Accessories

Image Part Number Description / PDF Quantity Rfq
98-0440-0038-2

98-0440-0038-2

3M

DBEF-E FILM 45 DEGREE 11' X 11'

0

98-0440-4994-2

98-0440-4994-2

3M

ALCF-P FLM KT 12.83X10.56 12 DEG

0

98-0440-0360-0

98-0440-0360-0

3M

DBEF-E FILM 45 DEG 17"X17"10 PCS

0

XG003877998

XG003877998

3M

UNFRMTY TP 50M 40.6X5.8MM

0

98000330732

98000330732

3M

CABLE EXTENSION FOR TOUCHPEN STY

0

98000341911

98000341911

3M

BOX, C3266PW

0

98000322143

98000322143

3M

EX II SERIAL UNCASED TOUCHPEN CO

0

98000330823

98000330823

3M

L-BRACKET, C1500SS

0

98110001116

98110001116

3M

EXII-7760UC(USB), SCT3210EX 31.8

0

98000341895

98000341895

3M

POWER SUPPLY, C2254PW

0

98000341804

98000341804

3M

VIDEO CABLE - DVI/HDMI, M18, M21

0

98000341861

98000341861

3M

BOX, M2256PW

0

98000341747

98000341747

3M

BOX, M2467PW

0

98044003626

98044003626

3M

BEF III-T PRODUCT KIT 17"X17"

0

JX200007437

JX200007437

3M

LIGHT FIBER 200MX8MM DIA

0

98000321707

98000321707

3M

VESA BRACKET, C1500SS

0

98-1100-0330-2

98-1100-0330-2

3M

CABLES AND ACCESSORIES

0

98000329866

98000329866

3M

FOAM INSERTS, M1500SS

0

98000341739

98000341739

3M

BOX, M2167PW

0

98-0440-4276-4

98-0440-4276-4

3M

DBEF-D400 45 DEGREE 14" X 14"

0

Accessories

1. Overview

Optoelectronics accessories refer to components that interface, control, or enhance the performance of optoelectronic systems. These include devices that manage light signals in fiber optics, sensors, lasers, and imaging systems. They play a critical role in telecommunications, data transmission, industrial automation, and medical diagnostics by enabling precise light manipulation and signal integrity.

2. Main Types and Functional Classification

TypeFunctional FeaturesApplication Examples
Optical ConnectorsSecure fiber alignment, low insertion lossTelecom networks, data centers
Optical CouplersSplit/combine light signalsPON networks, sensing systems
Optical IsolatorsPrevent back-reflection interferenceLaser protection, high-speed transceivers
Optical AttenuatorsControl signal power levelsEDFA amplifiers, FTTH networks
Photodetector ModulesConvert optical to electrical signalsLiDAR, optical sensors

3. Structure and Components

Typical optoelectronic accessories consist of: - Optical interfaces (e.g., ceramic ferrules in connectors) - Active/passive optical elements (e.g., thin-film filters, waveguides) - Mechanical housings (aluminum alloy or plastic for environmental protection) - Electrical contacts (for signal/power transmission) - Thermal management layers (to maintain stability under varying temperatures)

4. Key Technical Specifications

ParameterSignificance
Wavelength Range (nm)Determines compatibility with light sources (e.g., 1260-1650nm for telecom)
Insertion Loss (dB)Measures signal power loss through the component
Return Loss (dB)Indicates reflection suppression capability
Operating Temperature ( C)Defines environmental tolerance (-40 to +85 C typical)
Optical Power Handling (mW)Maximum power without performance degradation

5. Application Fields

Major industries include: - Telecommunications (DWDM systems, 5G infrastructure) - Medical (endoscopy, optical coherence tomography) - Industrial (laser material processing, machine vision) - Consumer Electronics (3D sensing, display technologies) - Aerospace (fiber optic gyroscopes, LiDAR)

6. Leading Manufacturers and Products

ManufacturerRepresentative Products
Finisar (II-VI)FMT series optical transceivers
Avago TechnologiesHFBR series fiber optic modules
LumentumWaveReady optical components
Hamamatsu PhotonicsG12157 photodetector arrays

7. Selection Recommendations

Key considerations: - Match wavelength specifications with system requirements - Verify environmental ratings (temperature, humidity) - Assess mechanical durability (e.g., connector mating cycles) - Check compliance with standards (e.g., Telcordia GR-326-CORE) - Balance cost-performance ratio for volume deployments

8. Industry Trends

Emerging trends include: - Development of silicon photonics for compact integration - 400G/800G high-speed transmission components - AI-driven smart optoelectronic packaging - Wide adoption of VCSEL-based 3D sensing - Green manufacturing processes reducing material waste

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