Arrays/Networks Resistors

Part Number	Description / PDF	Quantity
SM208RD-0035E Ohmite	SM208RD 150M / 75K 1%	49
SM104RD-0015 Ohmite	SM104RD 1001M / 1M 1%	37
SM104RD-0007E Ohmite	SM104RD 100.1M / 100K 1%	28
SM206RD-0012 Ohmite	SM206RD 150M / 150K 0.5%	20
SM106RD-001 Ohmite	SM106RD 5000M / 25M 1%	29
SM104RD-0160E Ohmite	SM104RD 1MEG 1%	9
SM103RD-0050 Ohmite	RT=100M 5% R2=100K 5%	92
SM208RD-0032E Ohmite	SM208RD 1G / 250K 1%	16
SM208RD-0005 Ohmite	SM208RD 1001MEG / 1MEG 5%	11
SM104RD-0007 Ohmite	SM104RD 100.1M / 100K 1%	3
SM103RD-0105 Ohmite	SM103RD 30M / 100K 0.5%	12
SM104RD-0158E Ohmite	SM104RD 1MEG 1%	2
SM106RD-0030 Ohmite	SM106RD 1000M 10%	6
SM104RD-0161E Ohmite	SM104RD 300MEG 1%	83
SM208RD-0021 Ohmite	SM208RD 4000MEG / 1MEG 1%	18
SM-SP096 Ohmite	RES NETWORK 2 RES 400K OHM 3SIP	0
MC4-1003JE Ohmite	RES ARRAY 4 RES 100K OHM 8SMD	0

Arrays/Networks Resistors

1. Overview

Resistor arrays/networks are integrated circuits containing multiple resistors in a single package. They provide precise resistance values and spatial efficiency in electronic systems. These components play a critical role in modern electronics by enabling voltage division, signal conditioning, and termination networks while reducing PCB footprint and assembly complexity.

2. Main Types and Functional Classification

Type	Functional Characteristics	Application Examples
Bussed Resistor Arrays	Common terminal connection for multiple resistors	Digital logic pull-up/pull-down networks
Isolated Resistor Networks	Electrically separated resistor elements	Analog signal conditioning circuits
Voltage Divider Arrays	Precisely matched resistor ratios	Sensor signal scaling in measurement systems
Termination Networks	High-precision impedance matching	High-speed data bus termination
Integrated EMI Filters	Combined resistive and capacitive elements	Noise suppression in communication interfaces

3. Structure and Composition

Typical construction features:

Ceramic substrate (Al O or AlN) for thermal stability
Thin-film or thick-film resistive elements (NiCr, TaN)
Termination pads with Ag/Pd or Sn/Pb metallization
Molded epoxy encapsulation (for discrete packages)
Standard packages: SIP, DIP, SOIC, TSSOP

4. Key Technical Parameters

Parameter	Significance
Resistance Range	0.1 to 10M (determines application suitability)
Power Rating	50mW to 1W per element (thermal management factor)
Tolerance	0.1% to 5% (precision level indicator)
TCR	25ppm/ C to 100ppm/ C (temperature stability)
Insulation Resistance	100M min (isolation performance)
Voltage Rating	50V to 200V (safety and breakdown protection)

5. Application Fields

Consumer Electronics: Smartphones (LCD biasing), IoT devices
Automotive: ECU sensor interfaces, LED lighting control
Industrial: PLC signal conditioning, precision instrumentation
Telecommunications: Transmission line termination, RF circuits
Aerospace: Avionics redundancy systems, navigation equipment

6. Leading Manufacturers and Products

Manufacturer	Key Products
Vishay Precision Group	CRCW-HP series (high-precision thin-film)
Panasonic Electronic Devices	EX-H series (automotive-grade networks)
TT Electronics	WSL series (low-TCR power arrays)
ROHM Semiconductor	MNR series (miniaturized resistor networks)
Yageo Corporation	RCN series (high-voltage termination arrays)

7. Selection Guidelines

Calculate required resistance values and tolerances
Determine power dissipation requirements per element
Assess temperature coefficient needs based on operating environment
Select package type compatible with PCB layout and assembly process
Consider EMI filtering requirements for high-frequency applications
Evaluate automotive/aerospace certification needs

Industry Trends Analysis

Current development directions include:

Miniaturization: 01005-inch footprint arrays for mobile devices
Increased integration: Embedded passives in SiP modules
Extended reliability: AEC-Q100 qualified parts for EV systems
High-precision manufacturing: Laser-trimmed thin-film technology
Environmental compliance: Halogen-free and RoHS-compliant packages