LED Lighting - COBs, Engines, Modules, Strips

Part Number	Description / PDF	Quantity
SI-B8T07228SWW Samsung Semiconductor	LED SLIM 4000K 1120LM BACK WIRE	97
SI-B8V06128CWW Samsung Semiconductor	LED MODULE LT-V282A 3000K STRIP	507
SL-B8R5C9H1AWW Samsung Semiconductor	LED MODULE 12" 5150K 1.2A 25.8W	579
SI-B8T152560WW Samsung Semiconductor	LED MOD LTM562BG2 NEU WHT STRIP	155
SI-B8U171560WW Samsung Semiconductor	LED 3500K 80CRI LM561B	263
SI-B8T341560WW Samsung Semiconductor	LED 4000K 80CRI LM561B	31
SI-B8V07228SWW Samsung Semiconductor	LED SLIM 3000K 1080LM BACK WIRE	127
SI-B8V171550WW Samsung Semiconductor	LED 3000K 80CRI LM561B	502
SI-B8T341B20WW Samsung Semiconductor	LED MOD MSERIES 4FTC 4000K STRIP	200
SI-B8V342560WW Samsung Semiconductor	LED MODULE 3000K F562A_G2	688
SI-B8R14156SWW Samsung Semiconductor	LED SLIM 5000K 2290LM FRONT WIRE	224
SI-B8T14256HWW Samsung Semiconductor	LED SLIM 4000K 2250LM BACK WIRE	127
SI-B8U14256SWW Samsung Semiconductor	LED SLIM 3500K 2210LM BACK WIRE	0
SI-B8T172560WW Samsung Semiconductor	LED MOD LTM562CG2 NEU WHT STRIP	221
SPHWW1HDNE27YHV34J Samsung Semiconductor	LED COB WHT 3000K 3STEP 90CRI	0
SL-B8T4N90LAWW Samsung Semiconductor	LED	54
SI-B8V07228HWW Samsung Semiconductor	LED SLIM 3000K 1080LM BACK WIRE	125
SI-B8R08128CWW Samsung Semiconductor	LED MODULE LT-V282B 5000K STRIP	208
SL-PGR2W57SBGL Samsung Semiconductor	LED MODULE 5000K RECTANGLE	0
SI-B8U07128SWW Samsung Semiconductor	LED SLIM 3500K 1090LM FRONT WIRE	0

LED Lighting - COBs, Engines, Modules, Strips

1. Overview

LED lighting technologies, including Chip-on-Board (COB), LED Engines, Modules, and Strips, represent advanced solid-state lighting solutions. These components integrate semiconductor diodes to convert electrical energy into light, offering superior energy efficiency, longevity, and design flexibility compared to traditional lighting. Their importance spans industries such as architecture, automotive, consumer electronics, and industrial automation, driven by demands for sustainable and smart lighting systems.

2. Main Types and Functional Classification

Type	Functional Features	Application Examples
COBs	High-density LED arrays mounted directly on substrates, providing uniform light distribution and simplified thermal management.	Commercial downlights, high-bay warehouse lighting, film/photography lighting.
Engines	Pre-assembled units combining LEDs, drivers, and optics for plug-and-play integration.	Smart home lighting systems, retrofit lamps, horticultural grow lights.
Modules	Standardized units with LED arrays and integrated circuits for modular system design.	Office panel lighting, tunnel illumination, outdoor streetlights.
Strips	Flexible PCB-based linear arrays for customizable length and color control.	Architectural accent lighting, vehicle underglow, signage backlighting.

3. Structure and Components

Typical structures include:

COBs: Ceramic/aluminum substrate + multiple LED chips + phosphor coating + silicone encapsulation.
Engines: LED chip(s) + constant-current driver IC + primary optics + thermal interface material.
Modules: PCB board + SMD LEDs + secondary optics + connector terminals.
Strips: Flexible FPCB + RGB/W LED diodes + current-limiting resistors + adhesive backing.

All variants utilize semiconductor materials like GaN-on-SiC for blue/white emission or AlInGaP for red/yellow wavelengths.

4. Key Technical Specifications

Parameter	Description	Importance
Luminous Flux (lm)	Measure of total visible light output.	Determines brightness suitability for space.
Color Rendering Index (CRI)	Ability to accurately render object colors (0-100 scale).	Critical for retail, healthcare, and photography.
Correlated Color Temperature (CCT)	Light appearance from warm (2700K) to cool (6500K).	Affects ambiance and circadian rhythm regulation.
Lifespan (L70)	Operating hours until 70% lumen maintenance.	Reduces long-term maintenance costs.
Thermal Resistance ( C/W)	Efficiency of heat dissipation.	Impacts reliability and maximum drive current.

5. Application Fields

Architecture: Office lighting (Modules), hotel accenting (Strips), museum displays (COBs)
Automotive: Headlights (COBs), interior mood lighting (Strips), dashboard indicators (Modules)
Consumer Electronics: Smart bulb replacements (Engines), gaming PC lighting (Strips)
Industrial: Machine vision systems (COBs), warehouse safety lighting (Modules)

6. Leading Manufacturers

Manufacturer	Representative Product	Key Features
Cree (now Wolfspeed)	XLamp COB Arrays	3000K-5700K CCT range, 80 CRI, 1500mA max current
Osram	OSTAR LED Engines	Integrated driver, DALI compatibility, automotive-grade reliability
Philips Lighting	CorePro Modules	IEC 62031 compliant, 50,000-hour lifespan
Samsung LED	LPD8 Strips	Addressable RGB control, IP65 rating, 24V operation

7. Selection Recommendations

Key considerations:

Match L70 lifespan to maintenance schedules (e.g., 50,000+ hours for hard-to-reach installations)
Select CRI 90 for critical color applications vs. CRI 80 for general lighting
Verify IP rating compatibility (IP20 for indoor vs. IP67 for outdoor Strips)
Evaluate thermal management needs - COBs require heatsinks, Strips need ventilation
Check dimming compatibility (PWM vs. constant current reduction)

Case Study: Retail store lighting selected 4000K COBs with 95 CRI for product displays, achieving 40% energy savings over halogen systems while improving color accuracy.

8. Industry Trends

Emerging developments include:

Micro-LED integration for sub-100 m pixel densities in displays
HDR lighting systems using tunable white Modules
LiFi-enabled Engines for data transmission through light
UV-C disinfection modules for healthcare applications
Recyclable phosphor materials to meet EU RoHS standards

Market growth is projected at 12.3% CAGR (2023-2030), driven by smart city initiatives and automotive LED adoption.