LEDs - Circuit Board Indicators, Arrays, Light Bars, Bar Graphs

Image Part Number Description / PDF Quantity Rfq
LTL-2800G

LTL-2800G

Lite-On, Inc.

LED LIGHT BAR RECT 1X2 GREEN

0

LTL-42M1NHDP1

LTL-42M1NHDP1

Lite-On, Inc.

LED CBI 3MM 2-LVL GREEN

0

LTL-42M7NMHLP

LTL-42M7NMHLP

Lite-On, Inc.

LED CBI 3MM 4-LEVEL X 2

0

LTL-42M5NMHLP

LTL-42M5NMHLP

Lite-On, Inc.

LED CBI 3MM 4-LEVEL X 2

0

LTL-14CDJNH79

LTL-14CDJNH79

Lite-On, Inc.

LED CBI 3MM 1X4-LEVEL YLW/GREEN

0

LTL-42MJNH51

LTL-42MJNH51

Lite-On, Inc.

LED CBI 3MM 4-LEVEL YW/GN

0

LTL-42M1NH71

LTL-42M1NH71

Lite-On, Inc.

LED CBI 3MM 4X2 YELLOW/GREEN

0

LTL-42M2NH71

LTL-42M2NH71

Lite-On, Inc.

LED CBI 3MM 2X4LVL Y,G

0

LTL-42M7NHKP

LTL-42M7NHKP

Lite-On, Inc.

LED CBI 3MM 3-LVL G,G,Y

0

LTA-1801M

LTA-1801M

Lite-On, Inc.

LED LIGHT BAR ARRAY

0

LTA-4301E

LTA-4301E

Lite-On, Inc.

LED LIGHT BAR ARRAY

0

LTL-10233WHC

LTL-10233WHC

Lite-On, Inc.

LED CBI 5MM GREEN GRN DIFF TH

0

LTL-555-14

LTL-555-14

Lite-On, Inc.

LED 5MM 1LVL X4 YELLOW TH

0

LTL-633-1

LTL-633-1

Lite-On, Inc.

LED WITH SPACER 5MM GRN

0

LTA-15B01M-02

LTA-15B01M-02

Lite-On, Inc.

LED LIGHT BAR ARRAY

0

LTL-2450Y-DL

LTL-2450Y-DL

Lite-On, Inc.

LED LAMP THRU-HOLE

0

LTL-4272NH63P

LTL-4272NH63P

Lite-On, Inc.

LED CBI 3MM AMB-YLW AMBER TRANSP

0

LTL-1CHG18C

LTL-1CHG18C

Lite-On, Inc.

LED CBI 3MM WITH SPACER GRN

0

LTL-42M7NH51P

LTL-42M7NH51P

Lite-On, Inc.

LED CBI 3MM 4-LEVEL GRN

0

LTA-AB02M-01

LTA-AB02M-01

Lite-On, Inc.

LED LIGHT BAR ARRAY

0

LEDs - Circuit Board Indicators, Arrays, Light Bars, Bar Graphs

1. Overview

Light Emitting Diodes (LEDs) are semiconductor devices that convert electrical energy into light through electroluminescence. This product category includes indicators, arrays, light bars, and bar graphs designed for circuit board integration. LEDs serve critical roles in modern electronics for status indication, data visualization, and illumination. Their advantages include low power consumption, long lifespan, and compact form factors.

2. Main Types and Functional Classification

TypeFunctional FeaturesApplication Examples
IndicatorsSingle/dual-color point-source lighting for status indicationPower switches, network routers, medical device panels
ArraysMatrix configurations for alphanumeric/symbol displaySeven-segment displays, dot matrix modules
Light BarsLinear arrangements for directional lighting/brightness zonesAudio level meters, industrial control panels
Bar GraphsSegmented columns for quantitative visual representationBattery level indicators, sensor data visualization

3. Structure and Components

Typical LED components include:

  • Die: Gallium Nitride (GaN) or Indium Gallium Aluminum Phosphide (InGaAlP) semiconductor chips
  • Substrate: FR4 or metal-core PCB for thermal management
  • Encapsulation: Epoxy resin with diffused/optical lens structures
  • Driver Circuitry: Current-limiting resistors or PWM control ICs

4. Key Technical Specifications

ParameterDescriptionImportance
Luminous Intensity0.1-100 cd/m rangeDetermines visibility in various lighting conditions
Wavelength400-700 nm (visible spectrum)Defines color output accuracy
Forward Current2-30 mA typicalImpacts brightness and longevity
Viewing Angle5-120 depending on lens designDictates light distribution pattern
MTBF50,000-100,000 hoursSystem reliability prediction

5. Application Fields

Key industries include:

  • Consumer Electronics: Smartphones, laptops, home appliances
  • Industrial Automation: PLC status indicators, HMI panels
  • Automotive: Dashboard lighting, warning indicators
  • Medical Equipment: Diagnostic status visualization

6. Leading Manufacturers and Products

ManufacturerProduct SeriesKey Features
CreeXLamp XRHigh-brightness automotive indicators
OSRAMLED LineProgrammable RGB light bars
NichiaNSPWR70CSSUltra-compact bar graph displays
EverlightDLW-5xxxWaterproof array modules

7. Selection Recommendations

Key considerations:

  • Environmental Conditions: Temperature (-40 to +85 C operational range)
  • Optical Requirements: Color consistency (CIE 1931 standard)
  • Electrical Compatibility: Driver circuit matching
  • Form Factor: 0402-5050 package size constraints
  • Cost Optimization: Trade-off between performance and budget

Industry Trend Analysis

Current trends show:

  • Micronization: Development of 0201 package formats
  • Smart Integration: Embedded ICs for addressable lighting
  • Energy Efficiency: Sub-1mA operational current devices
  • Automotive Growth: HUD and LiDAR indicator applications
  • Medical Advancements: UV/IR spectrum specialized indicators

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