LED Indication - Discrete

Part Number	Description / PDF	Quantity
ALMD-EL2E-XZ002 Broadcom	LED AMBER SMT ROUND ALINGAP 23DE	1475
HSMY-C110 Broadcom	LED YELLOW DIFFUSED CHIP SMD R/A	8142
HSMF-C114 Broadcom	LED RGB DIFFUSED CHIP SMD	21667
HLMP-EL24-PS000 Broadcom	LED AMBER CLEAR T-1 3/4 T/H	1338
HLMP-S201 Broadcom	LED RED DIFF RECT 2MMX5MM T/H	8335
HLMP-NM31-R0000 Broadcom	LED GREEN CLEAR T-1 T/H	1464
ASMB-MTB0-0A3A2 Broadcom	LED RGB DIFFUSED 4PLCC SMD	0
HLMP-3600 Broadcom	LED RED DIFFUSED T-1 3/4 T/H	14720
HSMA-A431-Y00M1 Broadcom	LED AMBER CLEAR 4PLCC SMD	17992
HSMC-A100-Q00J1 Broadcom	LED RED CLEAR 2PLCC SMD	111641
HLMP-1621 Broadcom	LED YELLOW DIFFUSED T-1 T/H	0
ASMT-SWB5-NW703 Broadcom	LED WHITE DIFFUSED 4PLCC SMD	1223
HLMP-P156-HK031 Broadcom	LED RED FLAT TOP 2SMD ZBEND	31048
HSMC-A101-S00J1 Broadcom	LED RED CLEAR 2PLCC SMD	253
HSMN-C120 Broadcom	LED BLUE CLEAR CHIP SMD R/A	15805
HSMA-C400 Broadcom	LED AMBER 1206 SMD	0
HSMA-C170-T0000 Broadcom	CHIP LED AMBER TOP MT ALINGAP	15329
HLMP-Q106-VX011 Broadcom	LED RED CLEAR DOME 2SMD GW	13348
HLMP-3351 Broadcom	LED RED DIFFUSED T-1 3/4 T/H	23529
HLMP-Q105-P0031 Broadcom	LED RED CLEAR Z-BEND SMD	22508

LED Indication - Discrete

1. Overview

Discrete Light Emitting Diodes (LEDs) are single-chip optoelectronic devices that convert electrical energy into light through electroluminescence. This product category forms the foundation of modern indication systems, offering advantages including low power consumption, long lifespan, and high reliability. Their importance spans across consumer electronics, industrial equipment, automotive systems, and communication infrastructure.

2. Major Types and Functional Classification

Type	Functional Characteristics	Application Examples
Visible LEDs	Emits light in visible spectrum (400-700nm), available in multiple colors	Indicator lamps, display backlighting, decorative lighting
Infrared LEDs	Emits 700nm-1mm wavelength radiation, invisible to human eye	Remote controls, security sensors, night vision systems
High-Brightness LEDs	Enhanced luminous intensity (>1000mcd) with advanced packaging	Automotive lighting, outdoor displays, emergency signage
UV LEDs	Ultraviolet spectrum emission (280-400nm)	Sterilization equipment, counterfeit detection, curing systems

3. Structure and Composition

Typical discrete LED construction includes:

Die: Semiconductor chip (GaN/InGaN for blue/green, AlGaInP for red)
Encapsulation: Epoxy or silicone lens for light extraction and protection
Lead Frame: Copper or iron alloy for electrical connection and heat dissipation
Phosphor Coating: Used in white LEDs for wavelength conversion
Reflective Cup: Optimizes light directionality

4. Key Technical Parameters

Parameter	Significance	Typical Range
Wavelength	Determines light color and application suitability	375nm-940nm
Luminous Intensity	Measures brightness output (mcd)	50-10,000mcd
Forward Current	Operating current rating	20-150mA
Forward Voltage	Electrical potential drop	1.8-3.6V
Viewing Angle	Light emission spread measurement	5 -120

5. Application Fields

Primary application sectors include:

Consumer Electronics: Mobile phone indicators, keyboard backlighting
Automotive: Dashboard indicators, brake light systems
Industrial: Machine status indicators, safety signage
Medical: Diagnostic equipment indicators, phototherapy devices
Telecommunications: Network equipment status lights

6. Leading Manufacturers and Products

Manufacturer	Product Series	Key Features
Cree Inc.	XLamp XP-G3	High brightness (3200mcd), 120 viewing angle
OSRAM Opto	OSTAR Projection	High-power LED for automotive lighting
Nichia Corp.	NSHU5991	UV LED (365nm) for curing applications
Everlight Electronics	LTST-C19HE8WT	Tri-color LED for RGB indication

7. Selection Recommendations

Key consideration factors:

Spectral Requirements: Match wavelength to application needs
Environmental Conditions: Temperature range (-40 C to +85 C typical)
Power Constraints: Select appropriate current/voltage ratings
Optical Design: Consider lens type and viewing angle
Reliability: Check MTTF (Mean Time to Failure) specifications

Industry Development Trends

Current technology directions include:

Miniaturization: Development of micro-LED ( LED) with dimensions <50 m
Efficiency Improvement: Targeting >300lm/W efficacy for visible LEDs
Smart Integration: Incorporating driver ICs and sensors in LED packages
Material Innovation: GaN-on-silicon substrates for cost reduction
Regulatory Compliance: RoHS/REACH compliant packaging materials