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Arrays/Networks Resistors

Image Part Number Description / PDF Quantity Rfq
RACF104DJT68K0

RACF104DJT68K0

Stackpole Electronics, Inc.

RES ARRAY 4 RES 68K OHM 0804

0
RACF104DJT56K0

RACF104DJT56K0

Stackpole Electronics, Inc.

RES ARRAY 4 RES 56K OHM 0804

0
RACF104DJT47R0

RACF104DJT47R0

Stackpole Electronics, Inc.

RES ARRAY 4 RES 47 OHM 0804

0
RACF648NJT470R

RACF648NJT470R

Stackpole Electronics, Inc.

RES ARRAY 8 RES 470 OHM 2512

0
RACF164DFT15K0

RACF164DFT15K0

Stackpole Electronics, Inc.

RES ARRAY 4 RES 15K OHM 1206

40000
RACF104DJT15R0

RACF104DJT15R0

Stackpole Electronics, Inc.

RES ARRAY 4 RES 15 OHM 0804

0
RACF104DJT18K0

RACF104DJT18K0

Stackpole Electronics, Inc.

RES ARRAY 4 RES 18K OHM 0804

0
RACF104DJT270R

RACF104DJT270R

Stackpole Electronics, Inc.

RES ARRAY 4 RES 270 OHM 0804

0
RACF104DJT12R0

RACF104DJT12R0

Stackpole Electronics, Inc.

RES ARRAY 4 RES 12 OHM 0804

0
RACF104DJT680R

RACF104DJT680R

Stackpole Electronics, Inc.

RES ARRAY 4 RES 680 OHM 0804

0
RACF104DJT22K0

RACF104DJT22K0

Stackpole Electronics, Inc.

RES ARRAY 4 RES 22K OHM 0804

0
RACF104DJT100R

RACF104DJT100R

Stackpole Electronics, Inc.

RES ARRAY 4 RES 100 OHM 0804

0
RACF104DJT10R0

RACF104DJT10R0

Stackpole Electronics, Inc.

RES ARRAY 4 RES 10 OHM 0804

0
RACF104DJT22R0

RACF104DJT22R0

Stackpole Electronics, Inc.

RES ARRAY 4 RES 22 OHM 0804

0
RACF104DJT33K0

RACF104DJT33K0

Stackpole Electronics, Inc.

RES ARRAY 4 RES 33K OHM 0804

0
RACF324DFT1K00

RACF324DFT1K00

Stackpole Electronics, Inc.

RES ARRAY 4 RES 1K OHM 2010

0
RACF104DJT39K0

RACF104DJT39K0

Stackpole Electronics, Inc.

RES ARRAY 4 RES 39K OHM 0804

0
RACF164DFT470K

RACF164DFT470K

Stackpole Electronics, Inc.

RES ARRAY 4 RES 470K OHM 1206

0
RACF104DJT390R

RACF104DJT390R

Stackpole Electronics, Inc.

RES ARRAY 4 RES 390 OHM 0804

0
RACF104DJT15K0

RACF104DJT15K0

Stackpole Electronics, Inc.

RES ARRAY 4 RES 15K OHM 0804

0

Arrays/Networks Resistors

1. Overview

Resistor arrays/networks are integrated circuits containing multiple resistors in a single package. They provide precise resistance values and spatial efficiency in electronic systems. These components play a critical role in modern electronics by enabling voltage division, signal conditioning, and termination networks while reducing PCB footprint and assembly complexity.

2. Main Types and Functional Classification

TypeFunctional CharacteristicsApplication Examples
Bussed Resistor ArraysCommon terminal connection for multiple resistorsDigital logic pull-up/pull-down networks
Isolated Resistor NetworksElectrically separated resistor elementsAnalog signal conditioning circuits
Voltage Divider ArraysPrecisely matched resistor ratiosSensor signal scaling in measurement systems
Termination NetworksHigh-precision impedance matchingHigh-speed data bus termination
Integrated EMI FiltersCombined resistive and capacitive elementsNoise suppression in communication interfaces

3. Structure and Composition

Typical construction features:

  • Ceramic substrate (Al O or AlN) for thermal stability
  • Thin-film or thick-film resistive elements (NiCr, TaN)
  • Termination pads with Ag/Pd or Sn/Pb metallization
  • Molded epoxy encapsulation (for discrete packages)
  • Standard packages: SIP, DIP, SOIC, TSSOP

4. Key Technical Parameters

ParameterSignificance
Resistance Range0.1 to 10M (determines application suitability)
Power Rating50mW to 1W per element (thermal management factor)
Tolerance 0.1% to 5% (precision level indicator)
TCR 25ppm/ C to 100ppm/ C (temperature stability)
Insulation Resistance100M min (isolation performance)
Voltage Rating50V to 200V (safety and breakdown protection)

5. Application Fields

  • Consumer Electronics: Smartphones (LCD biasing), IoT devices
  • Automotive: ECU sensor interfaces, LED lighting control
  • Industrial: PLC signal conditioning, precision instrumentation
  • Telecommunications: Transmission line termination, RF circuits
  • Aerospace: Avionics redundancy systems, navigation equipment

6. Leading Manufacturers and Products

ManufacturerKey Products
Vishay Precision GroupCRCW-HP series (high-precision thin-film)
Panasonic Electronic DevicesEX-H series (automotive-grade networks)
TT ElectronicsWSL series (low-TCR power arrays)
ROHM SemiconductorMNR series (miniaturized resistor networks)
Yageo CorporationRCN series (high-voltage termination arrays)

7. Selection Guidelines

  1. Calculate required resistance values and tolerances
  2. Determine power dissipation requirements per element
  3. Assess temperature coefficient needs based on operating environment
  4. Select package type compatible with PCB layout and assembly process
  5. Consider EMI filtering requirements for high-frequency applications
  6. Evaluate automotive/aerospace certification needs

Industry Trends Analysis

Current development directions include:

  • Miniaturization: 01005-inch footprint arrays for mobile devices
  • Increased integration: Embedded passives in SiP modules
  • Extended reliability: AEC-Q100 qualified parts for EV systems
  • High-precision manufacturing: Laser-trimmed thin-film technology
  • Environmental compliance: Halogen-free and RoHS-compliant packages
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