LED Indication - Discrete

Part Number	Description / PDF	Quantity
CSM28B2CG ChromeLED	LED BLUE CLEAR GULL WING SMD	0
CS63CW2C5MA ChromeLED	LED WHITE CLEAR CHIP 0603 SMD	76
CBQ33YYYYD ChromeLED	LED CBI 3MM 4X1 YEL, YEL, YEL, Y	1000
CS126AR2C ChromeLED	LED RED CLEAR 1206 SMD	26
CS85BR2C ChromeLED	LED RED CLEAR 0805 SMD	15
CS85BG1W ChromeLED	LED GREEN DIFFUSED 0805 SMD	30
CS63EY2C ChromeLED	LED YELLOW CLEAR CHIP 0603 SMD	10
CS126AA2C ChromeLED	LED AMBER CLEAR 1206 SMD	35
CST121R2GT2B2C ChromeLED	LED RGB CLEAR 1210 SMD	20
CS63BGT2C-HT ChromeLED	LED GREEN CLEAR CHIP 0603 SMD	0
CSB63CR2GT2C ChromeLED	LED RED/GRN CLEAR 0603 CHIP SMD	10
CS63BR2C-HT ChromeLED	LED RED CLEAR CHIP 0603 SMD	40
CSB85BR2B2C ChromeLED	LED RED/BLUE CLEAR 0805 SMD	15
CS126AW2C ChromeLED	LED WHITE CLEAR 1206 SMD	50
CS63CGT1C ChromeLED	LED GREEN CLEAR CHIP 0603 SMD	90
CSM28IR880CG ChromeLED	LED IR CLEAR GULL WING SMD	7
CSM28R2CG ChromeLED	LED RED CLEAR GULL WING SMD	12
CS63CB1C ChromeLED	LED BLUE CLEAR CHIP 0603 SMD	60
CSM28IR940CZ ChromeLED	LED IR CLEAR Z-BEND SMD	1
CS63BGT3C ChromeLED	LED GREEN CLEAR CHIP 0603 SMD	10

LED Indication - Discrete

1. Overview

Discrete Light Emitting Diodes (LEDs) are single-chip optoelectronic devices that convert electrical energy into light through electroluminescence. This product category forms the foundation of modern indication systems, offering advantages including low power consumption, long lifespan, and high reliability. Their importance spans across consumer electronics, industrial equipment, automotive systems, and communication infrastructure.

2. Major Types and Functional Classification

Type	Functional Characteristics	Application Examples
Visible LEDs	Emits light in visible spectrum (400-700nm), available in multiple colors	Indicator lamps, display backlighting, decorative lighting
Infrared LEDs	Emits 700nm-1mm wavelength radiation, invisible to human eye	Remote controls, security sensors, night vision systems
High-Brightness LEDs	Enhanced luminous intensity (>1000mcd) with advanced packaging	Automotive lighting, outdoor displays, emergency signage
UV LEDs	Ultraviolet spectrum emission (280-400nm)	Sterilization equipment, counterfeit detection, curing systems

3. Structure and Composition

Typical discrete LED construction includes:

Die: Semiconductor chip (GaN/InGaN for blue/green, AlGaInP for red)
Encapsulation: Epoxy or silicone lens for light extraction and protection
Lead Frame: Copper or iron alloy for electrical connection and heat dissipation
Phosphor Coating: Used in white LEDs for wavelength conversion
Reflective Cup: Optimizes light directionality

4. Key Technical Parameters

Parameter	Significance	Typical Range
Wavelength	Determines light color and application suitability	375nm-940nm
Luminous Intensity	Measures brightness output (mcd)	50-10,000mcd
Forward Current	Operating current rating	20-150mA
Forward Voltage	Electrical potential drop	1.8-3.6V
Viewing Angle	Light emission spread measurement	5 -120

5. Application Fields

Primary application sectors include:

Consumer Electronics: Mobile phone indicators, keyboard backlighting
Automotive: Dashboard indicators, brake light systems
Industrial: Machine status indicators, safety signage
Medical: Diagnostic equipment indicators, phototherapy devices
Telecommunications: Network equipment status lights

6. Leading Manufacturers and Products

Manufacturer	Product Series	Key Features
Cree Inc.	XLamp XP-G3	High brightness (3200mcd), 120 viewing angle
OSRAM Opto	OSTAR Projection	High-power LED for automotive lighting
Nichia Corp.	NSHU5991	UV LED (365nm) for curing applications
Everlight Electronics	LTST-C19HE8WT	Tri-color LED for RGB indication

7. Selection Recommendations

Key consideration factors:

Spectral Requirements: Match wavelength to application needs
Environmental Conditions: Temperature range (-40 C to +85 C typical)
Power Constraints: Select appropriate current/voltage ratings
Optical Design: Consider lens type and viewing angle
Reliability: Check MTTF (Mean Time to Failure) specifications

Industry Development Trends

Current technology directions include:

Miniaturization: Development of micro-LED ( LED) with dimensions <50 m
Efficiency Improvement: Targeting >300lm/W efficacy for visible LEDs
Smart Integration: Incorporating driver ICs and sensors in LED packages
Material Innovation: GaN-on-silicon substrates for cost reduction
Regulatory Compliance: RoHS/REACH compliant packaging materials