LED Indication - Discrete

Image Part Number Description / PDF Quantity Rfq
NTE3019

NTE3019

NTE Electronics, Inc.

LED-RED T-1 3/4

378

NTE3188

NTE3188

NTE Electronics, Inc.

LED-WHITE CLEAR T-1 3/4

84

NTE30085

NTE30085

NTE Electronics, Inc.

LED-SMD RT ANG SUPER BLUE

2207

NTE30153

NTE30153

NTE Electronics, Inc.

LED 5MM RGB COMM ANODE

4160

NTE30159-10

NTE30159-10

NTE Electronics, Inc.

LED 10MM RGB COMM CATHODE 10PCS

16

NTE30140-EW

NTE30140-EW

NTE Electronics, Inc.

LED-3MM RED W/220OHM 1/8 RESISTO

28

NTE30127

NTE30127

NTE Electronics, Inc.

LED-5MM TURQUOISE

1128

NTE30056

NTE30056

NTE Electronics, Inc.

LED-8MM LT-RED

1327

NTE30071

NTE30071

NTE Electronics, Inc.

LED-10MM WHITE

2246

NTE3185

NTE3185

NTE Electronics, Inc.

LED-WHITE CLEAR T-1

52

NTE30115

NTE30115

NTE Electronics, Inc.

LED-RED/GREEN/BLUE 5MM

2734

NTE30078

NTE30078

NTE Electronics, Inc.

LED-SMD 1206 SUPER BLUE

1476

NTE30112

NTE30112

NTE Electronics, Inc.

LED-RED/YEL_GRN 5MM 2LEAD

3101

LED Indication - Discrete

1. Overview

Discrete Light Emitting Diodes (LEDs) are single-chip optoelectronic devices that convert electrical energy into light through electroluminescence. This product category forms the foundation of modern indication systems, offering advantages including low power consumption, long lifespan, and high reliability. Their importance spans across consumer electronics, industrial equipment, automotive systems, and communication infrastructure.

2. Major Types and Functional Classification

TypeFunctional CharacteristicsApplication Examples
Visible LEDsEmits light in visible spectrum (400-700nm), available in multiple colorsIndicator lamps, display backlighting, decorative lighting
Infrared LEDsEmits 700nm-1mm wavelength radiation, invisible to human eyeRemote controls, security sensors, night vision systems
High-Brightness LEDsEnhanced luminous intensity (>1000mcd) with advanced packagingAutomotive lighting, outdoor displays, emergency signage
UV LEDsUltraviolet spectrum emission (280-400nm)Sterilization equipment, counterfeit detection, curing systems

3. Structure and Composition

Typical discrete LED construction includes:

  • Die: Semiconductor chip (GaN/InGaN for blue/green, AlGaInP for red)
  • Encapsulation: Epoxy or silicone lens for light extraction and protection
  • Lead Frame: Copper or iron alloy for electrical connection and heat dissipation
  • Phosphor Coating: Used in white LEDs for wavelength conversion
  • Reflective Cup: Optimizes light directionality

4. Key Technical Parameters

ParameterSignificanceTypical Range
WavelengthDetermines light color and application suitability375nm-940nm
Luminous IntensityMeasures brightness output (mcd)50-10,000mcd
Forward CurrentOperating current rating20-150mA
Forward VoltageElectrical potential drop1.8-3.6V
Viewing AngleLight emission spread measurement5 -120

5. Application Fields

Primary application sectors include:

  • Consumer Electronics: Mobile phone indicators, keyboard backlighting
  • Automotive: Dashboard indicators, brake light systems
  • Industrial: Machine status indicators, safety signage
  • Medical: Diagnostic equipment indicators, phototherapy devices
  • Telecommunications: Network equipment status lights

6. Leading Manufacturers and Products

ManufacturerProduct SeriesKey Features
Cree Inc.XLamp XP-G3High brightness (3200mcd), 120 viewing angle
OSRAM OptoOSTAR ProjectionHigh-power LED for automotive lighting
Nichia Corp.NSHU5991UV LED (365nm) for curing applications
Everlight ElectronicsLTST-C19HE8WTTri-color LED for RGB indication

7. Selection Recommendations

Key consideration factors:

  • Spectral Requirements: Match wavelength to application needs
  • Environmental Conditions: Temperature range (-40 C to +85 C typical)
  • Power Constraints: Select appropriate current/voltage ratings
  • Optical Design: Consider lens type and viewing angle
  • Reliability: Check MTTF (Mean Time to Failure) specifications

Industry Development Trends

Current technology directions include:

  • Miniaturization: Development of micro-LED ( LED) with dimensions <50 m
  • Efficiency Improvement: Targeting >300lm/W efficacy for visible LEDs
  • Smart Integration: Incorporating driver ICs and sensors in LED packages
  • Material Innovation: GaN-on-silicon substrates for cost reduction
  • Regulatory Compliance: RoHS/REACH compliant packaging materials
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