Arrays/Networks Resistors

Part Number	Description / PDF	Quantity
ACASA1001E5001P1AT Vishay / Beyschlag	RES ARRAY 4 RES MULT OHM 1206	0
ACASA100023000P100 Vishay / Beyschlag	RES ARRAY 4 RES MULT OHM 1206	0
ACASA1003E1003P100 Vishay / Beyschlag	RES ARRAY 4 RES 100K OHM 1206	504
ACASN1002E1002P1AT Vishay / Beyschlag	RES ARRAY 2 RES 10K OHM 0606	0
ACASA100222002P100 Vishay / Beyschlag	RES ARRAY 4 RES MULT OHM 1206	1563
ACASA1002E2002P100 Vishay / Beyschlag	RES ARRAY 4 RES MULT OHM 1206	1995
ACASN1000U1000P1AT Vishay / Beyschlag	ACAS 0606 100R U 100R AT P1	341
ACASN1003E1003P1AT Vishay / Beyschlag	RES ARRAY 2 RES 100K OHM 0606	2999
ACASA1001S1001P1AT Vishay / Beyschlag	RES ARRAY 4 RES 1K OHM 1206	4004
ACASA5002E5002P100 Vishay / Beyschlag	RES ARRAY 4 RES 50K OHM 1206	0
ACASN1001S2001P1AT Vishay / Beyschlag	RES ARRAY 2 RES MULT OHM 0606	0
ACASA4702E4702P1AT Vishay / Beyschlag	RES ARRAY 4 RES 47K OHM 1206	0
ACASN4701E4701P1AT Vishay / Beyschlag	RES ARRAY 2 RES 4.7K OHM 0606	0
ACASA1000S1000P1AT Vishay / Beyschlag	RES ARRAY 4 RES 100 OHM 1206	0
ACASA5001U5001P1AT Vishay / Beyschlag	ACAS 0612 5K0 U 5K0 AT P1	990
ACASA470224702P100 Vishay / Beyschlag	RES ARRAY 4 RES 47K OHM 1206	932
ACASN1001E1001P1AT Vishay / Beyschlag	RES ARRAY 2 RES 1K OHM 0606	0
ACASN1001E2001P1AT Vishay / Beyschlag	RES ARRAY 2 RES MULT OHM 0606	0
ACASA1001S1001P100 Vishay / Beyschlag	RES ARRAY 4 RES 1K OHM 1206	2015
ACASN1001S1001P1AT Vishay / Beyschlag	RES ARRAY 2 RES 1K OHM 0606	863

Arrays/Networks Resistors

1. Overview

Resistor arrays/networks are integrated circuits containing multiple resistors in a single package. They provide precise resistance values and spatial efficiency in electronic systems. These components play a critical role in modern electronics by enabling voltage division, signal conditioning, and termination networks while reducing PCB footprint and assembly complexity.

2. Main Types and Functional Classification

Type	Functional Characteristics	Application Examples
Bussed Resistor Arrays	Common terminal connection for multiple resistors	Digital logic pull-up/pull-down networks
Isolated Resistor Networks	Electrically separated resistor elements	Analog signal conditioning circuits
Voltage Divider Arrays	Precisely matched resistor ratios	Sensor signal scaling in measurement systems
Termination Networks	High-precision impedance matching	High-speed data bus termination
Integrated EMI Filters	Combined resistive and capacitive elements	Noise suppression in communication interfaces

3. Structure and Composition

Typical construction features:

Ceramic substrate (Al O or AlN) for thermal stability
Thin-film or thick-film resistive elements (NiCr, TaN)
Termination pads with Ag/Pd or Sn/Pb metallization
Molded epoxy encapsulation (for discrete packages)
Standard packages: SIP, DIP, SOIC, TSSOP

4. Key Technical Parameters

Parameter	Significance
Resistance Range	0.1 to 10M (determines application suitability)
Power Rating	50mW to 1W per element (thermal management factor)
Tolerance	0.1% to 5% (precision level indicator)
TCR	25ppm/ C to 100ppm/ C (temperature stability)
Insulation Resistance	100M min (isolation performance)
Voltage Rating	50V to 200V (safety and breakdown protection)

5. Application Fields

Consumer Electronics: Smartphones (LCD biasing), IoT devices
Automotive: ECU sensor interfaces, LED lighting control
Industrial: PLC signal conditioning, precision instrumentation
Telecommunications: Transmission line termination, RF circuits
Aerospace: Avionics redundancy systems, navigation equipment

6. Leading Manufacturers and Products

Manufacturer	Key Products
Vishay Precision Group	CRCW-HP series (high-precision thin-film)
Panasonic Electronic Devices	EX-H series (automotive-grade networks)
TT Electronics	WSL series (low-TCR power arrays)
ROHM Semiconductor	MNR series (miniaturized resistor networks)
Yageo Corporation	RCN series (high-voltage termination arrays)

7. Selection Guidelines

Calculate required resistance values and tolerances
Determine power dissipation requirements per element
Assess temperature coefficient needs based on operating environment
Select package type compatible with PCB layout and assembly process
Consider EMI filtering requirements for high-frequency applications
Evaluate automotive/aerospace certification needs

Industry Trends Analysis

Current development directions include:

Miniaturization: 01005-inch footprint arrays for mobile devices
Increased integration: Embedded passives in SiP modules
Extended reliability: AEC-Q100 qualified parts for EV systems
High-precision manufacturing: Laser-trimmed thin-film technology
Environmental compliance: Halogen-free and RoHS-compliant packages