Arrays/Networks Resistors

Part Number	Description / PDF	Quantity
ACASA100225002P100 Vishay / Beyschlag	RES ARRAY 4 RES MULT OHM 1206	122
ACASA5002S5002P1AT Vishay / Beyschlag	RES ARRAY 4 RES 50K OHM 1206	1258
ACASA1002U1002P1AT Vishay / Beyschlag	ACAS 0612 10K U 10K AT P1	1071
ACASA100123001P100 Vishay / Beyschlag	RES ARRAY 4 RES MULT OHM 1206	0
ACASA4701E4701P100 Vishay / Beyschlag	RES ARRAY 4 RES 4.7K OHM 1206	2370
ACASA1002S3002P1AT Vishay / Beyschlag	RES ARRAY 4 RES MULT OHM 1206	0
ACASN2001E2001P1AT Vishay / Beyschlag	RES ARRAY 2 RES 2K OHM 0606	1879
ACASN5002E5002P1AT Vishay / Beyschlag	RES ARRAY 2 RES 50K OHM 0606	0
ACASN5002S5002P1AT Vishay / Beyschlag	RES ARRAY 2 RES 50K OHM 0606	368
ACASA1001S1002P100 Vishay / Beyschlag	RES ARRAY 4 RES MULT OHM 1206	1859
ACASA1000U1000P1AT Vishay / Beyschlag	ACAS 0612 100R U 100R AT P1	0
ACASA2002S2002P100 Vishay / Beyschlag	RES ARRAY 4 RES 20K OHM 1206	0
ACASN2002U2002P1AT Vishay / Beyschlag	ACAS 0606 20K U 20K AT P1	119
ACASA5002S5002P100 Vishay / Beyschlag	RES ARRAY 4 RES 50K OHM 1206	0
ACASN1002E1502P1AT Vishay / Beyschlag	RES ARRAY 2 RES MULT OHM 0606	0
ACASA1001E3001P1AT Vishay / Beyschlag	RES ARRAY 4 RES MULT OHM 1206	0
ACASA5002E5002P1AT Vishay / Beyschlag	RES ARRAY 4 RES 50K OHM 1206	0
ACASA1000E1000P100 Vishay / Beyschlag	RES ARRAY 4 RES 100 OHM 1206	3
ACASA1002E5002P1AT Vishay / Beyschlag	RES ARRAY 4 RES MULT OHM 1206	0
ACASA1002S2002P1AT Vishay / Beyschlag	RES ARRAY 4 RES MULT OHM 1206	980

Arrays/Networks Resistors

1. Overview

Resistor arrays/networks are integrated circuits containing multiple resistors in a single package. They provide precise resistance values and spatial efficiency in electronic systems. These components play a critical role in modern electronics by enabling voltage division, signal conditioning, and termination networks while reducing PCB footprint and assembly complexity.

2. Main Types and Functional Classification

Type	Functional Characteristics	Application Examples
Bussed Resistor Arrays	Common terminal connection for multiple resistors	Digital logic pull-up/pull-down networks
Isolated Resistor Networks	Electrically separated resistor elements	Analog signal conditioning circuits
Voltage Divider Arrays	Precisely matched resistor ratios	Sensor signal scaling in measurement systems
Termination Networks	High-precision impedance matching	High-speed data bus termination
Integrated EMI Filters	Combined resistive and capacitive elements	Noise suppression in communication interfaces

3. Structure and Composition

Typical construction features:

Ceramic substrate (Al O or AlN) for thermal stability
Thin-film or thick-film resistive elements (NiCr, TaN)
Termination pads with Ag/Pd or Sn/Pb metallization
Molded epoxy encapsulation (for discrete packages)
Standard packages: SIP, DIP, SOIC, TSSOP

4. Key Technical Parameters

Parameter	Significance
Resistance Range	0.1 to 10M (determines application suitability)
Power Rating	50mW to 1W per element (thermal management factor)
Tolerance	0.1% to 5% (precision level indicator)
TCR	25ppm/ C to 100ppm/ C (temperature stability)
Insulation Resistance	100M min (isolation performance)
Voltage Rating	50V to 200V (safety and breakdown protection)

5. Application Fields

Consumer Electronics: Smartphones (LCD biasing), IoT devices
Automotive: ECU sensor interfaces, LED lighting control
Industrial: PLC signal conditioning, precision instrumentation
Telecommunications: Transmission line termination, RF circuits
Aerospace: Avionics redundancy systems, navigation equipment

6. Leading Manufacturers and Products

Manufacturer	Key Products
Vishay Precision Group	CRCW-HP series (high-precision thin-film)
Panasonic Electronic Devices	EX-H series (automotive-grade networks)
TT Electronics	WSL series (low-TCR power arrays)
ROHM Semiconductor	MNR series (miniaturized resistor networks)
Yageo Corporation	RCN series (high-voltage termination arrays)

7. Selection Guidelines

Calculate required resistance values and tolerances
Determine power dissipation requirements per element
Assess temperature coefficient needs based on operating environment
Select package type compatible with PCB layout and assembly process
Consider EMI filtering requirements for high-frequency applications
Evaluate automotive/aerospace certification needs

Industry Trends Analysis

Current development directions include:

Miniaturization: 01005-inch footprint arrays for mobile devices
Increased integration: Embedded passives in SiP modules
Extended reliability: AEC-Q100 qualified parts for EV systems
High-precision manufacturing: Laser-trimmed thin-film technology
Environmental compliance: Halogen-free and RoHS-compliant packages