Accessories

Image Part Number Description / PDF Quantity Rfq
080131005301

080131005301

Dialight

PMI BASE PANEL MOUNT INDICATOR

0

FTMA32NWXP

FTMA32NWXP

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TUNNL START 32 LED NW NO OPTIC

0

831153014503

831153014503

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PMI BASE PRESS TO TEST

0

1780334500

1780334500

Dialight

PMI CAP BLUE FLAT 15/32 TRANSP

0

8120976

8120976

Dialight

PMI CAP 15/32 MNT TRANSLUC YLW

0

CL2ENDUK

CL2ENDUK

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CL2 END PLUG

0

3041871

3041871

Dialight

SWITCH CAP RED

0

1885075

1885075

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INDICATOR SWITCH CAP

0

091130809371

091130809371

Dialight

PMI BASE 11/16 NEON BAY SCREW

0

095041009102

095041009102

Dialight

PMI BASE 11/16 INCAND BAY SOLDER

0

2100117203

2100117203

Dialight

PMI CONVEX CAP CLR DIFF FROSTED

0

051340201301

051340201301

Dialight

PMI BASE 1 INCAND S-6 BAY SLDR

0

355340201203

355340201203

Dialight

PMI BASE 1 INCAND BAY SOLDER

0

183983014604

183983014604

Dialight

PMI BASE 1/2 INCAND MIDG SOLDER

0

3041861

3041861

Dialight

SWITCH CAP IPS 5/8 SQUARE RED

0

RJ45FMLXM

RJ45FMLXM

Dialight

OPTO LED

0

1691111203

1691111203

Dialight

PMI CAP STOVEP RED 11/16 FROSTED

0

RJ45C

RJ45C

Dialight

TERMINTION PLUG FOR RJ45 BLCK

0

051320201300

051320201300

Dialight

PMI BASE 1 INCAND S-6 BAY SCREW

0

3290701537

3290701537

Dialight

CAP KIT 3/4"X1" LEGEND SGL

0

Accessories

1. Overview

Optoelectronics accessories refer to components that interface, control, or enhance the performance of optoelectronic systems. These include devices that manage light signals in fiber optics, sensors, lasers, and imaging systems. They play a critical role in telecommunications, data transmission, industrial automation, and medical diagnostics by enabling precise light manipulation and signal integrity.

2. Main Types and Functional Classification

TypeFunctional FeaturesApplication Examples
Optical ConnectorsSecure fiber alignment, low insertion lossTelecom networks, data centers
Optical CouplersSplit/combine light signalsPON networks, sensing systems
Optical IsolatorsPrevent back-reflection interferenceLaser protection, high-speed transceivers
Optical AttenuatorsControl signal power levelsEDFA amplifiers, FTTH networks
Photodetector ModulesConvert optical to electrical signalsLiDAR, optical sensors

3. Structure and Components

Typical optoelectronic accessories consist of: - Optical interfaces (e.g., ceramic ferrules in connectors) - Active/passive optical elements (e.g., thin-film filters, waveguides) - Mechanical housings (aluminum alloy or plastic for environmental protection) - Electrical contacts (for signal/power transmission) - Thermal management layers (to maintain stability under varying temperatures)

4. Key Technical Specifications

ParameterSignificance
Wavelength Range (nm)Determines compatibility with light sources (e.g., 1260-1650nm for telecom)
Insertion Loss (dB)Measures signal power loss through the component
Return Loss (dB)Indicates reflection suppression capability
Operating Temperature ( C)Defines environmental tolerance (-40 to +85 C typical)
Optical Power Handling (mW)Maximum power without performance degradation

5. Application Fields

Major industries include: - Telecommunications (DWDM systems, 5G infrastructure) - Medical (endoscopy, optical coherence tomography) - Industrial (laser material processing, machine vision) - Consumer Electronics (3D sensing, display technologies) - Aerospace (fiber optic gyroscopes, LiDAR)

6. Leading Manufacturers and Products

ManufacturerRepresentative Products
Finisar (II-VI)FMT series optical transceivers
Avago TechnologiesHFBR series fiber optic modules
LumentumWaveReady optical components
Hamamatsu PhotonicsG12157 photodetector arrays

7. Selection Recommendations

Key considerations: - Match wavelength specifications with system requirements - Verify environmental ratings (temperature, humidity) - Assess mechanical durability (e.g., connector mating cycles) - Check compliance with standards (e.g., Telcordia GR-326-CORE) - Balance cost-performance ratio for volume deployments

8. Industry Trends

Emerging trends include: - Development of silicon photonics for compact integration - 400G/800G high-speed transmission components - AI-driven smart optoelectronic packaging - Wide adoption of VCSEL-based 3D sensing - Green manufacturing processes reducing material waste

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