Solderless Breadboards

Part Number	Description / PDF	Quantity
EXP-300E Global Specialties	BREADBRD TERM STRIP 6.50X1.75"	23
GS-100T Global Specialties	BREADBRD DISTI STRIP 6.50X0.69"	16
GS-630 Global Specialties	BREADBRD TERM STRIP 6.50X1.38"	104
GS-830T Global Specialties	BREADBRD TERM STRIP 6.50X2.13"	45
PB-101M Global Specialties	BREADBOARD ASSEMBLY 8.46X3.94"	5
GS-630T Global Specialties	BREADBRD TERM STRIP 6.50X1.38"	0
GS-470 Global Specialties	BREADBRD TERM STRIP 5.25X1.38"	39
PB-105M Global Specialties	BREADBOARD ASSEMBLY 12.01X9.45"	16
PB-83E Global Specialties	EXT PWRD BREADBOARD 830 TIE-PNT	26
PB-204 Global Specialties	POWERED BREADBOARD	16
PB-5 Global Specialties	BREADBOARD RPLC FOR PB-507	0
GS-351 Global Specialties	BREADBRD TERM STRIP 4.00X1.38"	74
GS-080 Global Specialties	BREADBRD DIST STRP 5.25X0.69 2PC	93
PB-10 Global Specialties	EXT PWRD BREADBOARD 840 TIE-PNT	8
PB-70M Global Specialties	BREADBOARD ASSEMBLY 8.46X5.12"	51
PB-83M Global Specialties	BREADBOARD ASSEMBLY 7.20X3.74"	18
GS-400 Global Specialties	BREADBRD TERM STRIP 3.30X1.40"	1305
PB-203A Global Specialties	POWERED BREADBOARD	24
PB-326T Global Specialties	TRNSPRNT PROTO-BRD 3260 TIE PNT	5
PRO-S-LAB Global Specialties	BREADBOARD ASSEMBLY 6.89X3.94"	0

Solderless Breadboards

1. Overview

Solderless breadboards are reusable electronic prototyping tools that enable rapid circuit assembly without requiring soldering. They utilize spring-loaded contacts to temporarily connect components, offering a cost-effective platform for testing and development. These boards are essential in modern electronics engineering, education, and DIY projects due to their flexibility, reusability, and ease of use.

2. Major Types & Functional Classification

Type	Functional Characteristics	Application Examples
Half-Size Breadboard	400-600 tie points, single power rail	Basic electronics education, small-scale prototyping
Full-Size Breadboard	800+ tie points, dual power rails	Complex circuit development, embedded system testing
Mini Breadboard	170-300 tie points, compact design	Portable projects, sensor integration
Modular Breadboard	Connectable units with bus expansion	Scalable IoT device prototyping
Stackable Breadboard	Vertical expansion capability	Multilayer system development

3. Structure & Composition

Typical construction features:

ABS plastic base with 0.1" grid spacing
Phosphor bronze contacts with gold plating
Embedded bus strips (typically 2x5 rows)
Component retention springs (28-32 AWG compatibility)
Polarized power distribution rails
Anti-static surface treatment

4. Key Technical Specifications

Parameter	Typical Value	Significance
Contact Resistance	<1	Ensures signal integrity
Current Capacity	1-5A per node	Determines power handling
Voltage Range	0-30V DC	Defines operational safety
Insertion Force	50-150gF	Affects component durability
Terminal Durability	10,000+ insertions	Dictates product lifespan
Temperature Range	-20 C to +70 C	Environmental stability

5. Application Domains

Primary industries and typical equipment:

Education: Student lab kits, STEM training platforms
Industrial R&D: Sensor network prototyping, control system development
Consumer Electronics: Wearable device testing, IoT gateway development
Robotics: Motor driver testing, sensor fusion prototyping
Research: Analog/digital circuit validation, failure analysis

6. Leading Manufacturers & Products

Manufacturer	Key Product Series	Technical Highlights
Elegoo	EL-140088	830-point full-size board with dual power rails
SparkFun	DEV-12002	Stackable design with 630 tie points
Fritzing	MB102-01	Surface-mount compatible bus system
Bud Industries	431 Series	Industrial-grade contacts with EMI shielding

7. Selection Recommendations

Key considerations:

Project complexity vs. node count requirement
Power distribution needs (single/dual rails)
Component compatibility (through-hole/SMD)
Environmental factors (temperature/humidity)
Expansion requirements (modular connectivity)
Budget constraints vs. durability specifications

8. Industry Trends Analysis

Current development directions include:

Miniaturization with high-density interconnects
Integration of built-in measurement circuits
Smart breadboards with IoT connectivity
Eco-friendly materials with RoHS compliance
Improved contact systems for high-frequency applications
Standardization of modular expansion interfaces

Market growth driven by increasing demand in educational robotics, rapid prototyping services, and decentralized development environments.