Accessories

Image Part Number Description / PDF Quantity Rfq
2390372500

2390372500

Dialight

PMI IND CAP SUB MINI GREEN

0

051310101301

051310101301

Dialight

PMI BASE 1INCAND S6 CNDLBR SCRW

0

1750117203

1750117203

Dialight

PMI CAP CONVEX CLR 15/32 FROSTED

0

1881473

1881473

Dialight

IND SWITCH IPS CAP 3/4 RND YLW

0

FR2DMXT

FR2DMXT

Dialight

FR2 DMX Y SPLITTER

0

L2KL1F

L2KL1F

Dialight

KIT EVALUATION

0

CLLENDBNG

CLLENDBNG

Dialight

OPTO LED

0

1740132203

1740132203

Dialight

PMI CAP CONVEX GRN 15/32 TRANSP

0

061320202201

061320202201

Dialight

PMI BASE 1INCAND S-6 BAYO SCREW

0

3023462

3023462

Dialight

SWITCH CAP GREEN

0

019320205300

019320205300

Dialight

PMI BASE S-6 BAYO 1 INCAND SCRW

0

8311472003

8311472003

Dialight

IND PRESS TO TEST GREEN

0

2410001804

2410001804

Dialight

PMI IND CAP SUB MINI RED

0

080041005301

080041005301

Dialight

PMI BASE 1INCAN T3 1/4 BAY SLDR

0

061090102200

061090102200

Dialight

PMI BASE 1INCAND S6 CNDLBR SCRW

0

095040809370

095040809370

Dialight

PMI BASE 11/16 NEON BAY SOLDER

0

095911009300

095911009300

Dialight

PMI BASE 11/16 INCAND BAY SOLDER

0

FR2BRKT

FR2BRKT

Dialight

FRONTIER BRACKET ASSEMBLY

0

2030112203

2030112203

Dialight

PMI CAP MINI DIM 11/16 GRN FROST

0

350041001203

350041001203

Dialight

PMI BASE 11/16 INCAND BAY SLDR

0

Accessories

1. Overview

Optoelectronics accessories refer to components that interface, control, or enhance the performance of optoelectronic systems. These include devices that manage light signals in fiber optics, sensors, lasers, and imaging systems. They play a critical role in telecommunications, data transmission, industrial automation, and medical diagnostics by enabling precise light manipulation and signal integrity.

2. Main Types and Functional Classification

TypeFunctional FeaturesApplication Examples
Optical ConnectorsSecure fiber alignment, low insertion lossTelecom networks, data centers
Optical CouplersSplit/combine light signalsPON networks, sensing systems
Optical IsolatorsPrevent back-reflection interferenceLaser protection, high-speed transceivers
Optical AttenuatorsControl signal power levelsEDFA amplifiers, FTTH networks
Photodetector ModulesConvert optical to electrical signalsLiDAR, optical sensors

3. Structure and Components

Typical optoelectronic accessories consist of: - Optical interfaces (e.g., ceramic ferrules in connectors) - Active/passive optical elements (e.g., thin-film filters, waveguides) - Mechanical housings (aluminum alloy or plastic for environmental protection) - Electrical contacts (for signal/power transmission) - Thermal management layers (to maintain stability under varying temperatures)

4. Key Technical Specifications

ParameterSignificance
Wavelength Range (nm)Determines compatibility with light sources (e.g., 1260-1650nm for telecom)
Insertion Loss (dB)Measures signal power loss through the component
Return Loss (dB)Indicates reflection suppression capability
Operating Temperature ( C)Defines environmental tolerance (-40 to +85 C typical)
Optical Power Handling (mW)Maximum power without performance degradation

5. Application Fields

Major industries include: - Telecommunications (DWDM systems, 5G infrastructure) - Medical (endoscopy, optical coherence tomography) - Industrial (laser material processing, machine vision) - Consumer Electronics (3D sensing, display technologies) - Aerospace (fiber optic gyroscopes, LiDAR)

6. Leading Manufacturers and Products

ManufacturerRepresentative Products
Finisar (II-VI)FMT series optical transceivers
Avago TechnologiesHFBR series fiber optic modules
LumentumWaveReady optical components
Hamamatsu PhotonicsG12157 photodetector arrays

7. Selection Recommendations

Key considerations: - Match wavelength specifications with system requirements - Verify environmental ratings (temperature, humidity) - Assess mechanical durability (e.g., connector mating cycles) - Check compliance with standards (e.g., Telcordia GR-326-CORE) - Balance cost-performance ratio for volume deployments

8. Industry Trends

Emerging trends include: - Development of silicon photonics for compact integration - 400G/800G high-speed transmission components - AI-driven smart optoelectronic packaging - Wide adoption of VCSEL-based 3D sensing - Green manufacturing processes reducing material waste

RFQ BOM Call Skype Email
Top