Accessories

Image Part Number Description / PDF Quantity Rfq
98044059800

98044059800

3M

ALCF-P ABR2 25.22"X 15.77"

0

98044058711

98044058711

3M

BEF3 M2 155N 17"X17"

0

98044060154

98044060154

3M

DBEF II 45 DEG 11"X 11"

0

98044058489

98044058489

3M

ESR 26"X 26"

0

98-0440-5124-5

98-0440-5124-5

3M

ALCF-P FLM KT 16.77X12.8 11 DEG

0

98000321731

98000321731

3M

POWER SUPPLY, C1500SS, M1500SS

2

98044045726

98044045726

3M

DBEF-D2-400 14"X 18"

0

98044045718

98044045718

3M

DBEF-D2-400 0 DEG BIAS 42"X27"

0

98044059834

98044059834

3M

ALCF-P ABR2 18.77"X 10.56"

0

98044043499

98044043499

3M

DBEF II 17"X 17"

0

98044050833

98044050833

3M

DBEF-D2-280 17.03"X 17.03"

0

98044055873

98044055873

3M

ALCF ABR2 50"X 26"

0

98-0440-4265-7

98-0440-4265-7

3M

ALCF-P FLM KT 15X12 60 DEG

0

98044060311

98044060311

3M

DBEF QV2 W/OCA 90DEG 14"X22"

0

98044055378

98044055378

3M

DBEF II 90 DEGREE 14"X22"

0

98044059818

98044059818

3M

ALCF-P ABR2 20.43"X 12.78"

0

98044050866

98044050866

3M

DBEF-D2-400 14.03"X 14.03"

0

98044042616

98044042616

3M

FILM ANTI REFLECT 9.74X7.32 5PC

0

XG003878657

XG003878657

3M

UNFRMTY TP 50M 41.8X3.8MM

0

98-0440-4278-0

98-0440-4278-0

3M

DBEF-D400 45 DEG 17"X17" 10 PCS

0

Accessories

1. Overview

Optoelectronics accessories refer to components that interface, control, or enhance the performance of optoelectronic systems. These include devices that manage light signals in fiber optics, sensors, lasers, and imaging systems. They play a critical role in telecommunications, data transmission, industrial automation, and medical diagnostics by enabling precise light manipulation and signal integrity.

2. Main Types and Functional Classification

TypeFunctional FeaturesApplication Examples
Optical ConnectorsSecure fiber alignment, low insertion lossTelecom networks, data centers
Optical CouplersSplit/combine light signalsPON networks, sensing systems
Optical IsolatorsPrevent back-reflection interferenceLaser protection, high-speed transceivers
Optical AttenuatorsControl signal power levelsEDFA amplifiers, FTTH networks
Photodetector ModulesConvert optical to electrical signalsLiDAR, optical sensors

3. Structure and Components

Typical optoelectronic accessories consist of: - Optical interfaces (e.g., ceramic ferrules in connectors) - Active/passive optical elements (e.g., thin-film filters, waveguides) - Mechanical housings (aluminum alloy or plastic for environmental protection) - Electrical contacts (for signal/power transmission) - Thermal management layers (to maintain stability under varying temperatures)

4. Key Technical Specifications

ParameterSignificance
Wavelength Range (nm)Determines compatibility with light sources (e.g., 1260-1650nm for telecom)
Insertion Loss (dB)Measures signal power loss through the component
Return Loss (dB)Indicates reflection suppression capability
Operating Temperature ( C)Defines environmental tolerance (-40 to +85 C typical)
Optical Power Handling (mW)Maximum power without performance degradation

5. Application Fields

Major industries include: - Telecommunications (DWDM systems, 5G infrastructure) - Medical (endoscopy, optical coherence tomography) - Industrial (laser material processing, machine vision) - Consumer Electronics (3D sensing, display technologies) - Aerospace (fiber optic gyroscopes, LiDAR)

6. Leading Manufacturers and Products

ManufacturerRepresentative Products
Finisar (II-VI)FMT series optical transceivers
Avago TechnologiesHFBR series fiber optic modules
LumentumWaveReady optical components
Hamamatsu PhotonicsG12157 photodetector arrays

7. Selection Recommendations

Key considerations: - Match wavelength specifications with system requirements - Verify environmental ratings (temperature, humidity) - Assess mechanical durability (e.g., connector mating cycles) - Check compliance with standards (e.g., Telcordia GR-326-CORE) - Balance cost-performance ratio for volume deployments

8. Industry Trends

Emerging trends include: - Development of silicon photonics for compact integration - 400G/800G high-speed transmission components - AI-driven smart optoelectronic packaging - Wide adoption of VCSEL-based 3D sensing - Green manufacturing processes reducing material waste

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