Cameras

Part Number	Description / PDF	Quantity
26100-253 Aven	CAMERA 1280 X 1024 VGA	1
26100-244 Aven	CAMERA 2592 X 1944 USB	16
26100-253HD Aven	CAMERA 1920 X 1080 HDMI	2
26100-221 Aven	CAMERA 1616 X 1216 USB	0
26100-212 Aven	CAMERA 1440 X 1080 USB	1
26100-222 Aven	CAMERA 2080 X 1536 USB	0
26100-220 Aven	CAMERA 1392 X 1040 USB	0
26100-102 Aven	CAMERA 811 X 508 Y/C	0
26100-100 Aven	CAMERA 811 X 508 S-VIDEO	1
26100-216 Aven	CAMERA 2048 X 1536 USB	0
26100-215 Aven	CAMERA 1280 X 1024 USB	0
26100-230 Aven	CAMERA USB	1

Cameras

1. Overview

Optical inspection equipment cameras are specialized imaging devices designed for precision detection and analysis in industrial and scientific applications. By converting optical signals into digital data, these cameras enable automated quality control, defect detection, and process monitoring. Their importance in modern manufacturing and R&D environments stems from their ability to ensure product consistency, reduce human error, and accelerate production speeds.

2. Main Types and Functional Classification

Type	Functional Features	Application Examples
Industrial CCD Cameras	High sensitivity, low noise, precise color reproduction	PCB solder joint inspection
CMOS High-Speed Cameras	High frame rates (up to 100,000 fps), low power consumption	Automotive component impact testing
Hyperspectral Cameras	Multi-band spectral analysis (400-2500 nm)	Semiconductor material defect detection
Line Scan Cameras	Continuous imaging of moving objects, high resolution (up to 16k pixels)	Steel coil surface inspection
3D Depth Cameras	Structured light/time-of-flight measurement, point cloud generation	Robot guidance for logistics sorting

3. Structure and Components

Typical physical structure includes:

Lens assembly (C /TC mount, adjustable aperture)
Image sensor (CCD/CMOS with microlens array)
Image processing unit (FPGA/DSP for real-time algorithms)
Communication interface (GigE Vision/USB3.0/Camera Link)
Environmental protection housing (IP65/67 rating)

Technical composition involves: Optical filtering modules, temperature-controlled sensor chambers, and embedded machine vision libraries.

4. Key Technical Specifications

Parameter	Description	Importance
Resolution	Pixel count (e.g., 0.3-100 MP)	Determines detection accuracy
Frame Rate	Images per second (1-100,000 fps)	Affects production line speed
Sensor Size	Physical dimensions (1"-4")	Impacts field of view and light collection
Spectral Range	Wavelength sensitivity (UV/VIS/NIR/SWIR)	Material analysis capability
Interface Type	Data transmission standard	System compatibility
Dynamic Range	Signal-to-noise ratio (60-120 dB)	Defect contrast visibility

5. Application Fields

Electronics manufacturing: AOI systems for SMT solder paste inspection
Automotive industry: Engine component dimensional measurement
Semiconductor: Wafer micro-crack detection (sub- m resolution)
Pharmaceuticals: Tablet coating integrity analysis
Lithium battery production: Electrode sheet defect detection (0.01mm precision)

6. Leading Manufacturers and Products

Manufacturer	Representative Product	Key Specifications
Basler AG	ace acA2440-35uc	2448x2048 resolution, USB3.0, 35 fps
Keyence	VX Series XG-1000	Multi-spectral imaging, 0.1 m precision
Cognex	DSMax HD	High-dynamic-range CMOS, IP69K rating
Teledyne DALSA	Piranha4 8k Color	Line scan, 100kHz line rate
FLIR Systems	Blackfly S BFS-U3-51S5C	5120x3840 resolution, global shutter

7. Selection Recommendations

Key consideration factors:

Match sensor resolution to minimum defect size (e.g., 5 m defects require 5MP camera)
Calculate required frame rate using formula: Frame Rate (Production Speed FOV Width) / (Sensor Width 0.8)
Select spectral response based on material properties (e.g., SWIR for silicon wafer imaging)
Environmental adaptation (temperature/humidity/vibration resistance)
Total system cost (including lenses, lighting, and processing hardware)

Example: For lithium battery electrode inspection at 2m/s with 10 m defect detection, select a 5MP camera with 100fps frame rate and telecentric lens.

8. Industry Trend Analysis

Key development trends:

Resolution advancement: 200+MP sensors entering mass production
AI integration: On-camera neural processing units (NPUs) for edge computing
Spectral fusion: Multi/hyperspectral imaging becoming standard
Miniaturization: Wafer-level lens technologies reducing camera size
Standardization: Emergence of MIPI A-PHY for automotive vision systems

Market forecasts indicate a CAGR of 8.2% through 2030, driven by semiconductor and EV manufacturing demands.