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Arrays/Networks Resistors

Image Part Number Description / PDF Quantity Rfq
RAVF104DJT2K70

RAVF104DJT2K70

Stackpole Electronics, Inc.

RES ARRAY 4 RES 2.7K OHM 0804

0
RAVF164DFT27R0

RAVF164DFT27R0

Stackpole Electronics, Inc.

RES ARRAY 4 RES 27 OHM 1206

0
RAVF164DFT110R

RAVF164DFT110R

Stackpole Electronics, Inc.

RES ARRAY 4 RES 110 OHM 1206

0
RAVF104DFT330R

RAVF104DFT330R

Stackpole Electronics, Inc.

RES ARRAY 4 RES 330 OHM 0804

0
RAVF168DJT1M00

RAVF168DJT1M00

Stackpole Electronics, Inc.

RES ARRAY 8 RES 1M OHM 1506

0
RAVF164DJT160K

RAVF164DJT160K

Stackpole Electronics, Inc.

RES ARRAY 4 RES 160K OHM 1206

0
RAVF164DJT82R0

RAVF164DJT82R0

Stackpole Electronics, Inc.

RES ARRAY 4 RES 82 OHM 1206

0
RAVF104DFT91R0

RAVF104DFT91R0

Stackpole Electronics, Inc.

RES ARRAY 4 RES 91 OHM 0804

0
RAVF104DFT1K80

RAVF104DFT1K80

Stackpole Electronics, Inc.

RES ARRAY 4 RES 1.8K OHM 0804

0
RAVF324DJT470K

RAVF324DJT470K

Stackpole Electronics, Inc.

RES ARRAY 4 RES 470K OHM 2012

0
RAVF102DJT270R

RAVF102DJT270R

Stackpole Electronics, Inc.

RES ARRAY 2 RES 270 OHM 0404

0
RAVF162DJT470R

RAVF162DJT470R

Stackpole Electronics, Inc.

RES ARRAY 2 RES 470 OHM 0606

0
RAVF104DJT1R30

RAVF104DJT1R30

Stackpole Electronics, Inc.

RES ARRAY 4 RES 1.3 OHM 0804

0
RAVF164DJT100R

RAVF164DJT100R

Stackpole Electronics, Inc.

RES ARRAY 4 RES 100 OHM 1206

2992
RAVF164DJT1K60

RAVF164DJT1K60

Stackpole Electronics, Inc.

RES ARRAY 4 RES 1.6K OHM 1206

0
RAVF104DFT8K20

RAVF104DFT8K20

Stackpole Electronics, Inc.

RES ARRAY 4 RES 8.2K OHM 0804

0
RAVF164DJT2R20

RAVF164DJT2R20

Stackpole Electronics, Inc.

RES ARRAY 4 RES 2.2 OHM 1206

0
RAVF164DFT390R

RAVF164DFT390R

Stackpole Electronics, Inc.

RES ARRAY 4 RES 390 OHM 1206

0
RAVF104DJT15R0

RAVF104DJT15R0

Stackpole Electronics, Inc.

RES ARRAY 4 RES 15 OHM 0804

0
RAVF164DJT51K0

RAVF164DJT51K0

Stackpole Electronics, Inc.

RES ARRAY 4 RES 51K OHM 1206

0

Arrays/Networks Resistors

1. Overview

Resistor arrays/networks are integrated circuits containing multiple resistors in a single package. They provide precise resistance values and spatial efficiency in electronic systems. These components play a critical role in modern electronics by enabling voltage division, signal conditioning, and termination networks while reducing PCB footprint and assembly complexity.

2. Main Types and Functional Classification

TypeFunctional CharacteristicsApplication Examples
Bussed Resistor ArraysCommon terminal connection for multiple resistorsDigital logic pull-up/pull-down networks
Isolated Resistor NetworksElectrically separated resistor elementsAnalog signal conditioning circuits
Voltage Divider ArraysPrecisely matched resistor ratiosSensor signal scaling in measurement systems
Termination NetworksHigh-precision impedance matchingHigh-speed data bus termination
Integrated EMI FiltersCombined resistive and capacitive elementsNoise suppression in communication interfaces

3. Structure and Composition

Typical construction features:

  • Ceramic substrate (Al O or AlN) for thermal stability
  • Thin-film or thick-film resistive elements (NiCr, TaN)
  • Termination pads with Ag/Pd or Sn/Pb metallization
  • Molded epoxy encapsulation (for discrete packages)
  • Standard packages: SIP, DIP, SOIC, TSSOP

4. Key Technical Parameters

ParameterSignificance
Resistance Range0.1 to 10M (determines application suitability)
Power Rating50mW to 1W per element (thermal management factor)
Tolerance 0.1% to 5% (precision level indicator)
TCR 25ppm/ C to 100ppm/ C (temperature stability)
Insulation Resistance100M min (isolation performance)
Voltage Rating50V to 200V (safety and breakdown protection)

5. Application Fields

  • Consumer Electronics: Smartphones (LCD biasing), IoT devices
  • Automotive: ECU sensor interfaces, LED lighting control
  • Industrial: PLC signal conditioning, precision instrumentation
  • Telecommunications: Transmission line termination, RF circuits
  • Aerospace: Avionics redundancy systems, navigation equipment

6. Leading Manufacturers and Products

ManufacturerKey Products
Vishay Precision GroupCRCW-HP series (high-precision thin-film)
Panasonic Electronic DevicesEX-H series (automotive-grade networks)
TT ElectronicsWSL series (low-TCR power arrays)
ROHM SemiconductorMNR series (miniaturized resistor networks)
Yageo CorporationRCN series (high-voltage termination arrays)

7. Selection Guidelines

  1. Calculate required resistance values and tolerances
  2. Determine power dissipation requirements per element
  3. Assess temperature coefficient needs based on operating environment
  4. Select package type compatible with PCB layout and assembly process
  5. Consider EMI filtering requirements for high-frequency applications
  6. Evaluate automotive/aerospace certification needs

Industry Trends Analysis

Current development directions include:

  • Miniaturization: 01005-inch footprint arrays for mobile devices
  • Increased integration: Embedded passives in SiP modules
  • Extended reliability: AEC-Q100 qualified parts for EV systems
  • High-precision manufacturing: Laser-trimmed thin-film technology
  • Environmental compliance: Halogen-free and RoHS-compliant packages
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