Arrays/Networks Resistors

Part Number	Description / PDF	Quantity
MC4-5006JE Ohmite	RES ARRAY 4 RES 500M OHM 8SMD	97
MC4-5005JE Ohmite	RES ARRAY 4 RES 50M OHM 8SMD	60
MC4-5004JE Ohmite	RES ARRAY 4 RES 5M OHM 8SMD	58
MC4-1007KE Ohmite	RES ARRAY 4 RES 1G OHM 8SMD	41
MC4-5003JE Ohmite	RES ARRAY 4 RES 500K OHM 8SMD	78
SM103RD-0058 Ohmite	RES NETWORK 2 RES MULT OHM 3SIP	78
MC4-5007KE Ohmite	RES ARRAY 4 RES 5G OHM 8SMD	19
MC4-1005JE Ohmite	RES ARRAY 4 RES 10M OHM 8SMD	110
MC4-1006JE Ohmite	RES ARRAY 4 RES 100M OHM 8SMD	50
MC4-1004JE Ohmite	RES ARRAY 4 RES 1M OHM 8SMD	83
SM104RD-0019 Ohmite	SM104RD 1000M / 1M 5%	45
SM108RD-0030 Ohmite	SM108RD 1000.11M / 1.11M 1%	60
SM310RD-08E Ohmite	SLIM MOX 310 200M/ 100K 1%	3
SM104RD-002 Ohmite	IAW ADVANCED CONV 20406-6	78
SM206RD-0014E Ohmite	SM206RD 1G / 333,333K 1%E	36
SM310RD-09E Ohmite	WINTRON 500M/ 250K 10%	11
SM104RD-0159E Ohmite	SM104RD 1MEG 1%	17
SM103RD-0128E Ohmite	SM103RD 200M / 2M 1%	3
SM108RD-0010 Ohmite	SM108RD 150M / 150K 1%	139
SM104RD-0149E Ohmite	SM104RD 500M / 500K 1%	1

Arrays/Networks Resistors

1. Overview

Resistor arrays/networks are integrated circuits containing multiple resistors in a single package. They provide precise resistance values and spatial efficiency in electronic systems. These components play a critical role in modern electronics by enabling voltage division, signal conditioning, and termination networks while reducing PCB footprint and assembly complexity.

2. Main Types and Functional Classification

Type	Functional Characteristics	Application Examples
Bussed Resistor Arrays	Common terminal connection for multiple resistors	Digital logic pull-up/pull-down networks
Isolated Resistor Networks	Electrically separated resistor elements	Analog signal conditioning circuits
Voltage Divider Arrays	Precisely matched resistor ratios	Sensor signal scaling in measurement systems
Termination Networks	High-precision impedance matching	High-speed data bus termination
Integrated EMI Filters	Combined resistive and capacitive elements	Noise suppression in communication interfaces

3. Structure and Composition

Typical construction features:

Ceramic substrate (Al O or AlN) for thermal stability
Thin-film or thick-film resistive elements (NiCr, TaN)
Termination pads with Ag/Pd or Sn/Pb metallization
Molded epoxy encapsulation (for discrete packages)
Standard packages: SIP, DIP, SOIC, TSSOP

4. Key Technical Parameters

Parameter	Significance
Resistance Range	0.1 to 10M (determines application suitability)
Power Rating	50mW to 1W per element (thermal management factor)
Tolerance	0.1% to 5% (precision level indicator)
TCR	25ppm/ C to 100ppm/ C (temperature stability)
Insulation Resistance	100M min (isolation performance)
Voltage Rating	50V to 200V (safety and breakdown protection)

5. Application Fields

Consumer Electronics: Smartphones (LCD biasing), IoT devices
Automotive: ECU sensor interfaces, LED lighting control
Industrial: PLC signal conditioning, precision instrumentation
Telecommunications: Transmission line termination, RF circuits
Aerospace: Avionics redundancy systems, navigation equipment

6. Leading Manufacturers and Products

Manufacturer	Key Products
Vishay Precision Group	CRCW-HP series (high-precision thin-film)
Panasonic Electronic Devices	EX-H series (automotive-grade networks)
TT Electronics	WSL series (low-TCR power arrays)
ROHM Semiconductor	MNR series (miniaturized resistor networks)
Yageo Corporation	RCN series (high-voltage termination arrays)

7. Selection Guidelines

Calculate required resistance values and tolerances
Determine power dissipation requirements per element
Assess temperature coefficient needs based on operating environment
Select package type compatible with PCB layout and assembly process
Consider EMI filtering requirements for high-frequency applications
Evaluate automotive/aerospace certification needs

Industry Trends Analysis

Current development directions include:

Miniaturization: 01005-inch footprint arrays for mobile devices
Increased integration: Embedded passives in SiP modules
Extended reliability: AEC-Q100 qualified parts for EV systems
High-precision manufacturing: Laser-trimmed thin-film technology
Environmental compliance: Halogen-free and RoHS-compliant packages