Arrays/Networks Resistors

Image Part Number Description / PDF Quantity Rfq
RACF164DFT75R0

RACF164DFT75R0

Stackpole Electronics, Inc.

RES ARRAY 4 RES 75 OHM 1206

0

RACF648NJT3K30

RACF648NJT3K30

Stackpole Electronics, Inc.

RES ARRAY 8 RES 3.3K OHM 2512

0

RACF104DJT470R

RACF104DJT470R

Stackpole Electronics, Inc.

RES ARRAY 4 RES 470 OHM 0804

0

RACF104DJT220R

RACF104DJT220R

Stackpole Electronics, Inc.

RES ARRAY 4 RES 220 OHM 0804

0

RACF104DJT10K0

RACF104DJT10K0

Stackpole Electronics, Inc.

RES ARRAY 4 RES 10K OHM 0804

0

RACF104DJT33R0

RACF104DJT33R0

Stackpole Electronics, Inc.

RES ARRAY 4 RES 33 OHM 0804

0

RACF104DJT27K0

RACF104DJT27K0

Stackpole Electronics, Inc.

RES ARRAY 4 RES 27K OHM 0804

0

RACF104DJT82R0

RACF104DJT82R0

Stackpole Electronics, Inc.

RES ARRAY 4 RES 82 OHM 0804

0

RACF104DJT180R

RACF104DJT180R

Stackpole Electronics, Inc.

RES ARRAY 4 RES 180 OHM 0804

0

RACF104DJT120R

RACF104DJT120R

Stackpole Electronics, Inc.

RES ARRAY 4 RES 120 OHM 0804

0

RACF104DJT82K0

RACF104DJT82K0

Stackpole Electronics, Inc.

RES ARRAY 4 RES 82K OHM 0804

0

RACF104DJT100K

RACF104DJT100K

Stackpole Electronics, Inc.

RES ARRAY 4 RES 100K OHM 0804

0

RACF104DJT47K0

RACF104DJT47K0

Stackpole Electronics, Inc.

RES ARRAY 4 RES 47K OHM 0804

0

Arrays/Networks Resistors

1. Overview

Resistor arrays/networks are integrated circuits containing multiple resistors in a single package. They provide precise resistance values and spatial efficiency in electronic systems. These components play a critical role in modern electronics by enabling voltage division, signal conditioning, and termination networks while reducing PCB footprint and assembly complexity.

2. Main Types and Functional Classification

TypeFunctional CharacteristicsApplication Examples
Bussed Resistor ArraysCommon terminal connection for multiple resistorsDigital logic pull-up/pull-down networks
Isolated Resistor NetworksElectrically separated resistor elementsAnalog signal conditioning circuits
Voltage Divider ArraysPrecisely matched resistor ratiosSensor signal scaling in measurement systems
Termination NetworksHigh-precision impedance matchingHigh-speed data bus termination
Integrated EMI FiltersCombined resistive and capacitive elementsNoise suppression in communication interfaces

3. Structure and Composition

Typical construction features:

  • Ceramic substrate (Al O or AlN) for thermal stability
  • Thin-film or thick-film resistive elements (NiCr, TaN)
  • Termination pads with Ag/Pd or Sn/Pb metallization
  • Molded epoxy encapsulation (for discrete packages)
  • Standard packages: SIP, DIP, SOIC, TSSOP

4. Key Technical Parameters

ParameterSignificance
Resistance Range0.1 to 10M (determines application suitability)
Power Rating50mW to 1W per element (thermal management factor)
Tolerance 0.1% to 5% (precision level indicator)
TCR 25ppm/ C to 100ppm/ C (temperature stability)
Insulation Resistance100M min (isolation performance)
Voltage Rating50V to 200V (safety and breakdown protection)

5. Application Fields

  • Consumer Electronics: Smartphones (LCD biasing), IoT devices
  • Automotive: ECU sensor interfaces, LED lighting control
  • Industrial: PLC signal conditioning, precision instrumentation
  • Telecommunications: Transmission line termination, RF circuits
  • Aerospace: Avionics redundancy systems, navigation equipment

6. Leading Manufacturers and Products

ManufacturerKey Products
Vishay Precision GroupCRCW-HP series (high-precision thin-film)
Panasonic Electronic DevicesEX-H series (automotive-grade networks)
TT ElectronicsWSL series (low-TCR power arrays)
ROHM SemiconductorMNR series (miniaturized resistor networks)
Yageo CorporationRCN series (high-voltage termination arrays)

7. Selection Guidelines

  1. Calculate required resistance values and tolerances
  2. Determine power dissipation requirements per element
  3. Assess temperature coefficient needs based on operating environment
  4. Select package type compatible with PCB layout and assembly process
  5. Consider EMI filtering requirements for high-frequency applications
  6. Evaluate automotive/aerospace certification needs

Industry Trends Analysis

Current development directions include:

  • Miniaturization: 01005-inch footprint arrays for mobile devices
  • Increased integration: Embedded passives in SiP modules
  • Extended reliability: AEC-Q100 qualified parts for EV systems
  • High-precision manufacturing: Laser-trimmed thin-film technology
  • Environmental compliance: Halogen-free and RoHS-compliant packages
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