LED Indication - Discrete

Part Number	Description / PDF	Quantity
CSB85BR2G2C ChromeLED	LED RED/GRN CLEAR 0805 SMD	50
CS85BG2C ChromeLED	LED GREEN CLEAR 0805 SMD	11
CSDK63Y2C ChromeLED	LED YELLOW CLEAR DOME 0603 SMD	100
CS85BW3C ChromeLED	LED WHITE CLEAR 0805 SMD	20
CS42EY2C ChromeLED	LED YELLOW CLEAR CHIP 0402 SMD	340
CSB63CR2O2C ChromeLED	LED RED/ORG CLEAR 0603 CHIP SMD	10
CSM28A2CZ ChromeLED	LED AMBER CLEAR Z-BEND SMD	53
CSM28R2CZ ChromeLED	LED RED CLEAR Z-BEND SMD	43
CS63BY4C ChromeLED	LED YELLOW CLEAR CHIP 0603 SMD	100
CSB63CR2G2C ChromeLED	LED RED/GRN CLEAR 0603 CHIP SMD	20
CSM28B2CZ ChromeLED	LED BLUE CLEAR Z-BEND SMD	20
CS63EGT2C ChromeLED	LED GREEN CLEAR CHIP 0603 SMD	0
CS85BRR1C ChromeLED	LED RED CLEAR 0805 SMD	50
CS85BGT2C ChromeLED	LED GREEN CLEAR 0805 SMD	39
CS85BW2C ChromeLED	LED WHITE CLEAR 0805 SMD	75
CS126AGT2C ChromeLED	LED GREEN CLEAR 1206 SMD	30
CBQ33RRRRD ChromeLED	LED CBI 3MM 4X1 RED, RED, RED, R	1000
CL50W4C ChromeLED	LED WHITE CLEAR T-1 3/4 T/H	1000
CSM28G2CG ChromeLED	LED GREEN CLEAR GULL WING SMD	62
CSM28G2CZ ChromeLED	LED GREEN CLEAR Z-BEND SMD	5

LED Indication - Discrete

1. Overview

Discrete Light Emitting Diodes (LEDs) are single-chip optoelectronic devices that convert electrical energy into light through electroluminescence. This product category forms the foundation of modern indication systems, offering advantages including low power consumption, long lifespan, and high reliability. Their importance spans across consumer electronics, industrial equipment, automotive systems, and communication infrastructure.

2. Major Types and Functional Classification

Type	Functional Characteristics	Application Examples
Visible LEDs	Emits light in visible spectrum (400-700nm), available in multiple colors	Indicator lamps, display backlighting, decorative lighting
Infrared LEDs	Emits 700nm-1mm wavelength radiation, invisible to human eye	Remote controls, security sensors, night vision systems
High-Brightness LEDs	Enhanced luminous intensity (>1000mcd) with advanced packaging	Automotive lighting, outdoor displays, emergency signage
UV LEDs	Ultraviolet spectrum emission (280-400nm)	Sterilization equipment, counterfeit detection, curing systems

3. Structure and Composition

Typical discrete LED construction includes:

Die: Semiconductor chip (GaN/InGaN for blue/green, AlGaInP for red)
Encapsulation: Epoxy or silicone lens for light extraction and protection
Lead Frame: Copper or iron alloy for electrical connection and heat dissipation
Phosphor Coating: Used in white LEDs for wavelength conversion
Reflective Cup: Optimizes light directionality

4. Key Technical Parameters

Parameter	Significance	Typical Range
Wavelength	Determines light color and application suitability	375nm-940nm
Luminous Intensity	Measures brightness output (mcd)	50-10,000mcd
Forward Current	Operating current rating	20-150mA
Forward Voltage	Electrical potential drop	1.8-3.6V
Viewing Angle	Light emission spread measurement	5 -120

5. Application Fields

Primary application sectors include:

Consumer Electronics: Mobile phone indicators, keyboard backlighting
Automotive: Dashboard indicators, brake light systems
Industrial: Machine status indicators, safety signage
Medical: Diagnostic equipment indicators, phototherapy devices
Telecommunications: Network equipment status lights

6. Leading Manufacturers and Products

Manufacturer	Product Series	Key Features
Cree Inc.	XLamp XP-G3	High brightness (3200mcd), 120 viewing angle
OSRAM Opto	OSTAR Projection	High-power LED for automotive lighting
Nichia Corp.	NSHU5991	UV LED (365nm) for curing applications
Everlight Electronics	LTST-C19HE8WT	Tri-color LED for RGB indication

7. Selection Recommendations

Key consideration factors:

Spectral Requirements: Match wavelength to application needs
Environmental Conditions: Temperature range (-40 C to +85 C typical)
Power Constraints: Select appropriate current/voltage ratings
Optical Design: Consider lens type and viewing angle
Reliability: Check MTTF (Mean Time to Failure) specifications

Industry Development Trends

Current technology directions include:

Miniaturization: Development of micro-LED ( LED) with dimensions <50 m
Efficiency Improvement: Targeting >300lm/W efficacy for visible LEDs
Smart Integration: Incorporating driver ICs and sensors in LED packages
Material Innovation: GaN-on-silicon substrates for cost reduction
Regulatory Compliance: RoHS/REACH compliant packaging materials