LEDs - Circuit Board Indicators, Arrays, Light Bars, Bar Graphs

Image Part Number Description / PDF Quantity Rfq
5710111F

5710111F

Dialight

LED 2MM BI-LEVEL RED/RED DIFF

4099

5501104F

5501104F

Dialight

LED 5MM VERT LOW CUR RED PCMNT

34

5511109F

5511109F

Dialight

LED 3MM RT ANG LOW CUR RED PCMNT

4100

5913101107SF

5913101107SF

Dialight

LED PRISM 3MM SQ YW,GN SILIC SMD

0

5680701111F

5680701111F

Dialight

LED 4HI 3MM RED/GREEN BICLR PCMT

1474

5511307F

5511307F

Dialight

LED 3MM LOW CURR GREEN

4180

5530123F

5530123F

Dialight

LED 2HI 3MM GREEN OVER YEL PC MN

2241

5513508801F

5513508801F

Dialight

LED CBI 3MM RED/GRN DIFF RA

6025

5912801113F

5912801113F

Dialight

LED 3MM PRISM WHITE SMD

0

5640100222F

5640100222F

Dialight

LED 3HI 3MM GREEN PC MNT

2230

5520833F

5520833F

Dialight

LED 2HI 5MM SUP BRIGHT YEL PCMNT

0

5640100209F

5640100209F

Dialight

LED CBI 3MM 3X1 GRN/BLANK/BLUE

0

5612301070F

5612301070F

Dialight

LED 5MM VERT HE DIFF YLW PC MNT

0

5530201200F

5530201200F

Dialight

LED CBI 3MM BI-LVL BLANK/RED

0

5700100322F

5700100322F

Dialight

LED CBI 2MM 3X1 YLW,GRN,GRN DIFF

0

5680731111F

5680731111F

Dialight

LED 4HIGH GRN/RED BICLR 3MM

0

5530008813F

5530008813F

Dialight

LED CBI 3MM R,Y,R,Y,R,Y,R,Y RA

0

5510409808F

5510409808F

Dialight

LED 3MM CBI R/A R RV POL.125

0

5513011F

5513011F

Dialight

LED CBI 3MM RED/GRN BICOLOR RA

0

5640700101F

5640700101F

Dialight

LED CBI 3MM 3X1 R/G,BLANK,R/G

11

LEDs - Circuit Board Indicators, Arrays, Light Bars, Bar Graphs

1. Overview

Light Emitting Diodes (LEDs) are semiconductor devices that convert electrical energy into light through electroluminescence. This product category includes indicators, arrays, light bars, and bar graphs designed for circuit board integration. LEDs serve critical roles in modern electronics for status indication, data visualization, and illumination. Their advantages include low power consumption, long lifespan, and compact form factors.

2. Main Types and Functional Classification

TypeFunctional FeaturesApplication Examples
IndicatorsSingle/dual-color point-source lighting for status indicationPower switches, network routers, medical device panels
ArraysMatrix configurations for alphanumeric/symbol displaySeven-segment displays, dot matrix modules
Light BarsLinear arrangements for directional lighting/brightness zonesAudio level meters, industrial control panels
Bar GraphsSegmented columns for quantitative visual representationBattery level indicators, sensor data visualization

3. Structure and Components

Typical LED components include:

  • Die: Gallium Nitride (GaN) or Indium Gallium Aluminum Phosphide (InGaAlP) semiconductor chips
  • Substrate: FR4 or metal-core PCB for thermal management
  • Encapsulation: Epoxy resin with diffused/optical lens structures
  • Driver Circuitry: Current-limiting resistors or PWM control ICs

4. Key Technical Specifications

ParameterDescriptionImportance
Luminous Intensity0.1-100 cd/m rangeDetermines visibility in various lighting conditions
Wavelength400-700 nm (visible spectrum)Defines color output accuracy
Forward Current2-30 mA typicalImpacts brightness and longevity
Viewing Angle5-120 depending on lens designDictates light distribution pattern
MTBF50,000-100,000 hoursSystem reliability prediction

5. Application Fields

Key industries include:

  • Consumer Electronics: Smartphones, laptops, home appliances
  • Industrial Automation: PLC status indicators, HMI panels
  • Automotive: Dashboard lighting, warning indicators
  • Medical Equipment: Diagnostic status visualization

6. Leading Manufacturers and Products

ManufacturerProduct SeriesKey Features
CreeXLamp XRHigh-brightness automotive indicators
OSRAMLED LineProgrammable RGB light bars
NichiaNSPWR70CSSUltra-compact bar graph displays
EverlightDLW-5xxxWaterproof array modules

7. Selection Recommendations

Key considerations:

  • Environmental Conditions: Temperature (-40 to +85 C operational range)
  • Optical Requirements: Color consistency (CIE 1931 standard)
  • Electrical Compatibility: Driver circuit matching
  • Form Factor: 0402-5050 package size constraints
  • Cost Optimization: Trade-off between performance and budget

Industry Trend Analysis

Current trends show:

  • Micronization: Development of 0201 package formats
  • Smart Integration: Embedded ICs for addressable lighting
  • Energy Efficiency: Sub-1mA operational current devices
  • Automotive Growth: HUD and LiDAR indicator applications
  • Medical Advancements: UV/IR spectrum specialized indicators

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