Accessories

Image Part Number Description / PDF Quantity Rfq
031400101101

031400101101

Dialight

PMI BASE 1 INCAND S6 CAND SLDR

0

2030113203

2030113203

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PMI CAP MINI DIM 11/16 YLW FROST

0

LML6TERCAB

LML6TERCAB

Dialight

POWERWHITE TERMINATION CABLE ASY

0

CT8100

CT8100

Dialight

LINKING CABLE 6WAY PLUG 100MM

0

1885073

1885073

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INDICATOR SWITCH CAP

0

GCDA

GCDA

Dialight

OPTO LED

0

8131437

8131437

Dialight

PMI CAP 15/32MNT CYL TRANSP CLR

0

OHGDCLF

OHGDCLF

Dialight

LENS HOLDER GOLDEN DRAGON CLR

0

5920001

5920001

Dialight

KIT SPARE PARTS 592 HSGS LENS

0

091041009300

091041009300

Dialight

PMI BASE 11/16 INCAND BAY SLDR

0

095040809243

095040809243

Dialight

PMI BASE 11/16 NEON BAY SOLDER

0

CL2STARTUK

CL2STARTUK

Dialight

CL2 START CABLE

0

070131011206

070131011206

Dialight

PMI BASE 9/16 INCAND BAY SCREW

0

070132811100

070132811100

Dialight

PMI BASE 9/16 INCAND SLIDE SLDR

0

CT8C

CT8C

Dialight

CONNECTOR 8 WAY COMMON

0

104350202103

104350202103

Dialight

PMI BASE 1 INCAND S-6 BAY SCREW

0

1110134200

1110134200

Dialight

PMI T-1 3/4 INCAND BLUE UNFROST

0

095910809140

095910809140

Dialight

PMI BASE 11/16 NEON BAY SOLDER

0

OHS35CL

OHS35CL

Dialight

OPTIC HOLDER LUXEON STAR 3/5 CLR

0

2090137203

2090137203

Dialight

PMI CONVEX CAP SIZE 1 CLR TRANSP

0

Accessories

1. Overview

Optoelectronics accessories refer to components that interface, control, or enhance the performance of optoelectronic systems. These include devices that manage light signals in fiber optics, sensors, lasers, and imaging systems. They play a critical role in telecommunications, data transmission, industrial automation, and medical diagnostics by enabling precise light manipulation and signal integrity.

2. Main Types and Functional Classification

TypeFunctional FeaturesApplication Examples
Optical ConnectorsSecure fiber alignment, low insertion lossTelecom networks, data centers
Optical CouplersSplit/combine light signalsPON networks, sensing systems
Optical IsolatorsPrevent back-reflection interferenceLaser protection, high-speed transceivers
Optical AttenuatorsControl signal power levelsEDFA amplifiers, FTTH networks
Photodetector ModulesConvert optical to electrical signalsLiDAR, optical sensors

3. Structure and Components

Typical optoelectronic accessories consist of: - Optical interfaces (e.g., ceramic ferrules in connectors) - Active/passive optical elements (e.g., thin-film filters, waveguides) - Mechanical housings (aluminum alloy or plastic for environmental protection) - Electrical contacts (for signal/power transmission) - Thermal management layers (to maintain stability under varying temperatures)

4. Key Technical Specifications

ParameterSignificance
Wavelength Range (nm)Determines compatibility with light sources (e.g., 1260-1650nm for telecom)
Insertion Loss (dB)Measures signal power loss through the component
Return Loss (dB)Indicates reflection suppression capability
Operating Temperature ( C)Defines environmental tolerance (-40 to +85 C typical)
Optical Power Handling (mW)Maximum power without performance degradation

5. Application Fields

Major industries include: - Telecommunications (DWDM systems, 5G infrastructure) - Medical (endoscopy, optical coherence tomography) - Industrial (laser material processing, machine vision) - Consumer Electronics (3D sensing, display technologies) - Aerospace (fiber optic gyroscopes, LiDAR)

6. Leading Manufacturers and Products

ManufacturerRepresentative Products
Finisar (II-VI)FMT series optical transceivers
Avago TechnologiesHFBR series fiber optic modules
LumentumWaveReady optical components
Hamamatsu PhotonicsG12157 photodetector arrays

7. Selection Recommendations

Key considerations: - Match wavelength specifications with system requirements - Verify environmental ratings (temperature, humidity) - Assess mechanical durability (e.g., connector mating cycles) - Check compliance with standards (e.g., Telcordia GR-326-CORE) - Balance cost-performance ratio for volume deployments

8. Industry Trends

Emerging trends include: - Development of silicon photonics for compact integration - 400G/800G high-speed transmission components - AI-driven smart optoelectronic packaging - Wide adoption of VCSEL-based 3D sensing - Green manufacturing processes reducing material waste

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