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Arrays/Networks Resistors

Image Part Number Description / PDF Quantity Rfq
RAVF104DFT270K

RAVF104DFT270K

Stackpole Electronics, Inc.

RES ARRAY 4 RES 270K OHM 0804

0
RAVF104DJT3R90

RAVF104DJT3R90

Stackpole Electronics, Inc.

RES ARRAY 4 RES 3.9 OHM 0804

0
RAVF162DJT3K00

RAVF162DJT3K00

Stackpole Electronics, Inc.

RES ARRAY 2 RES 3K OHM 0606

0
RAVF168DJT33R0

RAVF168DJT33R0

Stackpole Electronics, Inc.

RES ARRAY 8 RES 33 OHM 1506

0
RAVF164DFT2K40

RAVF164DFT2K40

Stackpole Electronics, Inc.

RES ARRAY 4 RES 2.4K OHM 1206

0
RAVF102DJT33R0

RAVF102DJT33R0

Stackpole Electronics, Inc.

RES ARRAY 2 RES 33 OHM 0404

10000
RAVF164DFT56K0

RAVF164DFT56K0

Stackpole Electronics, Inc.

RES ARRAY 4 RES 56K OHM 1206

0
RAVF104DJT1R00

RAVF104DJT1R00

Stackpole Electronics, Inc.

RES ARRAY 4 RES 1 OHM 0804

0
RAVF164DFT51R0

RAVF164DFT51R0

Stackpole Electronics, Inc.

RES ARRAY 4 RES 51 OHM 1206

0
RAVF104DJT27R0

RAVF104DJT27R0

Stackpole Electronics, Inc.

RES ARRAY 4 RES 27 OHM 0804

170000
RAVF104DFT300K

RAVF104DFT300K

Stackpole Electronics, Inc.

RES ARRAY 4 RES 300K OHM 0804

0
RAVF164DFT4K70

RAVF164DFT4K70

Stackpole Electronics, Inc.

RES ARRAY 4 RES 4.7K OHM 1206

0
RAVF164DFT750R

RAVF164DFT750R

Stackpole Electronics, Inc.

RES ARRAY 4 RES 750 OHM 1206

0
RACF164DJT220R

RACF164DJT220R

Stackpole Electronics, Inc.

RES ARRAY 4 RES 220 OHM 1206

0
RAVF164DJT75K0

RAVF164DJT75K0

Stackpole Electronics, Inc.

RES ARRAY 4 RES 75K OHM 1206

0
RAVF324DJT47K0

RAVF324DJT47K0

Stackpole Electronics, Inc.

RES ARRAY 4 RES 47K OHM 2012

0
RAVF162DJT100K

RAVF162DJT100K

Stackpole Electronics, Inc.

RES ARRAY 2 RES 100K OHM 0606

0
RAVF102DJT3R00

RAVF102DJT3R00

Stackpole Electronics, Inc.

RES ARRAY 2 RES 3 OHM 0404

0
RAVF164DFT47K0

RAVF164DFT47K0

Stackpole Electronics, Inc.

RES ARRAY 4 RES 47K OHM 1206

0
RAVF164DJT2K40

RAVF164DJT2K40

Stackpole Electronics, Inc.

RES ARRAY 4 RES 2.4K OHM 1206

0

Arrays/Networks Resistors

1. Overview

Resistor arrays/networks are integrated circuits containing multiple resistors in a single package. They provide precise resistance values and spatial efficiency in electronic systems. These components play a critical role in modern electronics by enabling voltage division, signal conditioning, and termination networks while reducing PCB footprint and assembly complexity.

2. Main Types and Functional Classification

TypeFunctional CharacteristicsApplication Examples
Bussed Resistor ArraysCommon terminal connection for multiple resistorsDigital logic pull-up/pull-down networks
Isolated Resistor NetworksElectrically separated resistor elementsAnalog signal conditioning circuits
Voltage Divider ArraysPrecisely matched resistor ratiosSensor signal scaling in measurement systems
Termination NetworksHigh-precision impedance matchingHigh-speed data bus termination
Integrated EMI FiltersCombined resistive and capacitive elementsNoise suppression in communication interfaces

3. Structure and Composition

Typical construction features:

  • Ceramic substrate (Al O or AlN) for thermal stability
  • Thin-film or thick-film resistive elements (NiCr, TaN)
  • Termination pads with Ag/Pd or Sn/Pb metallization
  • Molded epoxy encapsulation (for discrete packages)
  • Standard packages: SIP, DIP, SOIC, TSSOP

4. Key Technical Parameters

ParameterSignificance
Resistance Range0.1 to 10M (determines application suitability)
Power Rating50mW to 1W per element (thermal management factor)
Tolerance 0.1% to 5% (precision level indicator)
TCR 25ppm/ C to 100ppm/ C (temperature stability)
Insulation Resistance100M min (isolation performance)
Voltage Rating50V to 200V (safety and breakdown protection)

5. Application Fields

  • Consumer Electronics: Smartphones (LCD biasing), IoT devices
  • Automotive: ECU sensor interfaces, LED lighting control
  • Industrial: PLC signal conditioning, precision instrumentation
  • Telecommunications: Transmission line termination, RF circuits
  • Aerospace: Avionics redundancy systems, navigation equipment

6. Leading Manufacturers and Products

ManufacturerKey Products
Vishay Precision GroupCRCW-HP series (high-precision thin-film)
Panasonic Electronic DevicesEX-H series (automotive-grade networks)
TT ElectronicsWSL series (low-TCR power arrays)
ROHM SemiconductorMNR series (miniaturized resistor networks)
Yageo CorporationRCN series (high-voltage termination arrays)

7. Selection Guidelines

  1. Calculate required resistance values and tolerances
  2. Determine power dissipation requirements per element
  3. Assess temperature coefficient needs based on operating environment
  4. Select package type compatible with PCB layout and assembly process
  5. Consider EMI filtering requirements for high-frequency applications
  6. Evaluate automotive/aerospace certification needs

Industry Trends Analysis

Current development directions include:

  • Miniaturization: 01005-inch footprint arrays for mobile devices
  • Increased integration: Embedded passives in SiP modules
  • Extended reliability: AEC-Q100 qualified parts for EV systems
  • High-precision manufacturing: Laser-trimmed thin-film technology
  • Environmental compliance: Halogen-free and RoHS-compliant packages
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