LED Indication - Discrete

Part Number	Description / PDF	Quantity
ASMD-CWG7-NX7C2 Broadcom	3014 DFN 0.1W WHITE WSURFACE NIM	114611
HSMF-A203-A00J1 Broadcom	LED GREEN/RED CLEAR 4PLCC SMD	14769
ASMD-CWG7-NX7A2 Broadcom	3014 DFN 0.1W WHITE WSURFACE NIM	111028
HLMP-1503-DE000 Broadcom	LED GREEN DIFFUSED T-1 T/H	26683
HLMP-Y601-JK000 Broadcom	LAMP,3MM,ALINGAP,RED	25975
HLMP-3490 Broadcom	LED YELLOW CLEAR T-1 3/4 T/H	0
HLMP-EG30-NR000 Broadcom	LED RED CLEAR T-1 3/4 T/H	0
ASMT-RR45-AQ902 Broadcom	LED RED DIFFUSED 0603 SMD	78807
HSME-C150 Broadcom	LED GREEN DIFFUSED CHIP SMD	20653
HLMP-EG2A-XY0DD Broadcom	LED RED CLEAR T-1 3/4 T/H	17674
HSM9-C380 Broadcom	CHIPTOP MTGAAS940NM	7980
HLMP-3301 Broadcom	LED RED DIFFUSED T-1 3/4 T/H	20909
HSMC-A461-V00M1 Broadcom	LED RED DIFFUSED 4PLCC SMD	68
HLMP-6800 Broadcom	LED GREEN DIFF AXIAL T/H AXIAL	0
HLMP-6820-F001S Broadcom	LED GREEN DIFFUSED AXIAL T/H	0
HLMP-Q150 Broadcom	LED RED DIFF AXIAL T/H AXIAL	3498
ASMT-CW00 Broadcom	LED WHITE CLEAR 0603 SMD R/A	4828
ASMT-UWB1-NX3B2 Broadcom	LED COOL WHITE DIFF 2PLCC SMD	77405
HSMR-C120 Broadcom	LED BLUE CLEAR CHIP SMD R/A	13768
HLMP-KA45-E0000 Broadcom	LED BLUE CLEAR T-1 T/H	10936

LED Indication - Discrete

1. Overview

Discrete Light Emitting Diodes (LEDs) are single-chip optoelectronic devices that convert electrical energy into light through electroluminescence. This product category forms the foundation of modern indication systems, offering advantages including low power consumption, long lifespan, and high reliability. Their importance spans across consumer electronics, industrial equipment, automotive systems, and communication infrastructure.

2. Major Types and Functional Classification

Type	Functional Characteristics	Application Examples
Visible LEDs	Emits light in visible spectrum (400-700nm), available in multiple colors	Indicator lamps, display backlighting, decorative lighting
Infrared LEDs	Emits 700nm-1mm wavelength radiation, invisible to human eye	Remote controls, security sensors, night vision systems
High-Brightness LEDs	Enhanced luminous intensity (>1000mcd) with advanced packaging	Automotive lighting, outdoor displays, emergency signage
UV LEDs	Ultraviolet spectrum emission (280-400nm)	Sterilization equipment, counterfeit detection, curing systems

3. Structure and Composition

Typical discrete LED construction includes:

Die: Semiconductor chip (GaN/InGaN for blue/green, AlGaInP for red)
Encapsulation: Epoxy or silicone lens for light extraction and protection
Lead Frame: Copper or iron alloy for electrical connection and heat dissipation
Phosphor Coating: Used in white LEDs for wavelength conversion
Reflective Cup: Optimizes light directionality

4. Key Technical Parameters

Parameter	Significance	Typical Range
Wavelength	Determines light color and application suitability	375nm-940nm
Luminous Intensity	Measures brightness output (mcd)	50-10,000mcd
Forward Current	Operating current rating	20-150mA
Forward Voltage	Electrical potential drop	1.8-3.6V
Viewing Angle	Light emission spread measurement	5 -120

5. Application Fields

Primary application sectors include:

Consumer Electronics: Mobile phone indicators, keyboard backlighting
Automotive: Dashboard indicators, brake light systems
Industrial: Machine status indicators, safety signage
Medical: Diagnostic equipment indicators, phototherapy devices
Telecommunications: Network equipment status lights

6. Leading Manufacturers and Products

Manufacturer	Product Series	Key Features
Cree Inc.	XLamp XP-G3	High brightness (3200mcd), 120 viewing angle
OSRAM Opto	OSTAR Projection	High-power LED for automotive lighting
Nichia Corp.	NSHU5991	UV LED (365nm) for curing applications
Everlight Electronics	LTST-C19HE8WT	Tri-color LED for RGB indication

7. Selection Recommendations

Key consideration factors:

Spectral Requirements: Match wavelength to application needs
Environmental Conditions: Temperature range (-40 C to +85 C typical)
Power Constraints: Select appropriate current/voltage ratings
Optical Design: Consider lens type and viewing angle
Reliability: Check MTTF (Mean Time to Failure) specifications

Industry Development Trends

Current technology directions include:

Miniaturization: Development of micro-LED ( LED) with dimensions <50 m
Efficiency Improvement: Targeting >300lm/W efficacy for visible LEDs
Smart Integration: Incorporating driver ICs and sensors in LED packages
Material Innovation: GaN-on-silicon substrates for cost reduction
Regulatory Compliance: RoHS/REACH compliant packaging materials