Accessories

Image Part Number Description / PDF Quantity Rfq
98-0440-4277-2

98-0440-4277-2

3M

DBEF-D400 0 DEG 17"X17" 10 PCS

0

98044043721

98044043721

3M

FILM DURA QUICK CLEAN 12X9 50 PC

0

98043985609

98043985609

3M

FILM BEF II 90/24 11"SQ 30 PCS

0

98043985039

98043985039

3M

FILM BEF II 90/50 11"SQ 30 PCS

0

98-0440-0359-2

98-0440-0359-2

3M

DBEF-E FILM 0 DEG 17"X17" 10 PCS

0

7310101

7310101

3M

CABLE WITH SERIAL RS232 CONN 96"

0

SCX-ASIC

SCX-ASIC

3M

CHIP SET FOR RESISTIVE CONTROLLR

0

98044003659

98044003659

3M

FILM BEF III 90/50-M 11"SQ 30 PC

0

98044042731

98044042731

3M

FILM ANTI REFLECT 2.84X2.13 3 PC

0

XG003878665

XG003878665

3M

UNFRMTY TP 50M 43.2X4.8MM

0

XG003878004

XG003878004

3M

UNFRMTY TP 50M 42X2.8MM

0

98000329759

98000329759

3M

POWER CORD, M1500SS, C1500SS, DU

0

98000330856

98000330856

3M

POWER SUPPLY, M1700SS

0

98-1100-0230-4

98-1100-0230-4

3M

CABLES AND ACCESSORIES

0

98000329742

98000329742

3M

VIDEO CABLE, DVI-DVI, M17, M22,

0

98-0440-5129-4

98-0440-5129-4

3M

ALCF-P FLM KT 13.70X11.02 11 DEG

0

98000332530

98000332530

3M

BOX, C1500SS

0

98000341432

98000341432

3M

BOX, C1910PS

0

98000329734

98000329734

3M

VIDEO CABLE - VGA/DVI, M1700SS

0

98000341713

98000341713

3M

BOX, C2234SW, C2254PW

0

Accessories

1. Overview

Optoelectronics accessories refer to components that interface, control, or enhance the performance of optoelectronic systems. These include devices that manage light signals in fiber optics, sensors, lasers, and imaging systems. They play a critical role in telecommunications, data transmission, industrial automation, and medical diagnostics by enabling precise light manipulation and signal integrity.

2. Main Types and Functional Classification

TypeFunctional FeaturesApplication Examples
Optical ConnectorsSecure fiber alignment, low insertion lossTelecom networks, data centers
Optical CouplersSplit/combine light signalsPON networks, sensing systems
Optical IsolatorsPrevent back-reflection interferenceLaser protection, high-speed transceivers
Optical AttenuatorsControl signal power levelsEDFA amplifiers, FTTH networks
Photodetector ModulesConvert optical to electrical signalsLiDAR, optical sensors

3. Structure and Components

Typical optoelectronic accessories consist of: - Optical interfaces (e.g., ceramic ferrules in connectors) - Active/passive optical elements (e.g., thin-film filters, waveguides) - Mechanical housings (aluminum alloy or plastic for environmental protection) - Electrical contacts (for signal/power transmission) - Thermal management layers (to maintain stability under varying temperatures)

4. Key Technical Specifications

ParameterSignificance
Wavelength Range (nm)Determines compatibility with light sources (e.g., 1260-1650nm for telecom)
Insertion Loss (dB)Measures signal power loss through the component
Return Loss (dB)Indicates reflection suppression capability
Operating Temperature ( C)Defines environmental tolerance (-40 to +85 C typical)
Optical Power Handling (mW)Maximum power without performance degradation

5. Application Fields

Major industries include: - Telecommunications (DWDM systems, 5G infrastructure) - Medical (endoscopy, optical coherence tomography) - Industrial (laser material processing, machine vision) - Consumer Electronics (3D sensing, display technologies) - Aerospace (fiber optic gyroscopes, LiDAR)

6. Leading Manufacturers and Products

ManufacturerRepresentative Products
Finisar (II-VI)FMT series optical transceivers
Avago TechnologiesHFBR series fiber optic modules
LumentumWaveReady optical components
Hamamatsu PhotonicsG12157 photodetector arrays

7. Selection Recommendations

Key considerations: - Match wavelength specifications with system requirements - Verify environmental ratings (temperature, humidity) - Assess mechanical durability (e.g., connector mating cycles) - Check compliance with standards (e.g., Telcordia GR-326-CORE) - Balance cost-performance ratio for volume deployments

8. Industry Trends

Emerging trends include: - Development of silicon photonics for compact integration - 400G/800G high-speed transmission components - AI-driven smart optoelectronic packaging - Wide adoption of VCSEL-based 3D sensing - Green manufacturing processes reducing material waste

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