LED Indication - Discrete

Part Number	Description / PDF	Quantity
CLM4B-AKW-CWBXB353 Cree	LED AMBER CLEAR 4PLCC SMD	20939
CLP6B-WKW-CC0E0233 Cree	LED COOL WHITE DIFF 6PLCC SMD	0
CLM1B-AKW-CVAVB353 Cree	LED AMBER DIFFUSED 2PLCC SMD	935
CLM4B-BKW-CUBVA453 Cree	LED BLUE 4PLCC SMD	0
C513A-WSN-CY0Z0232 Cree	LED WHITE 5MM ROUND T/H	1842
C566D-AFF-CV0X0252 Cree	LED AMBER CLEAR 5MM OVAL T/H	0
C503B-WAN-CBBDB232 Cree	LED COOL WHITE CLEAR 5MM T/H	0
CLP6C-RKW-CZ0A0AA3 Cree	LED RED CLEAR 6PLCC SMD	0
C503B-ABN-CX0Y0341 Cree	LED AMBER CLEAR 5MM ROUND T/H	22
C503B-BCS-CW0X0452 Cree	LED BLUE CLEAR 5MM ROUND T/H	374
C503B-RCS-CX0Y0AA2 Cree	LED RED CLEAR 5MM ROUND T/H	1229
C503B-GCN-CB0C0891 Cree	LED GREEN CLEAR 5MM ROUND T/H	650
C5SMF-BJE-CR14Q3T1 Cree	LED BLUE CLEAR 5MM OVAL T/H	0
C566D-RFE-CV0X0BB1 Cree	LED RED CLEAR 5MM OVAL T/H	0
C503B-RAN-CZ0C0AA2 Cree	LED RED CLEAR 5MM ROUND T/H	27170
C503B-BCN-CV0Z0462 Cree	LED BLUE CLEAR 5MM ROUND T/H	56921
CLM3C-WKW-CWBYA453 Cree	LED COOL WHITE DIFF 2PLCC SMD	47474
C566D-AFF-CV34Q341 Cree	LED AMBER CLEAR 5MM OVAL T/H	0
C503B-ACN-CYBZA342-030 Cree	LED AMBER CLEAR 5MM ROUND T/H	0
CLVBA-FKA-CAEDH8BBB7A363 Cree	LED RGB DIFFUSED 4PLCC SMD	63097

LED Indication - Discrete

1. Overview

Discrete Light Emitting Diodes (LEDs) are single-chip optoelectronic devices that convert electrical energy into light through electroluminescence. This product category forms the foundation of modern indication systems, offering advantages including low power consumption, long lifespan, and high reliability. Their importance spans across consumer electronics, industrial equipment, automotive systems, and communication infrastructure.

2. Major Types and Functional Classification

Type	Functional Characteristics	Application Examples
Visible LEDs	Emits light in visible spectrum (400-700nm), available in multiple colors	Indicator lamps, display backlighting, decorative lighting
Infrared LEDs	Emits 700nm-1mm wavelength radiation, invisible to human eye	Remote controls, security sensors, night vision systems
High-Brightness LEDs	Enhanced luminous intensity (>1000mcd) with advanced packaging	Automotive lighting, outdoor displays, emergency signage
UV LEDs	Ultraviolet spectrum emission (280-400nm)	Sterilization equipment, counterfeit detection, curing systems

3. Structure and Composition

Typical discrete LED construction includes:

Die: Semiconductor chip (GaN/InGaN for blue/green, AlGaInP for red)
Encapsulation: Epoxy or silicone lens for light extraction and protection
Lead Frame: Copper or iron alloy for electrical connection and heat dissipation
Phosphor Coating: Used in white LEDs for wavelength conversion
Reflective Cup: Optimizes light directionality

4. Key Technical Parameters

Parameter	Significance	Typical Range
Wavelength	Determines light color and application suitability	375nm-940nm
Luminous Intensity	Measures brightness output (mcd)	50-10,000mcd
Forward Current	Operating current rating	20-150mA
Forward Voltage	Electrical potential drop	1.8-3.6V
Viewing Angle	Light emission spread measurement	5 -120

5. Application Fields

Primary application sectors include:

Consumer Electronics: Mobile phone indicators, keyboard backlighting
Automotive: Dashboard indicators, brake light systems
Industrial: Machine status indicators, safety signage
Medical: Diagnostic equipment indicators, phototherapy devices
Telecommunications: Network equipment status lights

6. Leading Manufacturers and Products

Manufacturer	Product Series	Key Features
Cree Inc.	XLamp XP-G3	High brightness (3200mcd), 120 viewing angle
OSRAM Opto	OSTAR Projection	High-power LED for automotive lighting
Nichia Corp.	NSHU5991	UV LED (365nm) for curing applications
Everlight Electronics	LTST-C19HE8WT	Tri-color LED for RGB indication

7. Selection Recommendations

Key consideration factors:

Spectral Requirements: Match wavelength to application needs
Environmental Conditions: Temperature range (-40 C to +85 C typical)
Power Constraints: Select appropriate current/voltage ratings
Optical Design: Consider lens type and viewing angle
Reliability: Check MTTF (Mean Time to Failure) specifications

Industry Development Trends

Current technology directions include:

Miniaturization: Development of micro-LED ( LED) with dimensions <50 m
Efficiency Improvement: Targeting >300lm/W efficacy for visible LEDs
Smart Integration: Incorporating driver ICs and sensors in LED packages
Material Innovation: GaN-on-silicon substrates for cost reduction
Regulatory Compliance: RoHS/REACH compliant packaging materials