LED Lighting - COBs, Engines, Modules, Strips

Part Number	Description / PDF	Quantity
SI-B8V261560WW Samsung Semiconductor	LED MOD FSERIES GEN3 3000K STRIP	1564
SPHWW1HDNE23YHTN4J Samsung Semiconductor	LED 3.5X3.5 4000K 70CRI LH351A	0
SI-B8V301B20WW Samsung Semiconductor	LED MOD MSERIES 4FTB 3000K STRIP	388
SI-B8V521B20WW Samsung Semiconductor	LED MOD FSERIES GEN3 3000K STRIP	478
SL-B8V1N30LAWW Samsung Semiconductor	LED	33
SI-B8V15156CWW Samsung Semiconductor	LED MODULE LT-V562B 3000K STRIP	447
SI-B8V521560WW Samsung Semiconductor	LED MOD FSERIES GEN3 3000K STRIP	350
SI-B8V341B20WW Samsung Semiconductor	LED MOD MSERIES 4FTC 3000K STRIP	180
SI-B8R14156LWW Samsung Semiconductor	LED SLIM 5000K 2290LM FRONT WIRE	222
SI-B8T07128HWW Samsung Semiconductor	LED SLIM 4000K 1120LM FRONT WIRE	222
SI-B8T521560WW Samsung Semiconductor	LED MOD FSERIES GEN3 4000K STRIP	149
SI-B8V14256SWW Samsung Semiconductor	LED SLIM 3000K 2180LM BACK WIRE	122
SI-B8V07128HWW Samsung Semiconductor	LED SLIM 3000K 1080LM FRONT WIRE	213
SI-B8V052280WW Samsung Semiconductor	LED MOD LTM282AG2 WARM WHT STRIP	0
SI-B8V08128CWW Samsung Semiconductor	LED MODULE LT-V282B 3000K STRIP	653
SL-B8R2N70LAWW Samsung Semiconductor	LED	0
SI-B8R07128LWW Samsung Semiconductor	LED SLIM 5000K 1140LM FRONT WIRE	214
SI-B8R07128SWW Samsung Semiconductor	LED SLIM 5000K 1140LM FRONT WIRE	222
SI-B8U341560WW Samsung Semiconductor	LED 3500K 80CRI LM561B	589
SPHWW1HDNE27YHU34J Samsung Semiconductor	LED COB WHT 3500K 3STEP 90CRI	0

LED Lighting - COBs, Engines, Modules, Strips

1. Overview

LED lighting technologies, including Chip-on-Board (COB), LED Engines, Modules, and Strips, represent advanced solid-state lighting solutions. These components integrate semiconductor diodes to convert electrical energy into light, offering superior energy efficiency, longevity, and design flexibility compared to traditional lighting. Their importance spans industries such as architecture, automotive, consumer electronics, and industrial automation, driven by demands for sustainable and smart lighting systems.

2. Main Types and Functional Classification

Type	Functional Features	Application Examples
COBs	High-density LED arrays mounted directly on substrates, providing uniform light distribution and simplified thermal management.	Commercial downlights, high-bay warehouse lighting, film/photography lighting.
Engines	Pre-assembled units combining LEDs, drivers, and optics for plug-and-play integration.	Smart home lighting systems, retrofit lamps, horticultural grow lights.
Modules	Standardized units with LED arrays and integrated circuits for modular system design.	Office panel lighting, tunnel illumination, outdoor streetlights.
Strips	Flexible PCB-based linear arrays for customizable length and color control.	Architectural accent lighting, vehicle underglow, signage backlighting.

3. Structure and Components

Typical structures include:

COBs: Ceramic/aluminum substrate + multiple LED chips + phosphor coating + silicone encapsulation.
Engines: LED chip(s) + constant-current driver IC + primary optics + thermal interface material.
Modules: PCB board + SMD LEDs + secondary optics + connector terminals.
Strips: Flexible FPCB + RGB/W LED diodes + current-limiting resistors + adhesive backing.

All variants utilize semiconductor materials like GaN-on-SiC for blue/white emission or AlInGaP for red/yellow wavelengths.

4. Key Technical Specifications

Parameter	Description	Importance
Luminous Flux (lm)	Measure of total visible light output.	Determines brightness suitability for space.
Color Rendering Index (CRI)	Ability to accurately render object colors (0-100 scale).	Critical for retail, healthcare, and photography.
Correlated Color Temperature (CCT)	Light appearance from warm (2700K) to cool (6500K).	Affects ambiance and circadian rhythm regulation.
Lifespan (L70)	Operating hours until 70% lumen maintenance.	Reduces long-term maintenance costs.
Thermal Resistance ( C/W)	Efficiency of heat dissipation.	Impacts reliability and maximum drive current.

5. Application Fields

Architecture: Office lighting (Modules), hotel accenting (Strips), museum displays (COBs)
Automotive: Headlights (COBs), interior mood lighting (Strips), dashboard indicators (Modules)
Consumer Electronics: Smart bulb replacements (Engines), gaming PC lighting (Strips)
Industrial: Machine vision systems (COBs), warehouse safety lighting (Modules)

6. Leading Manufacturers

Manufacturer	Representative Product	Key Features
Cree (now Wolfspeed)	XLamp COB Arrays	3000K-5700K CCT range, 80 CRI, 1500mA max current
Osram	OSTAR LED Engines	Integrated driver, DALI compatibility, automotive-grade reliability
Philips Lighting	CorePro Modules	IEC 62031 compliant, 50,000-hour lifespan
Samsung LED	LPD8 Strips	Addressable RGB control, IP65 rating, 24V operation

7. Selection Recommendations

Key considerations:

Match L70 lifespan to maintenance schedules (e.g., 50,000+ hours for hard-to-reach installations)
Select CRI 90 for critical color applications vs. CRI 80 for general lighting
Verify IP rating compatibility (IP20 for indoor vs. IP67 for outdoor Strips)
Evaluate thermal management needs - COBs require heatsinks, Strips need ventilation
Check dimming compatibility (PWM vs. constant current reduction)

Case Study: Retail store lighting selected 4000K COBs with 95 CRI for product displays, achieving 40% energy savings over halogen systems while improving color accuracy.

8. Industry Trends

Emerging developments include:

Micro-LED integration for sub-100 m pixel densities in displays
HDR lighting systems using tunable white Modules
LiFi-enabled Engines for data transmission through light
UV-C disinfection modules for healthcare applications
Recyclable phosphor materials to meet EU RoHS standards

Market growth is projected at 12.3% CAGR (2023-2030), driven by smart city initiatives and automotive LED adoption.