LEDs - Circuit Board Indicators, Arrays, Light Bars, Bar Graphs

Image Part Number Description / PDF Quantity Rfq
XEUR30D

XEUR30D

SunLED

LIGHTBAR 6.8X19.9MM RED RED DIFF

0

5913101113SF

5913101113SF

Dialight

LED PRISM 3MM SQ YW,GN SILIC SMD

0

5530004810F

5530004810F

Dialight

LED CBI 3MM MULTI-LEVEL

0

5552008F

5552008F

Dialight

LED 2MM 24V RT ANGLE RED PCMNT

780

LTL-523-11

LTL-523-11

Lite-On, Inc.

LED 5MM HI EFF RED TH

5000

5500405F

5500405F

Dialight

LED 5MM RT ANGLE RED PC MNT

8244

XVB1LUG147D

XVB1LUG147D

SunLED

LED 3MM GREEN DIFFUSED RA CBI

0

H178CRD

H178CRD

Califia Lighting (Bivar)

LED RED 655NM R/A PC MOUNT

140

5923030313F

5923030313F

Dialight

BI-LEVEL R/G-R/G 13" REEL SIL

21

5352T3-5VLC

5352T3-5VLC

Visual Communications Company, LLC

LED AMBER T-3/4 RT ANG 5V PCB

954

5640200111F

5640200111F

Dialight

LED 3HI 3MM LOW CUR RED PC MNT

7564500

HLMP-1503-C00A2

HLMP-1503-C00A2

Broadcom

LED 3MM GAP DIFF GRN RA HOUSING

0

5612201100F

5612201100F

Dialight

LED 5MM VERT HIEFF DIFF GRN PCMT

111

WP934EB/2SRD

WP934EB/2SRD

Kingbright

LED IND 3MM BI-LVL RA RED DIFF

3319

5912004013F

5912004013F

Dialight

LED RED PRISM/CBI 630NM SMD

2255

5510507004F

5510507004F

Dialight

LED 3MM QUAD 5V RED PC MNT

0

SSA-LXB10HW-GF/LP

SSA-LXB10HW-GF/LP

Lumex, Inc.

LED ARRAY 10X25MM 10SEG RED DIFF

894

5530231F

5530231F

Dialight

LED CBI 3MM BI-LVL YLW/RED DIFF

1579

XEUR22D

XEUR22D

SunLED

LIGHTBAR 5X10MM RED RED DIFF

0

5690107777F

5690107777F

Dialight

LED 2X2 3MM HI DENSITY ORN PCMNT

0

LEDs - Circuit Board Indicators, Arrays, Light Bars, Bar Graphs

1. Overview

Light Emitting Diodes (LEDs) are semiconductor devices that convert electrical energy into light through electroluminescence. This product category includes indicators, arrays, light bars, and bar graphs designed for circuit board integration. LEDs serve critical roles in modern electronics for status indication, data visualization, and illumination. Their advantages include low power consumption, long lifespan, and compact form factors.

2. Main Types and Functional Classification

TypeFunctional FeaturesApplication Examples
IndicatorsSingle/dual-color point-source lighting for status indicationPower switches, network routers, medical device panels
ArraysMatrix configurations for alphanumeric/symbol displaySeven-segment displays, dot matrix modules
Light BarsLinear arrangements for directional lighting/brightness zonesAudio level meters, industrial control panels
Bar GraphsSegmented columns for quantitative visual representationBattery level indicators, sensor data visualization

3. Structure and Components

Typical LED components include:

  • Die: Gallium Nitride (GaN) or Indium Gallium Aluminum Phosphide (InGaAlP) semiconductor chips
  • Substrate: FR4 or metal-core PCB for thermal management
  • Encapsulation: Epoxy resin with diffused/optical lens structures
  • Driver Circuitry: Current-limiting resistors or PWM control ICs

4. Key Technical Specifications

ParameterDescriptionImportance
Luminous Intensity0.1-100 cd/m rangeDetermines visibility in various lighting conditions
Wavelength400-700 nm (visible spectrum)Defines color output accuracy
Forward Current2-30 mA typicalImpacts brightness and longevity
Viewing Angle5-120 depending on lens designDictates light distribution pattern
MTBF50,000-100,000 hoursSystem reliability prediction

5. Application Fields

Key industries include:

  • Consumer Electronics: Smartphones, laptops, home appliances
  • Industrial Automation: PLC status indicators, HMI panels
  • Automotive: Dashboard lighting, warning indicators
  • Medical Equipment: Diagnostic status visualization

6. Leading Manufacturers and Products

ManufacturerProduct SeriesKey Features
CreeXLamp XRHigh-brightness automotive indicators
OSRAMLED LineProgrammable RGB light bars
NichiaNSPWR70CSSUltra-compact bar graph displays
EverlightDLW-5xxxWaterproof array modules

7. Selection Recommendations

Key considerations:

  • Environmental Conditions: Temperature (-40 to +85 C operational range)
  • Optical Requirements: Color consistency (CIE 1931 standard)
  • Electrical Compatibility: Driver circuit matching
  • Form Factor: 0402-5050 package size constraints
  • Cost Optimization: Trade-off between performance and budget

Industry Trend Analysis

Current trends show:

  • Micronization: Development of 0201 package formats
  • Smart Integration: Embedded ICs for addressable lighting
  • Energy Efficiency: Sub-1mA operational current devices
  • Automotive Growth: HUD and LiDAR indicator applications
  • Medical Advancements: UV/IR spectrum specialized indicators

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