Solderless Breadboards

Part Number	Description / PDF	Quantity
PB-242T Global Specialties	BREADBOARD ASSEMBLY 6.89X9.06"	2
EXP-355 Global Specialties	BREADBRD TERM STRIP 4.12X2.31"	111
EXP-350E Global Specialties	BREADBRD TERM STRIP 3.25X1.75"	76
GS-060 Global Specialties	BREADBRD DISTI STRIP 4X0.69" 2PC	123
PB-105T Global Specialties	TRNSPRNT PROTO-BRD 4880 TIE PNT	8
GS-100 Global Specialties	BUS STRIP 100 TIE-POINTS	43
GS-090 Global Specialties	BREADBRD DIST STRP 6.5X0.69" 2PC	42
PB-60 Global Specialties	BREADBOARD ASSEMBLY 6.57X6.06"	13
UBS-100 Global Specialties	BREADBRD TERM STRIP 6.50X2.13"	0
GS-590 Global Specialties	BREADBRD TERM STRIP 6.50X1.38"	52
PB-103M Global Specialties	BREADBOARD ASSEMBLY 9.06X6.89"	151
PB-104M Global Specialties	BREADBOARD ASSEMBLY 9.45X8.27"	0
GS-830 Global Specialties	BREADBRD TERM STRIP 6.50X2.13"	795
QT-59B Global Specialties	BREADBRD DISTI STRIP 6.50X0.36"	0
PB-104E Global Specialties	BREADBOARD ASSEMBLY 8.27X9.45"	0
PB-103E Global Specialties	BREADBOARD ASSEMBLY 6.89X9.06"	0
QT-47S Global Specialties	BREADBRD TERM STRIP 5.30X1.32"	0
PB-101T Global Specialties	EXT PWRD BREADBOARD 1360 TIE PNT	0
PB-104 Global Specialties	EXT PWRD BRDBRD 3060 TIE-POINTS	0
PB-70E Global Specialties	BREADBOARD ASSEMBLY 5.12X8.46"	0

Solderless Breadboards

1. Overview

Solderless breadboards are reusable electronic prototyping tools that enable rapid circuit assembly without requiring soldering. They utilize spring-loaded contacts to temporarily connect components, offering a cost-effective platform for testing and development. These boards are essential in modern electronics engineering, education, and DIY projects due to their flexibility, reusability, and ease of use.

2. Major Types & Functional Classification

Type	Functional Characteristics	Application Examples
Half-Size Breadboard	400-600 tie points, single power rail	Basic electronics education, small-scale prototyping
Full-Size Breadboard	800+ tie points, dual power rails	Complex circuit development, embedded system testing
Mini Breadboard	170-300 tie points, compact design	Portable projects, sensor integration
Modular Breadboard	Connectable units with bus expansion	Scalable IoT device prototyping
Stackable Breadboard	Vertical expansion capability	Multilayer system development

3. Structure & Composition

Typical construction features:

ABS plastic base with 0.1" grid spacing
Phosphor bronze contacts with gold plating
Embedded bus strips (typically 2x5 rows)
Component retention springs (28-32 AWG compatibility)
Polarized power distribution rails
Anti-static surface treatment

4. Key Technical Specifications

Parameter	Typical Value	Significance
Contact Resistance	<1	Ensures signal integrity
Current Capacity	1-5A per node	Determines power handling
Voltage Range	0-30V DC	Defines operational safety
Insertion Force	50-150gF	Affects component durability
Terminal Durability	10,000+ insertions	Dictates product lifespan
Temperature Range	-20 C to +70 C	Environmental stability

5. Application Domains

Primary industries and typical equipment:

Education: Student lab kits, STEM training platforms
Industrial R&D: Sensor network prototyping, control system development
Consumer Electronics: Wearable device testing, IoT gateway development
Robotics: Motor driver testing, sensor fusion prototyping
Research: Analog/digital circuit validation, failure analysis

6. Leading Manufacturers & Products

Manufacturer	Key Product Series	Technical Highlights
Elegoo	EL-140088	830-point full-size board with dual power rails
SparkFun	DEV-12002	Stackable design with 630 tie points
Fritzing	MB102-01	Surface-mount compatible bus system
Bud Industries	431 Series	Industrial-grade contacts with EMI shielding

7. Selection Recommendations

Key considerations:

Project complexity vs. node count requirement
Power distribution needs (single/dual rails)
Component compatibility (through-hole/SMD)
Environmental factors (temperature/humidity)
Expansion requirements (modular connectivity)
Budget constraints vs. durability specifications

8. Industry Trends Analysis

Current development directions include:

Miniaturization with high-density interconnects
Integration of built-in measurement circuits
Smart breadboards with IoT connectivity
Eco-friendly materials with RoHS compliance
Improved contact systems for high-frequency applications
Standardization of modular expansion interfaces

Market growth driven by increasing demand in educational robotics, rapid prototyping services, and decentralized development environments.