LED Indication - Discrete

Part Number	Description / PDF	Quantity
HLMP-EH3A-WX000 Broadcom	LAMP,5MM,ALINGAP,REDORG,30DEG	15974
HLMP-Y601-J0000 Broadcom	LED RED CLEAR T-1 T/H	232
HSMD-C170 Broadcom	LED ORANGE DIFFUSED CHIP SMD	36586
ASMT-CW20 Broadcom	LED WHITE CHIP SMD	7456
ASMT-RF45-AN002 Broadcom	LED YLW/GREEN DIFFUSED 0603 SMD	209074
HSMR-C190 Broadcom	LED BLUE DIFFUSED CHIP SMD	7406
HSMN-A101-N00J1 Broadcom	LED BLUE CLEAR 2PLCC SMD	11054
HSM8-C350 Broadcom	CHIPTOP MTALGAAS850NM	8870
HLMP-6405 Broadcom	LED YELLOW CLEAR AXIAL T/H AXIAL	0
HSMN-A400-S4QM2 Broadcom	LED BLUE CLEAR 4PLCC SMD	59307
HLMP-C115 Broadcom	LED RED CLEAR T-1 3/4 T/H	8906
HLMP-EG24-PS000 Broadcom	LED RED CLEAR T-1 3/4 T/H	0
HSMS-A100-J00J1 Broadcom	LED RED CLEAR 2PLCC SMD	3883
HSMF-C153 Broadcom	LED RED/YELLOW DIFF CHIP SMD	15797
HSMW-C191 Broadcom	LED COOL WHITE DIFFUSED CHIP SMD	27105
ASMM-CS03-HN402 Broadcom	LED SUPER RED ALGAAS SMD PLCC2	61960
HSMZ-C170 Broadcom	LED RED DIFFUSED CHIP SMD	16338
ALMD-CY3F-YZ002 Broadcom	LED RND WHITE 4SMD 30DEG	15295
HSML-C150 Broadcom	LED ORANGE DIFFUSED CHIP SMD	0
HLMP-C323 Broadcom	LED YELLOW CLEAR T-1 3/4 T/H	15288

LED Indication - Discrete

1. Overview

Discrete Light Emitting Diodes (LEDs) are single-chip optoelectronic devices that convert electrical energy into light through electroluminescence. This product category forms the foundation of modern indication systems, offering advantages including low power consumption, long lifespan, and high reliability. Their importance spans across consumer electronics, industrial equipment, automotive systems, and communication infrastructure.

2. Major Types and Functional Classification

Type	Functional Characteristics	Application Examples
Visible LEDs	Emits light in visible spectrum (400-700nm), available in multiple colors	Indicator lamps, display backlighting, decorative lighting
Infrared LEDs	Emits 700nm-1mm wavelength radiation, invisible to human eye	Remote controls, security sensors, night vision systems
High-Brightness LEDs	Enhanced luminous intensity (>1000mcd) with advanced packaging	Automotive lighting, outdoor displays, emergency signage
UV LEDs	Ultraviolet spectrum emission (280-400nm)	Sterilization equipment, counterfeit detection, curing systems

3. Structure and Composition

Typical discrete LED construction includes:

Die: Semiconductor chip (GaN/InGaN for blue/green, AlGaInP for red)
Encapsulation: Epoxy or silicone lens for light extraction and protection
Lead Frame: Copper or iron alloy for electrical connection and heat dissipation
Phosphor Coating: Used in white LEDs for wavelength conversion
Reflective Cup: Optimizes light directionality

4. Key Technical Parameters

Parameter	Significance	Typical Range
Wavelength	Determines light color and application suitability	375nm-940nm
Luminous Intensity	Measures brightness output (mcd)	50-10,000mcd
Forward Current	Operating current rating	20-150mA
Forward Voltage	Electrical potential drop	1.8-3.6V
Viewing Angle	Light emission spread measurement	5 -120

5. Application Fields

Primary application sectors include:

Consumer Electronics: Mobile phone indicators, keyboard backlighting
Automotive: Dashboard indicators, brake light systems
Industrial: Machine status indicators, safety signage
Medical: Diagnostic equipment indicators, phototherapy devices
Telecommunications: Network equipment status lights

6. Leading Manufacturers and Products

Manufacturer	Product Series	Key Features
Cree Inc.	XLamp XP-G3	High brightness (3200mcd), 120 viewing angle
OSRAM Opto	OSTAR Projection	High-power LED for automotive lighting
Nichia Corp.	NSHU5991	UV LED (365nm) for curing applications
Everlight Electronics	LTST-C19HE8WT	Tri-color LED for RGB indication

7. Selection Recommendations

Key consideration factors:

Spectral Requirements: Match wavelength to application needs
Environmental Conditions: Temperature range (-40 C to +85 C typical)
Power Constraints: Select appropriate current/voltage ratings
Optical Design: Consider lens type and viewing angle
Reliability: Check MTTF (Mean Time to Failure) specifications

Industry Development Trends

Current technology directions include:

Miniaturization: Development of micro-LED ( LED) with dimensions <50 m
Efficiency Improvement: Targeting >300lm/W efficacy for visible LEDs
Smart Integration: Incorporating driver ICs and sensors in LED packages
Material Innovation: GaN-on-silicon substrates for cost reduction
Regulatory Compliance: RoHS/REACH compliant packaging materials