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Arrays/Networks Resistors

Image Part Number Description / PDF Quantity Rfq
RAVF164DJT910K

RAVF164DJT910K

Stackpole Electronics, Inc.

RES ARRAY 4 RES 910K OHM 1206

0
RAVF102DJT470R

RAVF102DJT470R

Stackpole Electronics, Inc.

RES ARRAY 2 RES 470 OHM 0404

0
RAVF328NJT4K70

RAVF328NJT4K70

Stackpole Electronics, Inc.

RES ARRAY 8 RES 4.7K OHM 1206

0
RAVF164DFT270K

RAVF164DFT270K

Stackpole Electronics, Inc.

RES ARRAY 4 RES 270K OHM 1206

0
RAVF164DFT49K9

RAVF164DFT49K9

Stackpole Electronics, Inc.

RES ARRAY 4 RES 49.9K OHM 1206

0
RAVF104DJT51R0

RAVF104DJT51R0

Stackpole Electronics, Inc.

RES ARRAY 4 RES 51 OHM 0804

2238
RAVF164DJT360R

RAVF164DJT360R

Stackpole Electronics, Inc.

RES ARRAY 4 RES 360 OHM 1206

0
RAVF164DJT20R0

RAVF164DJT20R0

Stackpole Electronics, Inc.

RES ARRAY 4 RES 20 OHM 1206

0
RAVF104DFT110K

RAVF104DFT110K

Stackpole Electronics, Inc.

RES ARRAY 4 RES 110K OHM 0804

0
RAVF168DJT22R0

RAVF168DJT22R0

Stackpole Electronics, Inc.

RES ARRAY 8 RES 22 OHM 1506

0
RACF164DFT10K0

RACF164DFT10K0

Stackpole Electronics, Inc.

RES ARRAY 4 RES 10K OHM 1206

0
RAVF164DJT430R

RAVF164DJT430R

Stackpole Electronics, Inc.

RES ARRAY 4 RES 430 OHM 1206

0
RAVF168DFT100R

RAVF168DFT100R

Stackpole Electronics, Inc.

RES ARRAY 8 RES 100 OHM 1506

0
RAVF104DJT24K0

RAVF104DJT24K0

Stackpole Electronics, Inc.

RES ARRAY 4 RES 24K OHM 0804

0
RAVF102DJT27R0

RAVF102DJT27R0

Stackpole Electronics, Inc.

RES ARRAY 2 RES 27 OHM 0404

0
RAVF104DJT4K70

RAVF104DJT4K70

Stackpole Electronics, Inc.

RES ARRAY 4 RES 4.7K OHM 0804

531
RAVF102DJT43R0

RAVF102DJT43R0

Stackpole Electronics, Inc.

RES ARRAY 2 RES 43 OHM 0404

0
RAVF164DJT43K0

RAVF164DJT43K0

Stackpole Electronics, Inc.

RES ARRAY 4 RES 43K OHM 1206

0
RAVF102DJT27K0

RAVF102DJT27K0

Stackpole Electronics, Inc.

RES ARRAY 2 RES 27K OHM 0404

0
RAVF324DJT470R

RAVF324DJT470R

Stackpole Electronics, Inc.

RES ARRAY 4 RES 470 OHM 2012

0

Arrays/Networks Resistors

1. Overview

Resistor arrays/networks are integrated circuits containing multiple resistors in a single package. They provide precise resistance values and spatial efficiency in electronic systems. These components play a critical role in modern electronics by enabling voltage division, signal conditioning, and termination networks while reducing PCB footprint and assembly complexity.

2. Main Types and Functional Classification

TypeFunctional CharacteristicsApplication Examples
Bussed Resistor ArraysCommon terminal connection for multiple resistorsDigital logic pull-up/pull-down networks
Isolated Resistor NetworksElectrically separated resistor elementsAnalog signal conditioning circuits
Voltage Divider ArraysPrecisely matched resistor ratiosSensor signal scaling in measurement systems
Termination NetworksHigh-precision impedance matchingHigh-speed data bus termination
Integrated EMI FiltersCombined resistive and capacitive elementsNoise suppression in communication interfaces

3. Structure and Composition

Typical construction features:

  • Ceramic substrate (Al O or AlN) for thermal stability
  • Thin-film or thick-film resistive elements (NiCr, TaN)
  • Termination pads with Ag/Pd or Sn/Pb metallization
  • Molded epoxy encapsulation (for discrete packages)
  • Standard packages: SIP, DIP, SOIC, TSSOP

4. Key Technical Parameters

ParameterSignificance
Resistance Range0.1 to 10M (determines application suitability)
Power Rating50mW to 1W per element (thermal management factor)
Tolerance 0.1% to 5% (precision level indicator)
TCR 25ppm/ C to 100ppm/ C (temperature stability)
Insulation Resistance100M min (isolation performance)
Voltage Rating50V to 200V (safety and breakdown protection)

5. Application Fields

  • Consumer Electronics: Smartphones (LCD biasing), IoT devices
  • Automotive: ECU sensor interfaces, LED lighting control
  • Industrial: PLC signal conditioning, precision instrumentation
  • Telecommunications: Transmission line termination, RF circuits
  • Aerospace: Avionics redundancy systems, navigation equipment

6. Leading Manufacturers and Products

ManufacturerKey Products
Vishay Precision GroupCRCW-HP series (high-precision thin-film)
Panasonic Electronic DevicesEX-H series (automotive-grade networks)
TT ElectronicsWSL series (low-TCR power arrays)
ROHM SemiconductorMNR series (miniaturized resistor networks)
Yageo CorporationRCN series (high-voltage termination arrays)

7. Selection Guidelines

  1. Calculate required resistance values and tolerances
  2. Determine power dissipation requirements per element
  3. Assess temperature coefficient needs based on operating environment
  4. Select package type compatible with PCB layout and assembly process
  5. Consider EMI filtering requirements for high-frequency applications
  6. Evaluate automotive/aerospace certification needs

Industry Trends Analysis

Current development directions include:

  • Miniaturization: 01005-inch footprint arrays for mobile devices
  • Increased integration: Embedded passives in SiP modules
  • Extended reliability: AEC-Q100 qualified parts for EV systems
  • High-precision manufacturing: Laser-trimmed thin-film technology
  • Environmental compliance: Halogen-free and RoHS-compliant packages
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