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Arrays/Networks Resistors

Image Part Number Description / PDF Quantity Rfq
RAVF328NJT47K0

RAVF328NJT47K0

Stackpole Electronics, Inc.

RES ARRAY 8 RES 47K OHM 1206

0
RAVF164DJT51R0

RAVF164DJT51R0

Stackpole Electronics, Inc.

RES ARRAY 4 RES 51 OHM 1206

4728
RAVF104DFT160R

RAVF104DFT160R

Stackpole Electronics, Inc.

RES ARRAY 4 RES 160 OHM 0804

0
RAVF104DJT220R

RAVF104DJT220R

Stackpole Electronics, Inc.

RES ARRAY 4 RES 220 OHM 0804

0
RAVF104DJT430K

RAVF104DJT430K

Stackpole Electronics, Inc.

RES ARRAY 4 RES 430K OHM 0804

0
RAVF164DFT510R

RAVF164DFT510R

Stackpole Electronics, Inc.

RES ARRAY 4 RES 510 OHM 1206

0
RAVF164DJT11R0

RAVF164DJT11R0

Stackpole Electronics, Inc.

RES ARRAY 4 RES 11 OHM 1206

0
RAVF164DJT4K70

RAVF164DJT4K70

Stackpole Electronics, Inc.

RES ARRAY 4 RES 4.7K OHM 1206

1398
RAVF104DJT3R30

RAVF104DJT3R30

Stackpole Electronics, Inc.

RES ARRAY 4 RES 3.3 OHM 0804

0
RAVF104DFT120R

RAVF104DFT120R

Stackpole Electronics, Inc.

RES ARRAY 4 RES 120 OHM 0804

0
RAVF104DJT7R50

RAVF104DJT7R50

Stackpole Electronics, Inc.

RES ARRAY 4 RES 7.5 OHM 0804

0
RAVS164DJT470R

RAVS164DJT470R

Stackpole Electronics, Inc.

RES ARRAY 4 RES 470 OHM 1206

0
RAVF104DJT20K0

RAVF104DJT20K0

Stackpole Electronics, Inc.

RES ARRAY 4 RES 20K OHM 0804

0
RAVF324DJT12K0

RAVF324DJT12K0

Stackpole Electronics, Inc.

RES ARRAY 4 RES 12K OHM 2012

0
RAVF104DFT39K0

RAVF104DFT39K0

Stackpole Electronics, Inc.

RES ARRAY 4 RES 39K OHM 0804

0
RAVF328NJT10K0

RAVF328NJT10K0

Stackpole Electronics, Inc.

RES ARRAY 8 RES 10K OHM 1206

0
RAVF104DFT270R

RAVF104DFT270R

Stackpole Electronics, Inc.

RES ARRAY 4 RES 270 OHM 0804

0
RAVF164DFT82R0

RAVF164DFT82R0

Stackpole Electronics, Inc.

RES ARRAY 4 RES 82 OHM 1206

0
RAVF104DFT1M00

RAVF104DFT1M00

Stackpole Electronics, Inc.

RES ARRAY 4 RES 1M OHM 0804

0
RAVF104DJT22K0

RAVF104DJT22K0

Stackpole Electronics, Inc.

RES ARRAY 4 RES 22K OHM 0804

0

Arrays/Networks Resistors

1. Overview

Resistor arrays/networks are integrated circuits containing multiple resistors in a single package. They provide precise resistance values and spatial efficiency in electronic systems. These components play a critical role in modern electronics by enabling voltage division, signal conditioning, and termination networks while reducing PCB footprint and assembly complexity.

2. Main Types and Functional Classification

TypeFunctional CharacteristicsApplication Examples
Bussed Resistor ArraysCommon terminal connection for multiple resistorsDigital logic pull-up/pull-down networks
Isolated Resistor NetworksElectrically separated resistor elementsAnalog signal conditioning circuits
Voltage Divider ArraysPrecisely matched resistor ratiosSensor signal scaling in measurement systems
Termination NetworksHigh-precision impedance matchingHigh-speed data bus termination
Integrated EMI FiltersCombined resistive and capacitive elementsNoise suppression in communication interfaces

3. Structure and Composition

Typical construction features:

  • Ceramic substrate (Al O or AlN) for thermal stability
  • Thin-film or thick-film resistive elements (NiCr, TaN)
  • Termination pads with Ag/Pd or Sn/Pb metallization
  • Molded epoxy encapsulation (for discrete packages)
  • Standard packages: SIP, DIP, SOIC, TSSOP

4. Key Technical Parameters

ParameterSignificance
Resistance Range0.1 to 10M (determines application suitability)
Power Rating50mW to 1W per element (thermal management factor)
Tolerance 0.1% to 5% (precision level indicator)
TCR 25ppm/ C to 100ppm/ C (temperature stability)
Insulation Resistance100M min (isolation performance)
Voltage Rating50V to 200V (safety and breakdown protection)

5. Application Fields

  • Consumer Electronics: Smartphones (LCD biasing), IoT devices
  • Automotive: ECU sensor interfaces, LED lighting control
  • Industrial: PLC signal conditioning, precision instrumentation
  • Telecommunications: Transmission line termination, RF circuits
  • Aerospace: Avionics redundancy systems, navigation equipment

6. Leading Manufacturers and Products

ManufacturerKey Products
Vishay Precision GroupCRCW-HP series (high-precision thin-film)
Panasonic Electronic DevicesEX-H series (automotive-grade networks)
TT ElectronicsWSL series (low-TCR power arrays)
ROHM SemiconductorMNR series (miniaturized resistor networks)
Yageo CorporationRCN series (high-voltage termination arrays)

7. Selection Guidelines

  1. Calculate required resistance values and tolerances
  2. Determine power dissipation requirements per element
  3. Assess temperature coefficient needs based on operating environment
  4. Select package type compatible with PCB layout and assembly process
  5. Consider EMI filtering requirements for high-frequency applications
  6. Evaluate automotive/aerospace certification needs

Industry Trends Analysis

Current development directions include:

  • Miniaturization: 01005-inch footprint arrays for mobile devices
  • Increased integration: Embedded passives in SiP modules
  • Extended reliability: AEC-Q100 qualified parts for EV systems
  • High-precision manufacturing: Laser-trimmed thin-film technology
  • Environmental compliance: Halogen-free and RoHS-compliant packages
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