LEDs - Circuit Board Indicators, Arrays, Light Bars, Bar Graphs

Image Part Number Description / PDF Quantity Rfq
5530122010F

5530122010F

Dialight

LED CBI 3MM BI-LVL GREEN/GREEN

0

5962326002F

5962326002F

Dialight

596 PRISM SMD 1.6MM BILEVEL RND

0

5553007F

5553007F

Dialight

LED 2MM 5V VERTICAL RED PC MNT

103

5530132300F

5530132300F

Dialight

LED CBI 3MM BI-LVL YELLOW/GREEN

253

5912101007F

5912101007F

Dialight

LED PRISM 3MM RND ALGAAS RED SMD

1496

5710123100F

5710123100F

Dialight

LED CBI 2MM BI-LEVEL GN,YW DIFF

0

5530112200F

5530112200F

Dialight

LED CBI 3MM BI-LVL RED/GREEN

1095

5513407F

5513407F

Dialight

LED 3MM CBI RT ANGLE O/G

111

5912301107F

5912301107F

Dialight

LED PRISM 3MM SQ GREEN SMD

2772

5555403F

5555403F

Dialight

LED CBI 2MM YLW 5V RES QUAD TH

0

5912404107F

5912404107F

Dialight

LED PRISM 3MM RND LC SQ YLW SMD

0

5912201002F

5912201002F

Dialight

LED PRISM 3MM RND HI INT GRN SMD

74

5615701100F

5615701100F

Dialight

LED 5MM VERT SUP CLEAR YEL PCMNT

0

5553303F

5553303F

Dialight

LED 2MM 5V VERTICAL GREEN PC MNT

962

5611301060F

5611301060F

Dialight

LED 5MM VERT LOW CUR GRN PC MNT

0

5512509F

5512509F

Dialight

LED 3MM RTANG HI EFF ORANGE PCMT

1965

5555007F

5555007F

Dialight

LED CBI 2MM RED 5V RES QUAD TH

0

5513102F

5513102F

Dialight

LED CBI 3MM YLW/GRN DIFF RA

0

5961818002F

5961818002F

Dialight

596 PRISM SMD 1.6MM BILEVEL RND

0

5912701107F

5912701107F

Dialight

LED PRISM 3MM SQ ALLINGAP YW SMD

0

LEDs - Circuit Board Indicators, Arrays, Light Bars, Bar Graphs

1. Overview

Light Emitting Diodes (LEDs) are semiconductor devices that convert electrical energy into light through electroluminescence. This product category includes indicators, arrays, light bars, and bar graphs designed for circuit board integration. LEDs serve critical roles in modern electronics for status indication, data visualization, and illumination. Their advantages include low power consumption, long lifespan, and compact form factors.

2. Main Types and Functional Classification

TypeFunctional FeaturesApplication Examples
IndicatorsSingle/dual-color point-source lighting for status indicationPower switches, network routers, medical device panels
ArraysMatrix configurations for alphanumeric/symbol displaySeven-segment displays, dot matrix modules
Light BarsLinear arrangements for directional lighting/brightness zonesAudio level meters, industrial control panels
Bar GraphsSegmented columns for quantitative visual representationBattery level indicators, sensor data visualization

3. Structure and Components

Typical LED components include:

  • Die: Gallium Nitride (GaN) or Indium Gallium Aluminum Phosphide (InGaAlP) semiconductor chips
  • Substrate: FR4 or metal-core PCB for thermal management
  • Encapsulation: Epoxy resin with diffused/optical lens structures
  • Driver Circuitry: Current-limiting resistors or PWM control ICs

4. Key Technical Specifications

ParameterDescriptionImportance
Luminous Intensity0.1-100 cd/m rangeDetermines visibility in various lighting conditions
Wavelength400-700 nm (visible spectrum)Defines color output accuracy
Forward Current2-30 mA typicalImpacts brightness and longevity
Viewing Angle5-120 depending on lens designDictates light distribution pattern
MTBF50,000-100,000 hoursSystem reliability prediction

5. Application Fields

Key industries include:

  • Consumer Electronics: Smartphones, laptops, home appliances
  • Industrial Automation: PLC status indicators, HMI panels
  • Automotive: Dashboard lighting, warning indicators
  • Medical Equipment: Diagnostic status visualization

6. Leading Manufacturers and Products

ManufacturerProduct SeriesKey Features
CreeXLamp XRHigh-brightness automotive indicators
OSRAMLED LineProgrammable RGB light bars
NichiaNSPWR70CSSUltra-compact bar graph displays
EverlightDLW-5xxxWaterproof array modules

7. Selection Recommendations

Key considerations:

  • Environmental Conditions: Temperature (-40 to +85 C operational range)
  • Optical Requirements: Color consistency (CIE 1931 standard)
  • Electrical Compatibility: Driver circuit matching
  • Form Factor: 0402-5050 package size constraints
  • Cost Optimization: Trade-off between performance and budget

Industry Trend Analysis

Current trends show:

  • Micronization: Development of 0201 package formats
  • Smart Integration: Embedded ICs for addressable lighting
  • Energy Efficiency: Sub-1mA operational current devices
  • Automotive Growth: HUD and LiDAR indicator applications
  • Medical Advancements: UV/IR spectrum specialized indicators

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