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Arrays/Networks Resistors

Image Part Number Description / PDF Quantity Rfq
RAVF162DJT2K40

RAVF162DJT2K40

Stackpole Electronics, Inc.

RES ARRAY 2 RES 2.4K OHM 0606

0
RAVF104DJT1R50

RAVF104DJT1R50

Stackpole Electronics, Inc.

RES ARRAY 4 RES 1.5 OHM 0804

0
RAVF104DJT820R

RAVF104DJT820R

Stackpole Electronics, Inc.

RES ARRAY 4 RES 820 OHM 0804

0
RAVF104DJT560K

RAVF104DJT560K

Stackpole Electronics, Inc.

RES ARRAY 4 RES 560K OHM 0804

0
RAVF104DFT130K

RAVF104DFT130K

Stackpole Electronics, Inc.

RES ARRAY 4 RES 130K OHM 0804

0
RAVF104DJT33R0

RAVF104DJT33R0

Stackpole Electronics, Inc.

RES ARRAY 4 RES 33 OHM 0804

66973
RAVF104DFT390R

RAVF104DFT390R

Stackpole Electronics, Inc.

RES ARRAY 4 RES 390 OHM 0804

0
RAVF104DJT360R

RAVF104DJT360R

Stackpole Electronics, Inc.

RES ARRAY 4 RES 360 OHM 0804

0
RAVF104DJT82R0

RAVF104DJT82R0

Stackpole Electronics, Inc.

RES ARRAY 4 RES 82 OHM 0804

0
RAVF162DJT220K

RAVF162DJT220K

Stackpole Electronics, Inc.

RES ARRAY 2 RES 220K OHM 0606

0
RAVF328RJT470R

RAVF328RJT470R

Stackpole Electronics, Inc.

RES ARRAY 8 RES 470 OHM 1206

0
RAVF164DJT8R20

RAVF164DJT8R20

Stackpole Electronics, Inc.

RES ARRAY 4 RES 8.2 OHM 1206

0
RAVF164DFT82K0

RAVF164DFT82K0

Stackpole Electronics, Inc.

RES ARRAY 4 RES 82K OHM 1206

0
RAVF162DJT43R0

RAVF162DJT43R0

Stackpole Electronics, Inc.

RES ARRAY 2 RES 43 OHM 0606

0
RAVF324DJT100K

RAVF324DJT100K

Stackpole Electronics, Inc.

RES ARRAY 4 RES 100K OHM 2012

0
RAVF164DJT330R

RAVF164DJT330R

Stackpole Electronics, Inc.

RES ARRAY 4 RES 330 OHM 1206

0
RAVF102DJT39R0

RAVF102DJT39R0

Stackpole Electronics, Inc.

RES ARRAY 2 RES 39 OHM 0404

0
RAVF164DJT2K00

RAVF164DJT2K00

Stackpole Electronics, Inc.

RES ARRAY 4 RES 2K OHM 1206

0
RAVF164DJT6K20

RAVF164DJT6K20

Stackpole Electronics, Inc.

RES ARRAY 4 RES 6.2K OHM 1206

0
RAVF164DFT560K

RAVF164DFT560K

Stackpole Electronics, Inc.

RES ARRAY 4 RES 560K OHM 1206

0

Arrays/Networks Resistors

1. Overview

Resistor arrays/networks are integrated circuits containing multiple resistors in a single package. They provide precise resistance values and spatial efficiency in electronic systems. These components play a critical role in modern electronics by enabling voltage division, signal conditioning, and termination networks while reducing PCB footprint and assembly complexity.

2. Main Types and Functional Classification

TypeFunctional CharacteristicsApplication Examples
Bussed Resistor ArraysCommon terminal connection for multiple resistorsDigital logic pull-up/pull-down networks
Isolated Resistor NetworksElectrically separated resistor elementsAnalog signal conditioning circuits
Voltage Divider ArraysPrecisely matched resistor ratiosSensor signal scaling in measurement systems
Termination NetworksHigh-precision impedance matchingHigh-speed data bus termination
Integrated EMI FiltersCombined resistive and capacitive elementsNoise suppression in communication interfaces

3. Structure and Composition

Typical construction features:

  • Ceramic substrate (Al O or AlN) for thermal stability
  • Thin-film or thick-film resistive elements (NiCr, TaN)
  • Termination pads with Ag/Pd or Sn/Pb metallization
  • Molded epoxy encapsulation (for discrete packages)
  • Standard packages: SIP, DIP, SOIC, TSSOP

4. Key Technical Parameters

ParameterSignificance
Resistance Range0.1 to 10M (determines application suitability)
Power Rating50mW to 1W per element (thermal management factor)
Tolerance 0.1% to 5% (precision level indicator)
TCR 25ppm/ C to 100ppm/ C (temperature stability)
Insulation Resistance100M min (isolation performance)
Voltage Rating50V to 200V (safety and breakdown protection)

5. Application Fields

  • Consumer Electronics: Smartphones (LCD biasing), IoT devices
  • Automotive: ECU sensor interfaces, LED lighting control
  • Industrial: PLC signal conditioning, precision instrumentation
  • Telecommunications: Transmission line termination, RF circuits
  • Aerospace: Avionics redundancy systems, navigation equipment

6. Leading Manufacturers and Products

ManufacturerKey Products
Vishay Precision GroupCRCW-HP series (high-precision thin-film)
Panasonic Electronic DevicesEX-H series (automotive-grade networks)
TT ElectronicsWSL series (low-TCR power arrays)
ROHM SemiconductorMNR series (miniaturized resistor networks)
Yageo CorporationRCN series (high-voltage termination arrays)

7. Selection Guidelines

  1. Calculate required resistance values and tolerances
  2. Determine power dissipation requirements per element
  3. Assess temperature coefficient needs based on operating environment
  4. Select package type compatible with PCB layout and assembly process
  5. Consider EMI filtering requirements for high-frequency applications
  6. Evaluate automotive/aerospace certification needs

Industry Trends Analysis

Current development directions include:

  • Miniaturization: 01005-inch footprint arrays for mobile devices
  • Increased integration: Embedded passives in SiP modules
  • Extended reliability: AEC-Q100 qualified parts for EV systems
  • High-precision manufacturing: Laser-trimmed thin-film technology
  • Environmental compliance: Halogen-free and RoHS-compliant packages
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