LEDs - Circuit Board Indicators, Arrays, Light Bars, Bar Graphs

Image Part Number Description / PDF Quantity Rfq
5680731830F

5680731830F

Dialight

LED 3MM QUAD CBI R/G RVSE POL

0

5615101100F

5615101100F

Dialight

LED 5MM VERT SUP DIFF RED PC MNT

1596

5510301F

5510301F

Dialight

LED CBI 3MM DIN YLW DIFF RA SGL

0

5912901102F

5912901102F

Dialight

LED SMD PRISM 3MM TRUE GREEN SQ

0

5912501002F

5912501002F

Dialight

LED SMD PRISM ORANGE RND LENS

0

5530744100F

5530744100F

Dialight

LED CBI 3MM BI-LVL BKLT Y/G Y/G

0

5923031313F

5923031313F

Dialight

LED CBI PRISM BLVL RG/YG TR SIL

415

5615601100F

5615601100F

Dialight

LED 5MM VERT SUP CLEAR GRN PCMNT

0

5912404002F

5912404002F

Dialight

LED PRISM 3MM RND LC YLW SMD

0

5912901113F

5912901113F

Dialight

LED SMD PRISM 3MM TRUE GREEN SQ

0

5510207F

5510207F

Dialight

LED 3MM HIGH EFF GREEN

12673

5510603F

5510603F

Dialight

LED CBI 3MM GREEN DIFF 5V .250

0

5913001013F

5913001013F

Dialight

LED PRISM 3MM RA SUP RED/GRN SMT

12571

5000036F

5000036F

Dialight

DEMO BOX 598 MICROLED

0

5923535302F

5923535302F

Dialight

LED CBI PRISM BLVL RGB/RGB SIL

2

5913101013F

5913101013F

Dialight

LED PRISM 3MM RT ANG YEL/GRN SMT

0

5680102323F

5680102323F

Dialight

LED 4HI 3MM GRN/YEL/GRN/YEL PCMT

365

5500407F

5500407F

Dialight

LED 5MM RT ANGLE RED PC MNT

3491

5511702F

5511702F

Dialight

LED CBI 3MM HI EFF RED TINTED RA

3700

5530121F

5530121F

Dialight

LED 2HI 3MM GREEN OVER RED PCMNT

8415

LEDs - Circuit Board Indicators, Arrays, Light Bars, Bar Graphs

1. Overview

Light Emitting Diodes (LEDs) are semiconductor devices that convert electrical energy into light through electroluminescence. This product category includes indicators, arrays, light bars, and bar graphs designed for circuit board integration. LEDs serve critical roles in modern electronics for status indication, data visualization, and illumination. Their advantages include low power consumption, long lifespan, and compact form factors.

2. Main Types and Functional Classification

TypeFunctional FeaturesApplication Examples
IndicatorsSingle/dual-color point-source lighting for status indicationPower switches, network routers, medical device panels
ArraysMatrix configurations for alphanumeric/symbol displaySeven-segment displays, dot matrix modules
Light BarsLinear arrangements for directional lighting/brightness zonesAudio level meters, industrial control panels
Bar GraphsSegmented columns for quantitative visual representationBattery level indicators, sensor data visualization

3. Structure and Components

Typical LED components include:

  • Die: Gallium Nitride (GaN) or Indium Gallium Aluminum Phosphide (InGaAlP) semiconductor chips
  • Substrate: FR4 or metal-core PCB for thermal management
  • Encapsulation: Epoxy resin with diffused/optical lens structures
  • Driver Circuitry: Current-limiting resistors or PWM control ICs

4. Key Technical Specifications

ParameterDescriptionImportance
Luminous Intensity0.1-100 cd/m rangeDetermines visibility in various lighting conditions
Wavelength400-700 nm (visible spectrum)Defines color output accuracy
Forward Current2-30 mA typicalImpacts brightness and longevity
Viewing Angle5-120 depending on lens designDictates light distribution pattern
MTBF50,000-100,000 hoursSystem reliability prediction

5. Application Fields

Key industries include:

  • Consumer Electronics: Smartphones, laptops, home appliances
  • Industrial Automation: PLC status indicators, HMI panels
  • Automotive: Dashboard lighting, warning indicators
  • Medical Equipment: Diagnostic status visualization

6. Leading Manufacturers and Products

ManufacturerProduct SeriesKey Features
CreeXLamp XRHigh-brightness automotive indicators
OSRAMLED LineProgrammable RGB light bars
NichiaNSPWR70CSSUltra-compact bar graph displays
EverlightDLW-5xxxWaterproof array modules

7. Selection Recommendations

Key considerations:

  • Environmental Conditions: Temperature (-40 to +85 C operational range)
  • Optical Requirements: Color consistency (CIE 1931 standard)
  • Electrical Compatibility: Driver circuit matching
  • Form Factor: 0402-5050 package size constraints
  • Cost Optimization: Trade-off between performance and budget

Industry Trend Analysis

Current trends show:

  • Micronization: Development of 0201 package formats
  • Smart Integration: Embedded ICs for addressable lighting
  • Energy Efficiency: Sub-1mA operational current devices
  • Automotive Growth: HUD and LiDAR indicator applications
  • Medical Advancements: UV/IR spectrum specialized indicators

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