LEDs - Circuit Board Indicators, Arrays, Light Bars, Bar Graphs

Image Part Number Description / PDF Quantity Rfq
5511502809F

5511502809F

Dialight

LED CBI 3MM HI EFF GRN TINTED RA

0

5952101007F

5952101007F

Dialight

LED PRISM 2MM RA ALGAAS RED SMT

1572

5615201050F

5615201050F

Dialight

LED 5MM VERT SUP DIFF GRN PC MNT

356

5510409F

5510409F

Dialight

LED 3MM RT ANG HI EFF RED PC MNT

2785

5530122004F

5530122004F

Dialight

LED CBI 3MM BI-LVL GREEN/GREEN

311

5680704838F

5680704838F

Dialight

LED CBI 3MM QUAD LEVEL

0

5500304F

5500304F

Dialight

LED 5MM VERTICAL YELLOW PC MNT

304

5502505F

5502505F

Dialight

LED 5MM RTANG HI EFF ORANGE PCMT

0

5510807F

5510807F

Dialight

LED 3MM R/A HI-EFF BLUE DIFF

251

5532223100F

5532223100F

Dialight

LED CBI 3MM BI-LVL GREEN/YELLOW

0

5502404F

5502404F

Dialight

LED 5MM VERT HI EFF RED PC MNT

2800

5912701848F

5912701848F

Dialight

LED SMD PRISM 3MM 590NM YLW

0

5511209F

5511209F

Dialight

LED 3MM RT ANG LOW CUR YEL PCMNT

8133

5532232100F

5532232100F

Dialight

LED CBI 3MM BI-LVL YLW/GRN TINT

531

5690101111F

5690101111F

Dialight

LED 2X2 3MM HI DENSITY RED PCMNT

908

5502507F

5502507F

Dialight

LED 5MM RTANG HI EFF ORANGE PCMT

660

5923030302F

5923030302F

Dialight

LED CBI PRISM BLVL RG/RG SIL

238

5912504113F

5912504113F

Dialight

LED PRISM 3MM RND LC SQ ORN SMD

0

5510411F

5510411F

Dialight

LED CBI 3MM HI EFF RED .201

1755

5912304002F

5912304002F

Dialight

LED PRISM 3MM RND LC GRN SMD

0

LEDs - Circuit Board Indicators, Arrays, Light Bars, Bar Graphs

1. Overview

Light Emitting Diodes (LEDs) are semiconductor devices that convert electrical energy into light through electroluminescence. This product category includes indicators, arrays, light bars, and bar graphs designed for circuit board integration. LEDs serve critical roles in modern electronics for status indication, data visualization, and illumination. Their advantages include low power consumption, long lifespan, and compact form factors.

2. Main Types and Functional Classification

TypeFunctional FeaturesApplication Examples
IndicatorsSingle/dual-color point-source lighting for status indicationPower switches, network routers, medical device panels
ArraysMatrix configurations for alphanumeric/symbol displaySeven-segment displays, dot matrix modules
Light BarsLinear arrangements for directional lighting/brightness zonesAudio level meters, industrial control panels
Bar GraphsSegmented columns for quantitative visual representationBattery level indicators, sensor data visualization

3. Structure and Components

Typical LED components include:

  • Die: Gallium Nitride (GaN) or Indium Gallium Aluminum Phosphide (InGaAlP) semiconductor chips
  • Substrate: FR4 or metal-core PCB for thermal management
  • Encapsulation: Epoxy resin with diffused/optical lens structures
  • Driver Circuitry: Current-limiting resistors or PWM control ICs

4. Key Technical Specifications

ParameterDescriptionImportance
Luminous Intensity0.1-100 cd/m rangeDetermines visibility in various lighting conditions
Wavelength400-700 nm (visible spectrum)Defines color output accuracy
Forward Current2-30 mA typicalImpacts brightness and longevity
Viewing Angle5-120 depending on lens designDictates light distribution pattern
MTBF50,000-100,000 hoursSystem reliability prediction

5. Application Fields

Key industries include:

  • Consumer Electronics: Smartphones, laptops, home appliances
  • Industrial Automation: PLC status indicators, HMI panels
  • Automotive: Dashboard lighting, warning indicators
  • Medical Equipment: Diagnostic status visualization

6. Leading Manufacturers and Products

ManufacturerProduct SeriesKey Features
CreeXLamp XRHigh-brightness automotive indicators
OSRAMLED LineProgrammable RGB light bars
NichiaNSPWR70CSSUltra-compact bar graph displays
EverlightDLW-5xxxWaterproof array modules

7. Selection Recommendations

Key considerations:

  • Environmental Conditions: Temperature (-40 to +85 C operational range)
  • Optical Requirements: Color consistency (CIE 1931 standard)
  • Electrical Compatibility: Driver circuit matching
  • Form Factor: 0402-5050 package size constraints
  • Cost Optimization: Trade-off between performance and budget

Industry Trend Analysis

Current trends show:

  • Micronization: Development of 0201 package formats
  • Smart Integration: Embedded ICs for addressable lighting
  • Energy Efficiency: Sub-1mA operational current devices
  • Automotive Growth: HUD and LiDAR indicator applications
  • Medical Advancements: UV/IR spectrum specialized indicators

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