Accessories

Image Part Number Description / PDF Quantity Rfq
047670129301

047670129301

Dialight

PMI BASE 1 INCAND S-6 CNDLBR QC

0

091130809142

091130809142

Dialight

PMI BASE 11/16 NEON BAY SCREW

0

5340701037

5340701037

Dialight

CAP KIT FILTER/LENS CLEAR/NONE

0

5000022F

5000022F

Dialight

ANIMOTION SAMPLE PACK

0

FRA120CWXP

FRA120CWXP

Dialight

L/E TYPE A BRIG BRIDGE

0

091130809341

091130809341

Dialight

PMI BASE 11/16 NEON BAY SCREW

0

019131005300

019131005300

Dialight

PMI BASE T-3 1/4 BAYO 1 S-6

0

HZXJB

HZXJB

Dialight

UNIVERSL J-BOX UL50/50E SUSPD

0

1847571

1847571

Dialight

HDWR PMI LEGEND CAP 1/2 SQ RED

0

004183029203

004183029203

Dialight

PMI BASE T-1 3/4 15/32 SCREW

0

GUDOME

GUDOME

Dialight

GUIDA DOME COVER

0

L2KL3F

L2KL3F

Dialight

KIT EVALUATION

0

1810933003

1810933003

Dialight

PMI CAP STOVEP YLW 15/32 TRANSP

0

081041001201

081041001201

Dialight

PMI BASE 11/16 INCAND BAY SOLDER

0

1871874

1871874

Dialight

SWITCH IPS CAP 3/4 SQUARE BLUE

0

2030134203

2030134203

Dialight

PMI CAP MINI DIM 11/16 BL TRANSP

0

2040137203

2040137203

Dialight

PMI CAP MINI DIM 11/16 CLR FROST

0

1875061

1875061

Dialight

SWITCH HDWR IPS CAP RED

0

1346451200

1346451200

Dialight

PMI PANEL MOUNT IND SUB MINI

0

1320997

1320997

Dialight

LED PANEL MOUNT INDICATION

0

Accessories

1. Overview

Optoelectronics accessories refer to components that interface, control, or enhance the performance of optoelectronic systems. These include devices that manage light signals in fiber optics, sensors, lasers, and imaging systems. They play a critical role in telecommunications, data transmission, industrial automation, and medical diagnostics by enabling precise light manipulation and signal integrity.

2. Main Types and Functional Classification

TypeFunctional FeaturesApplication Examples
Optical ConnectorsSecure fiber alignment, low insertion lossTelecom networks, data centers
Optical CouplersSplit/combine light signalsPON networks, sensing systems
Optical IsolatorsPrevent back-reflection interferenceLaser protection, high-speed transceivers
Optical AttenuatorsControl signal power levelsEDFA amplifiers, FTTH networks
Photodetector ModulesConvert optical to electrical signalsLiDAR, optical sensors

3. Structure and Components

Typical optoelectronic accessories consist of: - Optical interfaces (e.g., ceramic ferrules in connectors) - Active/passive optical elements (e.g., thin-film filters, waveguides) - Mechanical housings (aluminum alloy or plastic for environmental protection) - Electrical contacts (for signal/power transmission) - Thermal management layers (to maintain stability under varying temperatures)

4. Key Technical Specifications

ParameterSignificance
Wavelength Range (nm)Determines compatibility with light sources (e.g., 1260-1650nm for telecom)
Insertion Loss (dB)Measures signal power loss through the component
Return Loss (dB)Indicates reflection suppression capability
Operating Temperature ( C)Defines environmental tolerance (-40 to +85 C typical)
Optical Power Handling (mW)Maximum power without performance degradation

5. Application Fields

Major industries include: - Telecommunications (DWDM systems, 5G infrastructure) - Medical (endoscopy, optical coherence tomography) - Industrial (laser material processing, machine vision) - Consumer Electronics (3D sensing, display technologies) - Aerospace (fiber optic gyroscopes, LiDAR)

6. Leading Manufacturers and Products

ManufacturerRepresentative Products
Finisar (II-VI)FMT series optical transceivers
Avago TechnologiesHFBR series fiber optic modules
LumentumWaveReady optical components
Hamamatsu PhotonicsG12157 photodetector arrays

7. Selection Recommendations

Key considerations: - Match wavelength specifications with system requirements - Verify environmental ratings (temperature, humidity) - Assess mechanical durability (e.g., connector mating cycles) - Check compliance with standards (e.g., Telcordia GR-326-CORE) - Balance cost-performance ratio for volume deployments

8. Industry Trends

Emerging trends include: - Development of silicon photonics for compact integration - 400G/800G high-speed transmission components - AI-driven smart optoelectronic packaging - Wide adoption of VCSEL-based 3D sensing - Green manufacturing processes reducing material waste

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