull-up/pull-down networks
Isolated Resistor Networks	Electrically separated resistor elements	Analog signal conditioning circuits
Voltage Divider Arrays	Precisely matched resistor ratios	Sensor signal scaling in measurement systems
Termination Networks	High-precision impedance matching	High-speed data bus termination
Integrated EMI Filters	Combined resistive and capacitive elements	Noise suppression in communication interfaces

3. Structure and Composition

Typical construction features:

Ceramic substrate (Al O or AlN) for thermal stability
Thin-film or thick-film resistive elements (NiCr, TaN)
Termination pads with Ag/Pd or Sn/Pb metallization
Molded epoxy encapsulation (for discrete packages)
Standard packages: SIP, DIP, SOIC, TSSOP

4. Key Technical Parameters

Parameter	Significance
Resistance Range	0.1 to 10M (determines application suitability)
Power Rating	50mW to 1W per element (thermal management factor)
Tolerance	0.1% to 5% (precision level indicator)
TCR	25ppm/ C to 100ppm/ C (temperature stability)
Insulation Resistance	100M min (isolation performance)
Voltage Rating	50V to 200V (safety and breakdown protection)

5. Application Fields

Consumer Electronics: Smartphones (LCD biasing), IoT devices
Automotive: ECU sensor interfaces, LED lighting control
Industrial: PLC signal conditioning, precision instrumentation
Telecommunications: Transmission line termination, RF circuits
Aerospace: Avionics redundancy systems, navigation equipment

6. Leading Manufacturers and Products

Manufacturer	Key Products
Vishay Precision Group	CRCW-HP series (high-precision thin-film)
Panasonic Electronic Devices	EX-H series (automotive-grade networks)
TT Electronics	WSL series (low-TCR power arrays)
ROHM Semiconductor	MNR series (miniaturized resistor networks)
Yageo Corporation	RCN series (high-voltage termination arrays)

7. Selection Guidelines

Calculate required resistance values and tolerances
Determine power dissipation requirements per element
Assess temperature coefficient needs based on operating environment
Select package type compatible with PCB layout and assembly process
Consider EMI filtering requirements for high-frequency applications
Evaluate automotive/aerospace certification needs

Industry Trends Analysis

Current development directions include:

Miniaturization: 01005-inch footprint arrays for mobile devices
Increased integration: Embedded passives in SiP modules
Extended reliability: AEC-Q100 qualified parts for EV systems
High-precision manufacturing: Laser-trimmed thin-film technology
Environmental compliance: Halogen-free and RoHS-compliant packages