LEDs - Circuit Board Indicators, Arrays, Light Bars, Bar Graphs

Image Part Number Description / PDF Quantity Rfq
LTA-1000HR-07J

LTA-1000HR-07J

Lite-On, Inc.

LED LIGHT BAR ARRAY

0

LTA-35201M

LTA-35201M

Lite-On, Inc.

LED LIGHT BAR ARRAY

0

LTL-4286NHBP

LTL-4286NHBP

Lite-On, Inc.

LED CBI 3MM AMBER AMBER

0

LTL-1CHM6H115R

LTL-1CHM6H115R

Lite-On, Inc.

LED CBI 3MM 1X5 AMBER GREEN DIFF

0

LTL-42M1NMHKP

LTL-42M1NMHKP

Lite-On, Inc.

LED CBI 3MM 3-LEVEL Y,G,G

0

LTL-1CHM2H115R

LTL-1CHM2H115R

Lite-On, Inc.

LED CBI 3MM 1X5 GREEN GREEN DIFF

0

LTL-42M6NH39C

LTL-42M6NH39C

Lite-On, Inc.

LED CBI 3MM 3-LEVEL G,G,R

0

LTL-533-11P2

LTL-533-11P2

Lite-On, Inc.

LED 5MM GREEN GRN DIFF TH

0

LTA-12101M

LTA-12101M

Lite-On, Inc.

LED LIGHT BAR ARRAY

0

LTA-1000P

LTA-1000P

Lite-On, Inc.

LED LIGHT BAR RECT 1X10 RED

0

LTL-2658YG-1

LTL-2658YG-1

Lite-On, Inc.

LED LAMP THRU-HOLE

0

LTL-42MKNH51

LTL-42MKNH51

Lite-On, Inc.

LED CBI 3MM 4-LEVEL

0

LTL-42MQNHKP

LTL-42MQNHKP

Lite-On, Inc.

LED CBI 3MM 3-LEVEL A,R,G

0

LTL-1BEDJH131

LTL-1BEDJH131

Lite-On, Inc.

LED CBI 3MM YLW/GRN WHT DIFF

0

LTL1CHTBK3H130-002

LTL1CHTBK3H130-002

Lite-On, Inc.

LED CBI 3MM BLUE

0

LTL-2400Y-DL

LTL-2400Y-DL

Lite-On, Inc.

LED LAMP THRU-HOLE

0

LTL-30EJ9NNH48

LTL-30EJ9NNH48

Lite-On, Inc.

LED 5MM YELLOW/GREEN TH

0

LTL-42M3NHKP

LTL-42M3NHKP

Lite-On, Inc.

LED CBI 3MM 3-LEVEL GGG

0

LTL-42M2NH51P

LTL-42M2NH51P

Lite-On, Inc.

LED CBI 3MM 4-LEVEL GREEN/YELLOW

0

LTL-816EE

LTL-816EE

Lite-On, Inc.

LED 3.2MM RED TRANSP TH

0

LEDs - Circuit Board Indicators, Arrays, Light Bars, Bar Graphs

1. Overview

Light Emitting Diodes (LEDs) are semiconductor devices that convert electrical energy into light through electroluminescence. This product category includes indicators, arrays, light bars, and bar graphs designed for circuit board integration. LEDs serve critical roles in modern electronics for status indication, data visualization, and illumination. Their advantages include low power consumption, long lifespan, and compact form factors.

2. Main Types and Functional Classification

TypeFunctional FeaturesApplication Examples
IndicatorsSingle/dual-color point-source lighting for status indicationPower switches, network routers, medical device panels
ArraysMatrix configurations for alphanumeric/symbol displaySeven-segment displays, dot matrix modules
Light BarsLinear arrangements for directional lighting/brightness zonesAudio level meters, industrial control panels
Bar GraphsSegmented columns for quantitative visual representationBattery level indicators, sensor data visualization

3. Structure and Components

Typical LED components include:

  • Die: Gallium Nitride (GaN) or Indium Gallium Aluminum Phosphide (InGaAlP) semiconductor chips
  • Substrate: FR4 or metal-core PCB for thermal management
  • Encapsulation: Epoxy resin with diffused/optical lens structures
  • Driver Circuitry: Current-limiting resistors or PWM control ICs

4. Key Technical Specifications

ParameterDescriptionImportance
Luminous Intensity0.1-100 cd/m rangeDetermines visibility in various lighting conditions
Wavelength400-700 nm (visible spectrum)Defines color output accuracy
Forward Current2-30 mA typicalImpacts brightness and longevity
Viewing Angle5-120 depending on lens designDictates light distribution pattern
MTBF50,000-100,000 hoursSystem reliability prediction

5. Application Fields

Key industries include:

  • Consumer Electronics: Smartphones, laptops, home appliances
  • Industrial Automation: PLC status indicators, HMI panels
  • Automotive: Dashboard lighting, warning indicators
  • Medical Equipment: Diagnostic status visualization

6. Leading Manufacturers and Products

ManufacturerProduct SeriesKey Features
CreeXLamp XRHigh-brightness automotive indicators
OSRAMLED LineProgrammable RGB light bars
NichiaNSPWR70CSSUltra-compact bar graph displays
EverlightDLW-5xxxWaterproof array modules

7. Selection Recommendations

Key considerations:

  • Environmental Conditions: Temperature (-40 to +85 C operational range)
  • Optical Requirements: Color consistency (CIE 1931 standard)
  • Electrical Compatibility: Driver circuit matching
  • Form Factor: 0402-5050 package size constraints
  • Cost Optimization: Trade-off between performance and budget

Industry Trend Analysis

Current trends show:

  • Micronization: Development of 0201 package formats
  • Smart Integration: Embedded ICs for addressable lighting
  • Energy Efficiency: Sub-1mA operational current devices
  • Automotive Growth: HUD and LiDAR indicator applications
  • Medical Advancements: UV/IR spectrum specialized indicators

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